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S25FL016A0LMFC001

IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,SOP,16PIN,PLASTIC

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Reach Compliance Code
compliant
Is Samacsys
N
最大时钟频率 (fCLK)
50 MHz
数据保留时间-最小值
20
耐久性
100000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G16
内存密度
16777216 bit
内存集成电路类型
FLASH
内存宽度
8
端子数量
16
字数
2097152 words
字数代码
2000000
最高工作温度
70 °C
最低工作温度
组织
2MX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP16,.4
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
电源
3/3.3 V
认证状态
Not Qualified
串行总线类型
SPI
最大待机电流
0.00001 A
最大压摆率
0.024 mA
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
类型
NOR TYPE
写保护
HARDWARE/SOFTWARE
Base Number Matches
1
文档预览
S25FL Family (Serial Peripheral Interface)
S25FL016A
16 Megabit CMOS 3.0 Volt Flash Memory
with 50MHz SP1 Bus Interface
ADVANCE
INFORMATION
Notice to Readers:
The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion LLC
reserves the right to change or discontinue work on this proposed product
without notice.
Publication Number
S25FL016A_00
Revision
A
Amendment
3
Issue Date
March 3, 2005
This page intentionally left blank.
S25FL Family (Serial Peripheral Interface)
S25FL016A
16 Megabit CMOS 3.0 Volt Flash Memory
with 50MHz SP1 Bus Interface
Data Sheet
ADVANCE INFORMATION
Distinctive Characteristics
Architectural Advantages
Single power supply operation
— Full voltage range: 2.7 to 3.6 V read and program
operations
Memory Architecture
— Thirty-two sectors with 512 Kb each
Program
— Page Program (up to 256 bytes) in 1.5 ms (typical)
— Program cycles are on a page by page basis
Erase
— 1.5 s typical sector erase time
— 48 s typical bulk erase time
Cycling Endurance
— 100,000 cycles per sector typical
Data Retention
— 20 years typical
Device ID
— JEDEC standard two-byte electronic signature
— RES instruction one-byte electronic signature for
backward compatibility
Process Technology
— Manufactured on 0.20 µm MirrorBit
TM
process
technology
Package Option
— Industry Standard Pinouts
— 16-pin SO package (300 mils)
— 8-Contact WSON Package (6x8mm), No-Lead
Performance Characteristics
Speed
— 50 MHz clock rate (maximum)
Power Saving Standby Mode
— Standby Mode 50 µA (max)
— Deep Power Down Mode 1 µA (typical)
Memory Protection Features
Memory Protection
— W# pin works in conjunction with Status Register Bits
to protect specified memory areas
— Status Register Block Protection bits (BP2, BP1, BP0)
in status register configure parts of memory as read-
only
Software Features
SPI Bus Compatible Serial Interface
Publication Number
S25FL016A_00
Revision
A
Amendment
3
Issue Date
March 3, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, in-
cluding development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to high-
light their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a doc-
ument with this designation is likely to change, and in some cases, development on the product
may discontinue. Spansion LLC therefore places the following conditions upon Advance Informa-
tion content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the prod-
uct life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon Prelimi-
nary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
2
S25FL Family (Serial Peripheral Interface)
S25FL016A_00_A3 March 3, 2005
A d v a n c e
I n f o r m a t i o n
General Description
The S25FL016A device is a 3.0 Volt (2.7 V to 3.6 V) single power supply Flash memory
device. S25FL016A consists of thirty-two sectors, each with 512 Kb memory.
Data appears on SI input pin when inputting data into the memory and on the SO output
pin when outputting data from the memory. The devices are designed to be programmed
in-system with the standard system 3.0 Volt V
CC
supply.
The memory can be programmed 1 to 256 bytes at a time, using the Page Program in-
struction.
The memory supports Sector Erase and Bulk Erase instructions.
Each device requires only a 3.0 Volt power supply (2.7 V to 3.6 V) for both read and write
functions. Internally generated and regulated voltages are provided for the program op-
erations. This device does not require V
PP
supply.
March 3, 2005 S25FL016A_00_A3
S25FL Family (Serial Peripheral Interface)
3
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参数对比
与S25FL016A0LMFC001相近的元器件有:S25FL016A0LNFC001、S25FL016A0LMFC003、S25FL016A0LMAC001、S25FL016A0LMAC003、S25FL016A0LNAC001、S25FL016A0LNAC003。描述及对比如下:
型号 S25FL016A0LMFC001 S25FL016A0LNFC001 S25FL016A0LMFC003 S25FL016A0LMAC001 S25FL016A0LMAC003 S25FL016A0LNAC001 S25FL016A0LNAC003
描述 IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,SOP,16PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,LLCC,8PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,SOP,16PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,SOP,16PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,SOP,16PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,LLCC,8PIN,PLASTIC IC,SERIAL EEPROM,NOR FLASH,2MX8,CMOS,LLCC,8PIN,PLASTIC
是否Rohs认证 符合 符合 符合 不符合 不符合 不符合 不符合
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Is Samacsys N N N N N N N
最大时钟频率 (fCLK) 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
数据保留时间-最小值 20 20 20 20 20 20 20
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G16 R-PDSO-N8 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-N8 R-PDSO-N8
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8 8 8 8
端子数量 16 8 16 16 16 8 8
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SON SOP SOP SOP SON SON
封装等效代码 SOP16,.4 SOLCC8,.3 SOP16,.4 SOP16,.4 SOP16,.4 SOLCC8,.3 SOLCC8,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
电源 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
串行总线类型 SPI SPI SPI SPI SPI SPI SPI
最大待机电流 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
最大压摆率 0.024 mA 0.024 mA 0.024 mA 0.024 mA 0.024 mA 0.024 mA 0.024 mA
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING NO LEAD GULL WING GULL WING GULL WING NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1 1 1 1 1 1
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L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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