首页 > 器件类别 > 无源元件 > 电阻器

S2010CPC2232D10

Fixed Resistor, Metal Glaze/thick Film, 1W, 22300ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

器件类别:无源元件    电阻器   

厂商名称:State of the Art Inc

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1617669482
包装说明
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
Country Of Origin
USA
ECCN代码
EAR99
YTEOL
7.8
JESD-609代码
e4
制造商序列号
2010
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
150 °C
封装形状
RECTANGULAR PACKAGE
包装方法
BULK
额定功率耗散 (P)
1 W
额定温度
70 °C
电阻
22300 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
2010
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Silver (Ag)
端子形状
WRAPAROUND
容差
0.5%
工作电压
150 V
文档预览
2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
查看更多>
SiC,为何是大势所趋?
随着电动汽车、可再生能源和5G等领域的创新不断加速,SiC(碳化硅)半导体基于持续改进和比旧技术更...
btty038 RF/无线
UMTS协议图
目前所知最全的UMTS协议图!详细介绍了UMTS协议的细节要点。 而且这是世界顶级通讯公司3维制作...
mdreamj 模拟电子
TI 电源设计小贴士39
欢迎来到电源设计小贴士!随着现在对更高效、更低成本电源解决方案需求的...
trevor 模拟与混合信号
μC/OS—Ⅱ在TMS320LF2407上的移植及应用
μC/OS—Ⅱ在TMS320LF2407上的移植及应用 μC/OS—Ⅱ在TMS320LF...
fish001 微控制器 MCU
PC无法接受lwip发送的数据
可以ping得通。可是就PC机做服务器无法接受数据,有没有什么方法可以检测出错误?麻烦各位支个招!谢...
lvfeihi 微控制器 MCU
【DigiKey创意大赛】便携生命探测仪06+各模块整合联调
上一帖介绍了如何获取心电数据并解析协议,最终显示在电脑上,实现了心电采集功能。本帖介绍如何把...
sipower DigiKey得捷技术专区
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消