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S29AL016M

16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

3.0 Volt-only Boot Sector Flash Memory

Featuring MirrorBit™ Technology

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new

and current designs, S29AL016D supersedes S29AL016M and is the factory-

recommended migration path for this device. Please refer to the S29AL016D

Datasheet for specifications and ordering information. Availability of this

document is retained for reference and historical purposes only.

Notice to Readers:

This document states the current technical specifications

regarding the Spansion product(s) described herein. Spansion Inc. deems the

products to have been in sufficient production volume such that subsequent

versions of this document are not expected to change. However, typographical

or specification corrections, or modifications to the valid combinations offered

may occur.

Publication Number

S29AL016M_00

Revision

Amendment

Issue Date

October 11, 2006

D a t a

S h e e t

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, includ-

ing development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to

highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more spe-

cific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion Inc. therefore places the following conditions upon Advance

Information content:

“This document contains information on one or more products under development at Spansion Inc. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the product

life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon

Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance In-

formation, Preliminary, or Full Production). This type of document will distinguish these products

and their designations wherever necessary, typically on the first page, the ordering information

page, and pages with DC Characteristics table and AC Erase and Program table (in the table

notes). The disclaimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or incor-

rect specification. Spansion Inc. applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion Inc. deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29AL016M

S29AL016M_00_A7 October 11, 2006

S29AL016M

Data Sheet

16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

3.0 Volt-only Boot Sector Flash Memory

Featuring MirrorBit

Technology

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs, S29AL016D supersedes S29AL016M and is the factory-recommended migration path for this

device. Please refer to the S29AL016D Datasheet for specifications and ordering information. Availability of this document is retained for reference and historical purposes only.

Distinctive Characteristics

Architectural Advantages

Single power supply operation

— 3 V for read, erase, and program operations

Manufactured on 0.23 µm MirrorBit

process

technology

Secured Silicon Sector region

— 128-word/256-byte sector for permanent, secure

identification through an 8-word/16-byte random

Electronic Serial Number, accessible through a

command sequence

— May be programmed and locked at the factory or by

the customer

Flexible sector architecture

— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-

one 64 Kbyte sectors (byte mode)

— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-

one 32 Kword sectors (word mode)

Compatibility with JEDEC standards

— Provides pinout and software compatibility for single-

power supply flash, and superior inadvertent write

protection

Top or bottom boot block configurations available

100,000 erase cycle typical per sector

20-year typical data retention

— 400 nA standby mode current

— 15 mA read current

— 40 mA program/erase current

— 400 nA Automatic Sleep mode current

Package options

— 48-ball Fine-pitch BGA

— 64-ball Fortified BGA

— 48-pin TSOP

Software Features

— Program Suspend & Resume: read other sectors

before programming operation is completed

— Erase Suspend & Resume: read/program other

sectors before an erase operation is completed

— Data# polling & toggle bits provide status

— Unlock Bypass Program command reduces overall

multiple-word programming time

— CFI (Common Flash Interface) compliant: allows host

system to identify and accommodate multiple flash

devices

Hardware Features

— Sector Protection: hardware-level method of

preventing write operations within a sector

— Temporary Sector Unprotect: V

-level method of

changing code in locked sectors

— Hardware reset input (RESET#) resets device

— Ready/Busy# output (RY/BY#) indicates program or

erase cycle completion

Performance Characteristics

High performance

— 90 ns access time

— 0.7 s typical sector erase time

Low power consumption (typical values at 5 MHz)

Publication Number

S29AL016M_00

Revision

Amendment

Issue Date

October 11, 2006

This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient

production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to

the valid combinations offered may occur.

D a t a

S h e e t

General Description

The S29AL016M is a 16 Mbit, 3.0 Volt-only Flash memory organized as 2,097,152

bytes or 1,048,576 words. The device is offered in a 48-ball Fine-pitch BGA, 64-

ball Fortified BGA, and 48-pin TSOP packages. The word-wide data (x16) appears

on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. The device re-

quires only a

single 3.0 volt power supply

for both read and write functions,

designed to be programmed in-system with the standard system 3.0 volt V

sup-

ply. The device can also be programmed in standard EPROM programmers.

The device offers access times of 90 and 100 ns. To eliminate bus contention the

device has separate chip enable (CE#), write enable (WE#) and output enable

(OE#) controls.

The device is entirely command set compatible with the

JEDEC single-power-

supply Flash standard.

Commands are written to the device using standard

microprocessor write timing. Write cycles also internally latch addresses and data

needed for the programming and erase operations.

The

sector erase architecture

allows memory sectors to be erased and repro-

grammed without affecting the data contents of other sectors. The device is fully

erased when shipped from the factory.

Device programming and erasure are initiated through command sequences.

Once a program or erase operation has begun, the host system need only poll

the DQ7 (Data# Polling) or DQ6 (toggle)

status bits

or monitor the

Ready/

Busy# (RY/BY#)

output to determine whether the operation is complete. To

facilitate programming, an

Unlock Bypass

mode reduces command sequence

overhead by requiring only two write cycles to program data instead of four.

Hardware data protection

measures include a low V

detector that automati-

cally inhibits write operations during power transitions. The hardware sector

protection feature disables both program and erase operations in any combina-

tion of sectors of memory. This can be achieved in-system or via programming

equipment.

The

Erase Suspend/Erase Resume

feature allows the host system to pause an

erase operation in a given sector to read or program any other sector and then

complete the erase operation. The

Program Suspend/Program Resume

fea-

ture enables the host system to pause a program operation in a given sector to

read any other sector and then complete the program operation.

The

hardware RESET# pin

terminates any operation in progress and resets the

device, after which it is then ready for a new operation. The RESET# pin may be

tied to the system reset circuitry. A system reset would thus also reset the de-

vice, enabling the host system to read boot-up firmware from the Flash memory

device.

The device reduces power consumption in the

standby mode

when it detects

specific voltage levels on CE# and RESET#, or when addresses have been stable

for a specified period of time.

The

Secured Silicon Sector

provides a 128-word/256-byte area for code or

data that can be permanently protected. Once this sector is protected, no further

changes within the sector can occur.

MirrorBit flash technology combines years of Flash memory manufacturing expe-

rience to produce the highest levels of quality, reliability and cost effectiveness.

The device electrically erases all bits within a sector simultaneously via hot-hole

assisted erase. The data is programmed using hot electron injection.

S29AL016M

S29AL016M_00_A7 October 11, 2006

D a t a

S h e e t

Table of Contents

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1

Architectural Advantages ..............................................................................

Performance Characteristics ........................................................................

Software Features ............................................................................................

Hardware Features .........................................................................................

Program Suspend/Program Resume Command Sequence .................... 30

Figure 6. Program Suspend/Program Resume........................ 31

Command Definitions Tables ......................................................................... 32

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11

Table 1. S29AL016M Device Bus Operations ......................... 11

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 34

Table 10. Command Definitions (x16 Mode, BYTE# = V

) ...... 32

Table 11. Command Definitions (x8 Mode, BYTE# = V

) ........ 33

DQ7: Data# Polling ............................................................................................ 34

Figure 7. Data# Polling Algorithm ........................................ 35

RY/BY#: Ready/Busy# ....................................................................................... 35

DQ6: Toggle Bit I ............................................................................................... 36

DQ2: Toggle Bit II .............................................................................................. 36

Reading Toggle Bits DQ6/DQ2 ..................................................................... 37

Figure 8. Toggle Bit Algorithm ............................................. 38

DQ5: Exceeded Timing Limits ........................................................................ 38

DQ3: Sector Erase Timer ................................................................................ 39

Table 12. Write Operation Status ......................................... 39

Word/Byte Configuration ................................................................................. 11

Requirements for Reading Array Data .......................................................... 11

Writing Commands/Command Sequences ................................................. 12

Program and Erase Operation Status ........................................................... 12

Standby Mode ....................................................................................................... 12

Automatic Sleep Mode .......................................................................................13

RESET#: Hardware Reset Pin ..........................................................................13

Output Disable Mode .........................................................................................13

Table 2. Sector Address Tables (Model 01, Top Boot Device) ... 14

Table 3. Sector Address Tables (Model 02, Bottom Boot Device) ..

Absolute Maximum Ratings . . . . . . . . . . . . . . . . .40

Figure 9. Maximum Negative Overshoot Waveform ................ 40

Figure 10. Maximum Positive Overshoot Waveform ................ 40

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 41

CMOS Compatible ..............................................................................................41

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Figure 11. Test Setup......................................................... 42

Table 13. Test Specifications ............................................... 42

Figure 12. Input Waveforms and Measurement Levels ............ 42

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 43

Read Operations ................................................................................................. 43

Figure 13. Read Operations Timings..................................... 43

Autoselect Mode ..................................................................................................15

Table 4. Autoselect Codes (High Voltage Method) .................. 16

Sector Protection/Unprotection .................................................................... 16

Temporary Sector Unprotect ..........................................................................17

Figure 1. Temporary Sector Unprotect Operation .................... 17

Figure 2. In-System Single High Voltage Sector Protect/

Unprotect Algorithms .......................................................... 18

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44

Hardware Reset (RESET#) ..............................................................................44

Figure 14. RESET# Timings................................................. 44

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45

Erase/Program Operations .............................................................................. 45

Secured Silicon Sector Flash Memory Region ............................................ 19

Table 5. Secured Silicon Sector Addressing ........................... 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 15. Program Operation Timings ................................. 46

Customer Lockable: Secured Silicon Sector NOT Programmed or

Protected At the Factory ............................................................................. 19

Figure 3. Secured Silicon Sector Protect Verify ....................... 20

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 16. Chip/Sector Erase Operation Timings .................... 47

Common Flash Memory Interface (CFI) ...................................................... 21

Table 6. CFI Query Identification String ................................ 21

Table 7. System Interface String ......................................... 22

Table 8. Device Geometry Definition .................................... 22

Table 9. Primary Vendor-Specific Extended Query ................. 23

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 17. Data# Polling Timings

(During Embedded Algorithms) ........................................... 48

Figure 18. Toggle Bit Timings

(During Embedded Algorithms) ........................................... 48

Hardware Data Protection ..............................................................................23

Low V

Write Inhibit ..................................................................................23

Write Pulse “Glitch” Protection ................................................................23

Logical Inhibit .................................................................................................. 24

Power-Up Write Inhibit ............................................................................... 24

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 49

Figure 19. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations .................................................. 49

Temporary Sector Unprotect ........................................................................49

Figure 20. Temporary Sector Unprotect/Timing Diagram......... 49

Command Definitions . . . . . . . . . . . . . . . . . . . . . .24

Reading Array Data ........................................................................................... 24

Reset Command ................................................................................................. 24

Autoselect Command Sequence ....................................................................25

Word/Byte Program Command Sequence .................................................25

Unlock Bypass Command Sequence ........................................................ 26

Figure 4. Program Operation................................................ 27

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 50

Figure 21. Sector Protect/Unprotect Timing Diagram .............. 50

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 51

Alternate CE# Controlled Erase/Program Operations ........................... 51

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 52

Figure 22. Alternate CE# Controlled Write Operation Timings .. 52

Chip Erase Command Sequence ....................................................................27

Sector Erase Command Sequence ................................................................ 28

Erase Suspend/Erase Resume Commands .................................................. 28

Figure 5. Erase Operation.................................................... 30

Erase and Programming Performance . . . . . . . . . 53

TSOP Pin and BGA Package Capacitance . . . . . 53

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . .54

TS 048—48-Pin Standard TSOP .................................................................... 54

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 55

October 11, 2006 S29AL016M_00_A7

S29AL016M