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RSX180-235GT

IC Socket, PGA180, 180 Contact(s),

器件类别:连接器    插座   

厂商名称:Advanced Interconnections Corp

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
PGA SOCKET
联系完成配合
TIN LEAD OVER NICKEL
联系完成终止
Gold (Au) - with Nickel (Ni) barrier
触点材料
BERYLLIUM COPPER
设备插槽类型
IC SOCKET
使用的设备类型
PGA180
外壳材料
LIQUID CRYSTAL POLYMER
JESD-609代码
e4
触点数
180
Base Number Matches
1
文档预览
PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100” (2.54mm) Staggered (Interstitial) Grid
Description:
Peel-A-Way
®
(KSX)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
.005 Typ.
(.13)
Type -210
Shown
Description:
Molded (RSX)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Molded
Body
.100
(2.54)
Type -235
Shown
RSX replaces CSX.
Features:
• Low insertion force (1 oz. average
per pin)
• Screw-machined terminals with
multiple finger contacts for
reliability
• Closed bottom terminal for 100%
anti-wicking of solder
• Tapered entry for ease of insertion
• Custom designs available
Options
Tape Sealant - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RSX 503 - 234
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
®
KSX - Peel-A-Way
M
G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
RSX - New Hi-Temp Molded
Number of Pins
004 to 2209
*Footprints available online or
in separate booklet.
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
10
inch/(mm)
Low Insertion Force PGA Sockets
.100” (2.54mm) Staggered (Interstitial) Grid
Standard Quick-Turn Terminals
Type -210
Peel-A-Way
®
only
.058 Dia.
(1.47)
PGA Sockets
Type -82
Molded only
.059 Dia.
(1.50)
.165
(4.19)
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Type -234
Molded only
.059 Dia.
(1.50)
Type -176
Peel-A-Way
®
only
.058 Dia.
(1.47)
.015
(.38)
.155
(3.94)
.031
(.79)
.165
(4.19)
.155
(3.95)
.180
(4.57)
.125
(3.18)
.018 Dia.
(.46)
.034 Dia.
(.86)
.034 Dia.
(.86)
.018 Dia.
(.46)
Type -235
Molded only
4 standoffs per socket
Type -234 used in
remaining positions
.059 Dia.
(1.50)
Footprints:
.209
(5.31)
.136
(3.45)
.018 Dia.
(.46)
180 Pins
Footprint Number 180
1.200 Sq.
(30.48)
Solder Preform Terminals
Tin/Lead: Type -311
Lead-free: Type -813
Molded only
.059 Dia.
(1.50)
.165
(4.19)
Tin/Lead: Type -313
Lead-free: Type -814
Molded only
.056 Dia.
(1.42)
.165
(4.19)
Tin/Lead: Type -432
Lead-free: Type -815
Peel-A-Way
®
only
.058 Dia.
(1.47)
.100/(2.54) Typ.
Solder
Preform
.031
(.79)
23 x 23 rows
.155
(3.94)
Solder
Preform
.180
(4.57)
2 Solder
Preforms
.250
(6.35)
.038 Dia.
.018 Dia.
(.46)
.018 Dia.
(.46)
(.97)
• Full grid insulators loaded to your
specific footprint
• Open centers available upon
request (consult factory)
• Hundreds of footprints available
online
Intrusive Reflow Application
• Combines the labor of socket loading and solder
application into one operation.
• Eliminates the use of solder paste and screening
operation.
• Eliminates solder bridges and/or solder shorts
due to excess solder.
• Ensures a reliable solder joint with controlled
solder volume.
Solder Preform
• Use our online Build-A-Part
feature or download a Footprints
Booklet in PDF format
Available Online:
• Extraction Tools
• RoHS Qualification Test Report
• Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
PC Board
Preform After
Solder Flow
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
11
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
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