LOW PROFILE HIGH
FREQUENCY RELAY
RP-RELAYS
10.6
.417
9
.748
4
.157
• High frequency relay with the low profile of 4 mm
.157 inch
• Excellent high frequency characteristics
Isolation: Min. 10dB (at 1.8 GHz)
Insertion loss: Max. 1.0dB (at 1.8 GHz)
V.S.W.R.: Max. 1.3 (at 1.8 GHz)
• High sensitivity in small size
Size: 10.6
×
9
×
4 mm
.417
×
.354
×
.157 inch
Nominal operating power: 140 mW
mm
inch
SPECIFICATIONS
Contact
Arrangement
Contact material
Movable
1 Form C
Silver alloy
Gold-clad silver
50 mΩ
0.1 A 30 V DC
Contact switching power: 1 W
(Max. 1.8 GHz); Contact carrying
power: 3 W (Max. 1.2 GHz)
1 W (Max. 1.8 GHz)
Min. 15 dB (at 1 GHz)
Min. 10 dB (at 1.8 GHz)
Max. 0.5 dB (at 1 GHz)
Max. 1 dB (at 1.8 GHz)
Max. 1.2 (at 1 GHz)
Max. 1.3 (at 1.8 GHz)
5×10
6
10
5
(0.1 A 30 V DC)
10
5
(1 W at 1.8 GHz;
V.S.W.R.: max. 1.3)
Characteristics
Max. operating speed (at rated load)
Initial insulation resistance*
1
20 cpm
Min. 1,000 MΩ at 500 V DC
750 Vrms for 1 min.
1,500 Vrms for 1 min.
Max. 3 ms
(Approx. 1.5 ms)
Max. 2 ms
(Approx. 1 ms)
Max. 50°Cwith nominal coil
voltage across coil and at
nominal switching capacity
Stationary
Initial contact resistance, max.
(By voltage drop 6 V DC 0.1 A)
Nominal switch-
ing capacity
Initial breakdown Between open contacts
voltage*
2
Between contacts and coil
Operate time*
3
(at nominal voltage)
Release time(without diode)*
3
(at nominal voltage)
Temperature rise
Functional*
4
Destructive*
5
Functional*
6
Destructive
Conditions for operation,
transport and storage
Ambient temp.
Rating
Isolation
High frequency
characteristics
(Impedance 50Ω)
Insertion loss
V.S.W.R.
Mechanical
(at 180 cpm)
Electrical
(at 20 cpm)
Shock resistance
Min. 500 m/s
2
{50 G}
Min. 1,000 m/s
2
{100 G}
10 to 55 Hz
at double amplitude of 3 mm
10 to 55 Hz
at double amplitude of 5 mm
–40°C to 70°C
–40°F to 158°F
5 to 85% R.H.
Approx. 1 g
.04 oz
Vibration
resistance
Expected life
(min. opera-
tions)
Coil (at 25°C,
68°F)
Voltage type
1.5 to 12 V DC
24 V DC
Nominal operating power
140 mW
270 mW
(Not freezing and condensing
Humidity
at low temperature)
Unit weight
Remarks
* Specifications will vary with foreign standards certification ratings.
*
1
Measurement at same location as “Initial breakdown voltage” section
*
2
Detection current: 10mA
*
3
Excluding contact bounce time
*
4
Half-wave pulse of sine wave: 11ms, detection time: 10µs
*
5
Half-wave pulse of sine wave: 6ms
*
6
Detection time: 10µs
TYPICAL APPLICATIONS
• Antenna switching of mobile phone
• Switching signal of measuring equipment
ORDERING INFORMATION
Ex. RP
1
H
3V
Contact arrangement
1:1 Form C
Terminal shape
Nil: Standard PC board terminal
H: Self-clinching terminal
Coil voltage (DC)
1.5, 3, 4.5, 5, 6, 9, 12, 24 V
Note: Standard packing; Carton: 50 pcs. Case 1,000 pcs.
93
RP
TYPES ANE COIL DATA
(at 20°C
68°F)
Part No.
Standard PC
board terminal
RP1-1.5V
RP1-3V
RP1-4.5V
RP1-5V
RP1-6V
RP1-9V
RP1-12V
RP1-24V
Self-clinching
terminal
RP1-H-1.5V
RP1-H-3V
RP1-H-4.5V
RP1-H-5V
RP1-H-6V
RP1-H-9V
RP1-H-12V
RP1-H-24V
Nominal
voltage,
V DC
1.5
3
4.5
5
6
9
12
24
Pick-up
voltage, max.
V DC
1.125
2.25
3.375
3.75
4.5
6.75
9
18
Drop-out
voltage, min.
V DC
0.15
0.3
0.45
0.5
0.6
0.9
1.2
2.4
Coil
resistance,
Ω
(±10%)
16
64.3
145
178
257
579
1,028
2,133
Nominal
operating
current,
mA (±10%)
93.8
46.7
31.1
28
23.3
15.6
11.7
11.3
Nominal
operating
power,
mW
140
140
140
140
140
140
140
270
Maximum.
allowable
voltage,
V DC
2.25
4.5
6.75
7.5
9
13.5
18
28.8
mm
inch
Standard PC board terminal
3.75
.148
4
.157
3.5
.138
10.6
.417
9
.354
DIMENSIONS
PC board pattern (Copper-side view)
5.08
.200
2.54
.100
7.62
.300
(0.25)
(.010)
2.54
.100
0.5
.020
2.54
.100
7.62
.300
0.25
.010
6-1 dia.
6-.039 dia.
Self-clinching terminal
3.75
.148
4
.157
3.5
.138
10.6
.417
9
.354
Tolerance:
±0.1
±.004
Schematic (Bottom view)
1 2 3
+
–
(0.25)
(.010)
2.54
.100
0.5
.020
2.54
.100
7.62
.300
0.25
.010
6 5 4
Direction indication
General tolerance:
±0.3
±.012
Deenergized condition
REFERENCE DATA
Sample: RP1-6V
Measuring method: Impedance 50
Ω
Measuring tool:
6–1.60 dia
.063 dia
6–1.00 dia
.039 dia
26–0.80 dia
.031 dia
6–2.30 dia
.090 dia
1.94
.076
4.22 9.82
.166 .387
mm
inch
PC board
• Double-sided through hole
• Material: Glass-epoxy resin
• t= 1.0mm
.039 inch
• Copper plated thickness: 35
µm
1. High frequency characteristics
• Isolation
100
90
80
Isolation, dB
70
60
50
40
30
20
0.60
.024
18.92
.745
18.00 7.62
.709 .300
5.08
.200
10
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency, GHz
Soldering
SMA connector
• Insertion loss
5
• Return loss
100
90
• V.S.W.R
3.0
2.8
2.6
2.4
V.S.W.R.
N.O. (Terminal Nos. 5-6)
2.2
2.0
1.8
1.6
1.4
N.C. (Terminal Nos. 4-5)
1.2
1.0
N.C.
N.O.
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency, GHz
Insertion loss, dB
Return loss, dB
N.O. (Terminal Nos. 5-6)
N.C. (Terminal Nos. 4-5)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency, GHz
4
80
70
60
50
40
30
20
10
3
2
1
0
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency, GHz
94
RP
2. Coil temperature rise
Sample: RP1-6V; No. of samples: n = 5
Carrying current: 0.1 A
Ambient temperature: 25°C
77°F
100
90
Temperature rise,
°C
80
70
60
50
40
30
20
10
0
0
80
100
120
150
Coil applied voltage, %V
70 80
100
4
2
Max.
Max.
Min.
Min.
120
150
Coil applied voltage, %V
4
2
0
Max.
Min.
Max.
Min.
70 80
Time, ms
10
8
6
3. Operate/release time
Sample: RP1-9V; No. of samples: n = 50
• With diode
12
Operate time
Release time
• Without diode
12
Operate time
Release time
10
8
6
Time, ms
100
120
150
Coil applied voltage, %V
4. Mechanical life
Sample: RP1-5V; No. of samples: n = 8
• Change of pick-up, drop-out voltage
12
Pick-up/drop-out voltage, V
5. Electrical life (0.1 A 30 V DC)
Sample: RP1-6V; No. of samples: n = 6
• Change of pick-up/drop-out voltage
12
Pick-up/drop-out voltage, V
Contact resistance, mΩ
10
8
6
Pick-up voltage
4
2
Drop-out voltage
0
10
20
No. of operations,
×10
4
30
0
10
20
4
No. of operations,
×10
30
Max.
Min.
Max.
Min.
• Change of contact resistance
120
100
80
60
40
20
10
8
6
4
2
Pick-up voltage
Max.
Min.
Max.
Min.
Max.
Min.
50
Drop-out voltage
100
500 1,000
4
No. of operations,
×10
6. Ambient temperature characteristics
Sample: RP1-6V; No. of samples: n = 5
7. Contact resistance distribution (initial)
Sample: RP1-6V; No. of samples: n = 25
Rate of change, %
50
40
20
Pick-up
voltage
20 40 60 80
Ambient
–20 temperature,
°C
–40
Drop-out
voltage
Quantity
40
30
–40 –20
0
20
10
0
22 24 26 28 30 32 34 36 38 40
Contact resistance, mΩ
8.-(1) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
Rate of change, %
8.-(2) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
Rate of change, %
8.-(3) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
Rate of change, %
5
Pick-up voltage
0
–5
OFF
5
Pick-up voltage
0
–5
OFF
OFF
5
Pick-up voltage
0
–5
OFF
OFF
OFF
OFF
Rate of change, %
5
Drop-out voltage
0
ON
Rate of change, %
Rate of change, %
5
Drop-out voltage
0
–5
0
ON
ON
5
Drop-out voltage
0
–5
ON
ON
–5
ON
ON
0
5
10
.197
.394
Inter-relay distance, (mm,
inch)
5
10
.197
.394
Inter-relay distance, (mm,
inch)
0
5
10
.197
.394
Inter-relay distance, (mm,
inch)
95
RP
9. High frequency switching test (1.2 GHz, 1 W)
Sample: RP1-6V; No. of samples: n = 6
Ambient temperature: 20°C
68°F
• Change of pick-up/drop-out voltage
• Change of contact resistance
120
Contact resistance, mΩ
100
80
60
40
Max.
Min.
20
Max.
Min.
0
5
10
15
0
5
10
No. of operations,
×10
4
15
12
RP relay
Trans-
mission
T1
T2
Dummy load (50Ω)
WD-2351
Transmission: RF Tranceiver
IC-1201 (ICOH)
Pick-up/drop-out voltage, V
10
8
6
Pick-up voltage
4
2
Drop-out voltage
Max.
Min.
T1
T2
0.2s
ON
OFF
0.2s
1.5s
1.5s
No. of operations,
×10
4
NOTES
1. Packing direction
Relays are packed in a tube with the ori-
entation stripe (PIN NO. 1) toward the
green stopper.
Orientation (indicates PIN No. 1) stripe
Stopper (green)
Chucking pressure* in the direction B:
9.8 N {1 kgf} or less
Chucking pressure* in the direction C:
9.8 N {1 kgf} or less
Please chuck the
portion.
Avoid chucking the center of the relay. In
addition, excessive chucking pressure to
the pinpoint of the relay should be avoid-
ed.
3. Soldering
Preheat according to the following condi-
tions.
Temperature
Time
100°C
212°F
or less
Within 1 minute
,
,
C
Soldering should be done at 250°C
482°F
within 5 s.
2. Automatic mounting
To maintain the internal function of the
relay, the chucking pressure should
not exceed the values below.
Chucking pressure* in the direction A:
4.9 N {500 gf} or less
A
(4)
(5)
(6)
mm
inch
B
• Direction A • Direction B • Direction C
6 5 4
3
.118
6
.236
3
2
1 2 3
1
*Value of chucking pressure is shown by the value of weight
pressed on the portion (4 mm .157
inch dia.).
For Cautions for Use, see Relay Technical Information (Page 48 to 76).
96
9/1/2000
All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
Go To Online Catalog
