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S29AL032D90BAN002

Flash, 4MX8, 90ns, PBGA48, 10 X 6 MM, FBGA-48

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
BGA
包装说明
10 X 6 MM, FBGA-48
针数
48
Reach Compliance Code
not_compliant
ECCN代码
3A991.B.1.A
最长访问时间
90 ns
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
R-PBGA-B48
JESD-609代码
e0
长度
10 mm
内存密度
33554432 bit
内存集成电路类型
FLASH
内存宽度
8
湿度敏感等级
3
功能数量
1
部门数/规模
64
端子数量
48
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-40 °C
组织
4MX8
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装等效代码
BGA48,6X8,32
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
电源
3/3.3 V
编程电压
3 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1 mm
部门规模
64K
最大待机电流
0.000005 A
最大压摆率
0.035 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
切换位
YES
类型
NOR TYPE
宽度
6 mm
Base Number Matches
1
文档预览
S29AL032D
32 Megabit CMOS 3.0 Volt-only Flash Memory
4 M x 8-Bit Uniform Sector
4 M x 8-Bit/2 M x 16-Bit Boot Sector
S29AL032D Cover Sheet
Data Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number
S29AL032D_00
Revision
A
Amendment
8
Issue Date
November 2, 2006
D at a
S hee t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S29AL032D
S29AL032D_00_A8 November 2, 2006
S29AL032D
32 Megabit CMOS 3.0 Volt-only Flash Memory
4 M x 8-Bit Uniform Sector
4 M x 8-Bit/2 M x 16-Bit Boot Sector
Data Sheet
Distinctive Characteristics
Architectural Advantages
Single power supply operation
– Full voltage range: 2.7 to 3.6 volt read and write operations for
battery-powered applications
Performance Characteristics
High performance
– Access times as fast as 70 ns
Ultra low power consumption (typical values at 5 MHz)
200 nA Automatic Sleep mode current
200 nA standby mode current
9 mA read current
20 mA program/erase current
Manufactured on 200-nm process technology
– Fully compatible with 0.23 µm Am29LV320D, 0.32 µm Am29LV033C,
and 0.33 µm MBM29LV320E devices
Flexible sector architecture
– Boot sector models: Eight 8-Kbyte sectors; sixty-three 64-Kbyte
sectors; top or bottom boot block configurations available
– Uniform sector models: Sixty-four 64-Kbyte sectors
Cycling endurance: 1,000,000 cycles per sector typical
Data retention: 20 years typical
Sector Protection features
– A hardware method of locking a sector to prevent any program or
erase operations within that sector
– Sectors can be locked in-system or via programming equipment
– Temporary Sector Unprotect feature allows code changes in
previously locked sectors
Software Features
CFI (Common Flash Interface) compliant
– Provides device-specific information to the system, allowing host
software to easily reconfigure for different Flash devices
Erase Suspend/Erase Resume
– Suspends an erase operation to read data from, or program data to,
a sector that is not being erased, then resumes the erase operation
Unlock Bypass Program Command
– Reduces overall programming time when issuing multiple program
command sequences
Data# Polling and toggle bits
– Provides a software method of detecting program or erase operation
completion
– Unlock Bypass Program Command
Reduces overall programming time when issuing multiple program
command sequences
Secured Silicon Sector
– 128-word sector for permanent, secure identification through an 8-
word random Electronic Serial Number
– May be programmed and locked at the factory or by the customer
– Accessible through a command sequence
Compatibility with JEDEC standards
– Pinout and software compatible with single-power supply Flash
– Superior inadvertent write protection
Hardware Features
Ready/Busy# pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle
completion
Package Options
48-ball FBGA
48-pin TSOP
40-pin TSOP
Hardware reset pin (RESET#)
– Hardware method to reset the device to reading array data
WP#/ACC input pin
– Write protect (WP#) function allows protection of two outermost
boot sectors (boot sector models only), regardless of sector protect
status
– Acceleration (ACC) function provides accelerated program times
Publication Number
S29AL032D_00
Revision
A
Amendment
8
Issue Date
November 2, 2006
D at a
S hee t
General Description
The S29AL032D is a 32-megabit, 3.0 volt-only flash memory device, organized as 2,097,152 words of 16 bits
each or 4,194,304 bytes of 8 bits each. Word mode data appears on DQ0-DQ15; byte mode data appears on
DQ0-DQ7. The device is designed to be programmed in-system with the standard 3.0 volt VCC supply, and
can also be programmed in standard EPROM programmers.
The device is available with access times as fast as 70 ns. The devices are offered in 40-pin TSOP, 48-pin
TSOP and 48-ball FBGA packages. Standard control pins- chip enable (CE#), write enable (WE#), and output
enable (OE#)-control normal read and write operations, and avoid bus contention issues.
The device requires only a
single 3.0 volt power supply
for both read and write functions. Internally
generated and regulated voltages are provided for the pro-gram and erase operations.
S29AL032D Features
The
Secured Silicon Sector
is an extra sector capable of being permanently locked by Spansion or
customers. The
Secured Silicon Indicator Bit
(DQ7) is permanently set to a 1 if the part is
factory locked,
and set to a 0 if customer lockable. This way, customer lockable parts can never be used to replace a factory
locked part.
Note that the S29AL032D has a Secured Silicon Sector size of 128 words (256 bytes).
Factory locked parts provide several options. The Secured Silicon Sector may store a secure, random 16
byte ESN (Electronic Serial Number), customer code (programmed through the Spansion programming
service), or both.
The S29AL032D is entirely command set compatible with the
JEDEC single-power-supply Flash standard.
Commands are written to the command register using standard microprocessor write timings. Register
contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Reading
data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the
Embedded
Program
algorithm—an internal algorithm that automatically times the program pulse widths and verifies
proper cell margin. The
Unlock Bypass
mode facilitates faster programming times by requiring only two write
cycles to program data instead of four.
Device erasure occurs by executing the erase command sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin,
or by reading the DQ7 (Data# Polling) and DQ6 (toggle)
status bits.
After a program or erase cycle has been
completed, the device is ready to read array data or accept another command.
The
sector erase architecture
allows memory sectors to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection
measures include a low V
CC
detector that automatically inhibits write operations
during power transitions. The
hardware sector protection
feature disables both program and erase
operations in any combination of the sectors of memory. This can be achieved in-system or via programming
equipment.
The
Erase Suspend/Erase Resume
feature enables the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is not selected for erasure. True background erase can
thus be achieved.
The
hardware RESET# pin
terminates any operation in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When addresses are stable for a specified amount of time, the
device enters the
automatic sleep mode.
The system can also place the device into the
standby mode.
Power consumption is greatly reduced in both these modes.
The Spansion Flash technology combines years of Flash memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot-electron
injection.
2
S29AL032D
S29AL032D_00_A8 November 2, 2006
Data
She et
Table of Contents
Distinctive Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
S29AL032D Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
List of Tables
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.
2.
3.
Product Selector Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
FBGA Package for Model 00 Only. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
FBGA Package for Models 03, 04 Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
Special Handling Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7
8
9
9
4.
5.
6.
Pin Configuration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Symbols
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Ordering Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1
S29AL032D Standard Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2
Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Device Bus Operations
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1
Word/Byte Configuration (Models 03, 04 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2
Requirements for Reading Array Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3
Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4
Program and Erase Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5
Accelerated Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7
Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8
RESET#: Hardware Reset Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9
Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.10 Sector Addresss Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.11 Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.12 Sector Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.13 Write Protect (WP#) — Models 03, 04 Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.14 Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
12
12
13
13
13
13
14
14
14
15
21
21
26
26
7.
8.
Secured Silicon Sector Flash Memory Region
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.1
Factory Locked: Secured Silicon Sector Programmed and Protected at the Factory . . . . . . 27
8.2
Customer Lockable: Secured Silicon Sector NOT Programmed
or Protected at the Factory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Hardware Data Protection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.1
Low V
CC
Write Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2
Write Pulse “Glitch” Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3
Logical Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.4
Power-Up Write Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
28
28
28
28
9.
10.
11.
Common Flash Memory Interface (CFI)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Command Definitions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.1 Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.2 Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.3 Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.4 Enter Secured Silicon Sector/Exit Secured Silicon Sector Command Sequence . . . . . . . . .
11.5 Word/Byte Program Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.6 Unlock Bypass Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.7 Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.8 Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
32
32
32
32
33
33
33
34
35
November 2, 2006 S29AL032D_00_A8
S29AL032D
3
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