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S25FL204K0TMFI043

Flash, 512KX8, PDSO8, SOIC-8

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
8004808805
包装说明
SOIC-8
Reach Compliance Code
compliant
ECCN代码
EAR99
最大时钟频率 (fCLK)
85 MHz
数据保留时间-最小值
20
耐久性
100000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G8
长度
4.9 mm
内存密度
4194304 bit
内存集成电路类型
FLASH
内存宽度
8
功能数量
1
端子数量
8
字数
524288 words
字数代码
512000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
512KX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
峰值回流温度(摄氏度)
260
电源
3/3.3 V
编程电压
3 V
认证状态
Not Qualified
座面最大高度
1.75 mm
串行总线类型
SPI
最大待机电流
0.000032 A
最大压摆率
0.025 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
类型
NOR TYPE
宽度
3.9 mm
写保护
HARDWARE/SOFTWARE
文档预览
“Spansion, Inc.” and “Cypress Semiconductor Corp.” have merged together to deliver high-performance, high-quality solutions at
the heart of today's most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive
consumer and mobile devices. The new company “Cypress Semiconductor Corp.” will continue to offer “Spansion, Inc.” products
to new and existing customers.
CONTINUITY OF SPECIFICATIONS
There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made
are the result of normal document improvements and are noted in the document history page, where supported. Future revisions
will occur when appropriate, and changes will be noted in a document history page.
CONTINUITY OF ORDERING PART NUMBERS
Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in
this document.
FOR MORE INFORMATION
Please visit our website at
www.cypress.com
or contact your
local sales office
for additional information about Cypress products
and services.
OUR CUSTOMERS
Cypress is for true innovators – in companies both large and small.
Our customers are smart, aggressive, out-of-the-box thinkers who design and develop game-changing products that revolutionize
their industries or create new industries with products and solutions that nobody ever thought of before.
ABOUT CYPRESS
Founded in 1982, Cypress is the leader in advanced embedded system solutions for the world’s most innovative automotive,
industrial, home automation and appliances, consumer electronics and medical products. Cypress’s programmable systems-on-
chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance
memories help engineers design differentiated products and get them to market first.
Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators
and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to
www.cypress.com.
Cypress Semiconductor Corporation
Document Number: 002-00722 Rev. *H
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised November 09, 2017
S25FL204K
4-Mbit 3.0 V SPI Flash Memory
Distinctive Features
Single power supply operation
– Full voltage range: 2.7 to 3.6V
4-Mbit Serial Flash
– 4-Mbit/512 kbyte/2048 pages
– 256 bytes per programmable page
– Uniform 4-kbyte Sectors/64-kbyte Blocks
Standard and Dual
– Standard SPI: SCK, CS#, SI, SO, WP#, HOLD#
– Dual SPI: SCK, CS#, SI/IO0, SO, WP#, HOLD#
– Fast Read Dual Output instruction
– Auto-increment Read capability
High Performance
– FAST READ (Serial): 85 MHz clock rate
– DUAL OUTPUT READ: 85 MHz clock rate
Low Power Consumption
– 12 mA typical active current
– 15 µA typical standby current
Flexible Architecture with 4 kB Sectors
– Sector Erase (4 kB)
– Block Erase (64 kB)
– Page Program up to 256 bytes
– 100k erase/program cycles typical
– 20-year data retention typical
Software and Hardware Write Protection
– Write Protect all or portion of memory via software
– Enable/Disable protection with WP# pin
High Performance Program/Erase Speed
– Page program time: 1.5 ms typical
– Sector erase time (4 kB): 50 ms typical
– Block erase time (64 kB): 500 ms typical
– Chip erase time: 3.5 seconds typical
Package Options
– 8-pin SOIC 150/208-mil
– All Pb-free packages are RoHS compliant
The S25FL204K (4-Mbit, 512-kbyte) Serial Flash memory, with advanced write protection mechanisms. TheS25FL204K supports
the standard Serial Peripheral Interface (SPI), and a high performance Dual output using SPI pins: Serial Clock, Chip Select, Serial
SI/IO0, SO, WP# and HOLD#. SPI clock frequencies of up to 85 MHz are supported along with a clock rate of
85 MHz for Dual Output Read.
The S25FL204K array is organized into 2048 programmable pages of 256 bytes each. Up to 256 bytes can be programmed at a
time. Pages can be erased in groups of 16 (4 kB Sector Erase), groups of 256 (64 kB Block Erase) or the entire chip (Chip Erase).
The S25FL204K has128 erasable sectors and 8 erasable blocks. The small 4 kB sectors allow for greater flexibility in applications
that require data and parameter storage.
A Hold pin, Write Protect Pin and programmable write protection provide further control flexibility. Additionally, the S25FL204K
device supports JEDEC standard manufacturer and device identification.
General Description
Cypress Semiconductor Corporation
Document Number: 002-00722 Rev. *H
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised November 09, 2017
S25FL204K
Table of Contents
Distinctive Features
............................................................. 2
General Description
............................................................. 2
1.
2.
3.
4.
4.1
5.
6.
6.1
6.2
6.3
6.4
7.
7.1
7.2
7.3
7.4
8.
8.1
8.2
Block Diagram..............................................................
4
Connection Diagrams..................................................
4
Signal Descriptions
..................................................... 5
Ordering Information
................................................... 6
Valid Combinations ........................................................ 6
Memory Organizations
................................................ 7
Functional Description
................................................
SPI Modes .....................................................................
Dual Output SPI .............................................................
Hold Function.................................................................
Status Register ..............................................................
8
8
8
8
9
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
9.
9.1
9.2
9.3
9.4
9.5
9.6
Read Status Register (05h) .......................................... 13
Write Status Register (01h)........................................... 14
Read Data (03h) ........................................................... 15
Fast Read (0Bh) ........................................................... 15
Fast Read Dual Output (3Bh) ....................................... 16
Page Program (PP) (02h) ............................................. 17
Sector Erase (SE) (20h)................................................ 18
Block Erase (BE) (D8h)................................................. 19
Chip Erase (CE) (C7h).................................................. 19
Deep Power-down (DP) (B9h) ...................................... 20
Release Deep Power-down / Device ID (ABh) ............. 21
Read Manufacturer / Device ID (90h) ........................... 22
Read Identification (RDID) (9Fh) .................................. 23
Electrical Specifications.............................................
25
Power-up Timing........................................................... 25
Absolute Maximum Ratings .......................................... 26
Recommended Operating Ranges ............................... 26
DC Characteristics ........................................................ 27
AC Measurement Conditions ........................................ 27
AC Characteristics ........................................................ 28
Write Protection
......................................................... 10
Page Programming ...................................................... 11
Sector Erase, Block Erase, and Chip Erase ................ 11
Polling During a Write, Program, or Erase Cycle......... 11
Active Power, Stand-by Power, and Deep
Power-Down Modes ..................................................... 11
Commands
................................................................. 11
Write Enable (06h) ....................................................... 12
Write Disable (04h) ...................................................... 13
10. Package Material.........................................................
31
10.1 8-Pin SOIC 150-mil Package (SOA 008) ...................... 31
10.2 8-Pin SOIC 208-mil Package (SOC 008)...................... 32
11.
Revision History..........................................................
33
Document Number: 002-00722 Rev. *H
Page 3 of 35
S25FL204K
1. Block Diagram
X -Decoder
Address
Buffers
and
Latches
Flash
M em ory
Y- Decoder
Control Logic
I/O Buffers
and Data
Latches
Serial Interface
CS #
SCK
SI/IO0
SO
W P#
HO LD #
2. Connection Diagrams
Figure 2.1
8-pin SOIC (150/208 mil)
CS#
SO
WP#
GND
1
2
3
4
8
7
6
5
VCC
HOLD#
SCK
SI/IO0
Document Number: 002-00722 Rev. *H
Page 4 of 35
S25FL204K
3. Signal Descriptions
Serial Data Input / Output (SI/IO0)
The SPI Serial Data Input/Output (SI/IO0) pin provides a means for instructions, addresses and data to be serially written to (shifted
into) the device. Data is latched on the rising edge of the Serial Clock (SCK) input pin. The SI/IO0 pin is also used as an output pin
when the Fast Read Dual Output instruction is executed.
Serial Data Output (SO)
The SPI Serial Data Output (SO) pin provides a means for data and status to be serially read from (shifted out of) the device. Data is
shifted out on the falling edge of the Serial Clock (SCK) input pin.
Serial Clock (SCK)
The SPI Serial Clock Input (SCK) pin provides the timing for serial input and output operations.
See
SPI Modes
on page 8.
Chip Select (CS#)
The SPI Chip Select (CS#) pin enables and disables device operation. When CS# is high the device is deselected and the Serial
Data Output pins are at high impedance.
When deselected, the device’s power consumption will be at standby levels unless an internal erase, program or status register
cycle is in progress. When CS# is brought low the device will be selected, power consumption will increase to active levels and
instructions can be written to and data read from the device. After power-up, CS# must transition from high to low before a new
instruction will be accepted.
HOLD (HOLD#)
The HOLD# pin allows the device to be paused while it is actively selected. When HOLD# is brought low, while CS# is low, the SO
pin will be at high impedance and signals on the SI and SCK pins will be ignored (don’t care). The HOLD# function can be useful
when multiple devices are sharing the same SPI signals.
Write Protect (WP#)
The Write Protect (WP#) pin can be used to prevent the Status Register from being written. Used in conjunction with the Status
Register’s Block Protect (BP0, BP1 and BP2, BP3) bits and Status Register Protect (SRP) bits, a portion or the entire memory array
can be hardware protected.
Table 3.1
Pin Descriptions
Symbol
SCK
SI/IO0
SO
CS#
WP#
HOLD#
VCC
GND
Note:
1. SI/IO0 output is used for Dual Output Read instruction.
Pin Name
Serial Clock Input
Serial Data Input / Output
(1)
Serial Data Output
Chip Enable
Write Protect
Hold Input
Supply Voltage (2.7-3.6V)
Ground
Document Number: 002-00722 Rev. *H
Page 5 of 35
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参数对比
与S25FL204K0TMFI043相近的元器件有:S25FL204K0TMFI011、S25FL204K0TMFI013。描述及对比如下:
型号 S25FL204K0TMFI043 S25FL204K0TMFI011 S25FL204K0TMFI013
描述 Flash, 512KX8, PDSO8, SOIC-8 Flash, 512KX8, PDSO8, SOIC-8 Flash, 512KX8, PDSO8, SOIC-8
是否Rohs认证 符合 符合 符合
Objectid 8004808805 8004808801 8004808802
包装说明 SOIC-8 SOIC-8 SOIC-8
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
最大时钟频率 (fCLK) 85 MHz 85 MHz 85 MHz
数据保留时间-最小值 20 20 20
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 S-PDSO-G8 S-PDSO-G8
长度 4.9 mm 5.283 mm 5.283 mm
内存密度 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 FLASH FLASH FLASH
内存宽度 8 8 8
功能数量 1 1 1
端子数量 8 8 8
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
组织 512KX8 512KX8 512KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP
封装等效代码 SOP8,.25 SOP8,.3 SOP8,.3
封装形状 RECTANGULAR SQUARE SQUARE
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) 260 NOT SPECIFIED NOT SPECIFIED
电源 3/3.3 V 3/3.3 V 3/3.3 V
编程电压 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 2.159 mm 2.159 mm
串行总线类型 SPI SPI SPI
最大待机电流 0.000032 A 0.000032 A 0.000032 A
最大压摆率 0.025 mA 0.025 mA 0.025 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED
类型 NOR TYPE NOR TYPE NOR TYPE
宽度 3.9 mm 5.283 mm 5.283 mm
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
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