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S29AL016M90FAI022

16 Megabit (2 M x 8-Bit/1 M x 16-Bit) 3.0 Volt-only Boot Sector Flash Memory Featuring MirrorBit⑩ Technology

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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S29AL016M
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
3.0 Volt-only Boot Sector Flash Memory
Featuring MirrorBit™ Technology
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new
and current designs, S29AL016D supersedes S29AL016M and is the factory-
recommended migration path for this device. Please refer to the S29AL016D
Datasheet for specifications and ordering information. Availability of this
document is retained for reference and historical purposes only.
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Spansion Inc. deems the
products to have been in sufficient production volume such that subsequent
versions of this document are not expected to change. However, typographical
or specification corrections, or modifications to the valid combinations offered
may occur.
Publication Number
S29AL016M_00
Revision
A
Amendment
7
Issue Date
October 11, 2006
D a t a
S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, includ-
ing development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion Inc. therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion Inc. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product
life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion Inc. applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion Inc. deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S29AL016M
S29AL016M_00_A7 October 11, 2006
S29AL016M
Data Sheet
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
3.0 Volt-only Boot Sector Flash Memory
Featuring MirrorBit
TM
Technology
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs, S29AL016D supersedes S29AL016M and is the factory-recommended migration path for this
device. Please refer to the S29AL016D Datasheet for specifications and ordering information. Availability of this document is retained for reference and historical purposes only.
Distinctive Characteristics
Architectural Advantages
Single power supply operation
— 3 V for read, erase, and program operations
Manufactured on 0.23 µm MirrorBit
TM
process
technology
Secured Silicon Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-
one 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-
one 32 Kword sectors (word mode)
Compatibility with JEDEC standards
— Provides pinout and software compatibility for single-
power supply flash, and superior inadvertent write
protection
Top or bottom boot block configurations available
100,000 erase cycle typical per sector
20-year typical data retention
— 400 nA standby mode current
— 15 mA read current
— 40 mA program/erase current
— 400 nA Automatic Sleep mode current
Package options
— 48-ball Fine-pitch BGA
— 64-ball Fortified BGA
— 48-pin TSOP
Software Features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
Hardware Features
— Sector Protection: hardware-level method of
preventing write operations within a sector
— Temporary Sector Unprotect: V
ID
-level method of
changing code in locked sectors
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) indicates program or
erase cycle completion
Performance Characteristics
High performance
— 90 ns access time
— 0.7 s typical sector erase time
Low power consumption (typical values at 5 MHz)
Publication Number
S29AL016M_00
Revision
A
Amendment
7
Issue Date
October 11, 2006
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to
the valid combinations offered may occur.
D a t a
S h e e t
General Description
The S29AL016M is a 16 Mbit, 3.0 Volt-only Flash memory organized as 2,097,152
bytes or 1,048,576 words. The device is offered in a 48-ball Fine-pitch BGA, 64-
ball Fortified BGA, and 48-pin TSOP packages. The word-wide data (x16) appears
on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. The device re-
quires only a
single 3.0 volt power supply
for both read and write functions,
designed to be programmed in-system with the standard system 3.0 volt V
CC
sup-
ply. The device can also be programmed in standard EPROM programmers.
The device offers access times of 90 and 100 ns. To eliminate bus contention the
device has separate chip enable (CE#), write enable (WE#) and output enable
(OE#) controls.
The device is entirely command set compatible with the
JEDEC single-power-
supply Flash standard.
Commands are written to the device using standard
microprocessor write timing. Write cycles also internally latch addresses and data
needed for the programming and erase operations.
The
sector erase architecture
allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through command sequences.
Once a program or erase operation has begun, the host system need only poll
the DQ7 (Data# Polling) or DQ6 (toggle)
status bits
or monitor the
Ready/
Busy# (RY/BY#)
output to determine whether the operation is complete. To
facilitate programming, an
Unlock Bypass
mode reduces command sequence
overhead by requiring only two write cycles to program data instead of four.
Hardware data protection
measures include a low V
CC
detector that automati-
cally inhibits write operations during power transitions. The hardware sector
protection feature disables both program and erase operations in any combina-
tion of sectors of memory. This can be achieved in-system or via programming
equipment.
The
Erase Suspend/Erase Resume
feature allows the host system to pause an
erase operation in a given sector to read or program any other sector and then
complete the erase operation. The
Program Suspend/Program Resume
fea-
ture enables the host system to pause a program operation in a given sector to
read any other sector and then complete the program operation.
The
hardware RESET# pin
terminates any operation in progress and resets the
device, after which it is then ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would thus also reset the de-
vice, enabling the host system to read boot-up firmware from the Flash memory
device.
The device reduces power consumption in the
standby mode
when it detects
specific voltage levels on CE# and RESET#, or when addresses have been stable
for a specified period of time.
The
Secured Silicon Sector
provides a 128-word/256-byte area for code or
data that can be permanently protected. Once this sector is protected, no further
changes within the sector can occur.
MirrorBit flash technology combines years of Flash memory manufacturing expe-
rience to produce the highest levels of quality, reliability and cost effectiveness.
The device electrically erases all bits within a sector simultaneously via hot-hole
assisted erase. The data is programmed using hot electron injection.
2
S29AL016M
S29AL016M_00_A7 October 11, 2006
D a t a
S h e e t
Table of Contents
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1
Architectural Advantages ..............................................................................
Performance Characteristics ........................................................................
Software Features ............................................................................................
Hardware Features .........................................................................................
1
1
1
1
Program Suspend/Program Resume Command Sequence .................... 30
Figure 6. Program Suspend/Program Resume........................ 31
Command Definitions Tables ......................................................................... 32
General Description . . . . . . . . . . . . . . . . . . . . . . . . 2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11
Table 1. S29AL016M Device Bus Operations ......................... 11
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 34
Table 10. Command Definitions (x16 Mode, BYTE# = V
IH
) ...... 32
Table 11. Command Definitions (x8 Mode, BYTE# = V
IL
) ........ 33
DQ7: Data# Polling ............................................................................................ 34
Figure 7. Data# Polling Algorithm ........................................ 35
RY/BY#: Ready/Busy# ....................................................................................... 35
DQ6: Toggle Bit I ............................................................................................... 36
DQ2: Toggle Bit II .............................................................................................. 36
Reading Toggle Bits DQ6/DQ2 ..................................................................... 37
Figure 8. Toggle Bit Algorithm ............................................. 38
DQ5: Exceeded Timing Limits ........................................................................ 38
DQ3: Sector Erase Timer ................................................................................ 39
Table 12. Write Operation Status ......................................... 39
Word/Byte Configuration ................................................................................. 11
Requirements for Reading Array Data .......................................................... 11
Writing Commands/Command Sequences ................................................. 12
Program and Erase Operation Status ........................................................... 12
Standby Mode ....................................................................................................... 12
Automatic Sleep Mode .......................................................................................13
RESET#: Hardware Reset Pin ..........................................................................13
Output Disable Mode .........................................................................................13
Table 2. Sector Address Tables (Model 01, Top Boot Device) ... 14
Table 3. Sector Address Tables (Model 02, Bottom Boot Device) ..
15
Absolute Maximum Ratings . . . . . . . . . . . . . . . . .40
Figure 9. Maximum Negative Overshoot Waveform ................ 40
Figure 10. Maximum Positive Overshoot Waveform ................ 40
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 41
CMOS Compatible ..............................................................................................41
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Figure 11. Test Setup......................................................... 42
Table 13. Test Specifications ............................................... 42
Figure 12. Input Waveforms and Measurement Levels ............ 42
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 43
Read Operations ................................................................................................. 43
Figure 13. Read Operations Timings..................................... 43
Autoselect Mode ..................................................................................................15
Table 4. Autoselect Codes (High Voltage Method) .................. 16
Sector Protection/Unprotection .................................................................... 16
Temporary Sector Unprotect ..........................................................................17
Figure 1. Temporary Sector Unprotect Operation .................... 17
Figure 2. In-System Single High Voltage Sector Protect/
Unprotect Algorithms .......................................................... 18
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44
Hardware Reset (RESET#) ..............................................................................44
Figure 14. RESET# Timings................................................. 44
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45
Erase/Program Operations .............................................................................. 45
Secured Silicon Sector Flash Memory Region ............................................ 19
Table 5. Secured Silicon Sector Addressing ........................... 19
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 15. Program Operation Timings ................................. 46
Customer Lockable: Secured Silicon Sector NOT Programmed or
Protected At the Factory ............................................................................. 19
Figure 3. Secured Silicon Sector Protect Verify ....................... 20
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 16. Chip/Sector Erase Operation Timings .................... 47
Common Flash Memory Interface (CFI) ...................................................... 21
Table 6. CFI Query Identification String ................................ 21
Table 7. System Interface String ......................................... 22
Table 8. Device Geometry Definition .................................... 22
Table 9. Primary Vendor-Specific Extended Query ................. 23
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 17. Data# Polling Timings
(During Embedded Algorithms) ........................................... 48
Figure 18. Toggle Bit Timings
(During Embedded Algorithms) ........................................... 48
Hardware Data Protection ..............................................................................23
Low V
CC
Write Inhibit ..................................................................................23
Write Pulse “Glitch” Protection ................................................................23
Logical Inhibit .................................................................................................. 24
Power-Up Write Inhibit ............................................................................... 24
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 19. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations .................................................. 49
Temporary Sector Unprotect ........................................................................49
Figure 20. Temporary Sector Unprotect/Timing Diagram......... 49
Command Definitions . . . . . . . . . . . . . . . . . . . . . .24
Reading Array Data ........................................................................................... 24
Reset Command ................................................................................................. 24
Autoselect Command Sequence ....................................................................25
Word/Byte Program Command Sequence .................................................25
Unlock Bypass Command Sequence ........................................................ 26
Figure 4. Program Operation................................................ 27
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 21. Sector Protect/Unprotect Timing Diagram .............. 50
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 51
Alternate CE# Controlled Erase/Program Operations ........................... 51
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 22. Alternate CE# Controlled Write Operation Timings .. 52
Chip Erase Command Sequence ....................................................................27
Sector Erase Command Sequence ................................................................ 28
Erase Suspend/Erase Resume Commands .................................................. 28
Figure 5. Erase Operation.................................................... 30
Erase and Programming Performance . . . . . . . . . 53
TSOP Pin and BGA Package Capacitance . . . . . 53
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . .54
TS 048—48-Pin Standard TSOP .................................................................... 54
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 55
3
October 11, 2006 S29AL016M_00_A7
S29AL016M
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