型号
- 型号
- 关键词
flash 64m, 3.0V, 108mhz serial nor flash
厂商名称：SPANSION
厂商官网：http://www.spansion.com/
器件标准：
| 型号 | S25FL164K0XMFI013 | S25FL164K0XMFI003 | S25FL164K0XBHI023 | S25FL164K0XBHI033 | S25FL164K0XNFI013 | S25FL164K0XBHI020 | S25FL164K0XBHI030 |
|---|---|---|---|---|---|---|---|
| 描述 | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash | flash 64m, 3.0V, 108mhz serial nor flash |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | SOP, SOP8,.3 | 0.300 INCH, GREEN, PLASTIC, MS-013EAA, SOIC-16 | TBGA, BGA24,5X5,40 | 8 X 6 MM, 1 MM PITCH, GREEN, BGA-24 | HVSON, SOLCC8,.25 | TBGA, BGA24,5X5,40 | 8 X 6 MM, 1 MM PITCH, GREEN, BGA-24 |
| Reach Compliance Code | compliant | compli | compli | compli | compli | compli | compli |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 其他特性 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 | ALSO CONFIGURABLE AS 64M X 1 |
| 备用内存宽度 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最大时钟频率 (fCLK) | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G16 | R-PBGA-B24 | R-PBGA-B24 | R-PDSO-N8 | R-PBGA-B24 | R-PBGA-B24 |
| JESD-609代码 | e3 | e3 | e1 | e1 | e3 | e1 | e1 |
| 长度 | 5.283 mm | 10.3 mm | 8 mm | 8 mm | 6 mm | 8 mm | 8 mm |
| 内存密度 | 67108864 bit | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 16 | 24 | 24 | 8 | 24 | 24 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16MX4 | 16MX4 | 16MX4 | 16MX4 | 16MX4 | 16MX4 | 16MX4 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | TBGA | TBGA | HVSON | TBGA | TBGA |
| 封装等效代码 | SOP8,.3 | SOP16,.4 | BGA24,5X5,40 | BGA24,4X6,40 | SOLCC8,.25 | BGA24,5X5,40 | BGA24,4X6,40 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.159 mm | 2.65 mm | 1.2 mm | 1.2 mm | 0.8 mm | 1.2 mm | 1.2 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | MATTE TIN | TIN SILVER COPPER | TIN SILVER COPPER | MATTE TIN | TIN SILVER COPPER | TIN SILVER COPPER |
| 端子形式 | GULL WING | GULL WING | BALL | BALL | NO LEAD | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1 mm | 1 mm | 1.27 mm | 1 mm | 1 mm |
| 端子位置 | DUAL | DUAL | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 5.283 mm | 7.5 mm | 6 mm | 6 mm | 5 mm | 6 mm | 6 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 厂商名称 | - | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |
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