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S29GL032A11FAIR32

64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
13 X 11 MM, FBGA-64
针数
64
Reach Compliance Code
_compli
ECCN代码
3A991.B.1.A
最长访问时间
110 ns
其他特性
ALSO CONFIGURABLE 4M X 8
备用内存宽度
8
启动块
TOP
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
R-PBGA-B64
JESD-609代码
e0
长度
13 mm
内存密度
33554432 bi
内存集成电路类型
FLASH
内存宽度
16
湿度敏感等级
3
功能数量
1
部门数/规模
8,63
端子数量
64
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
2MX16
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA64,8X8,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
页面大小
4/8 words
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
电源
3.3 V
编程电压
3 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1.4 mm
部门规模
8K,64K
最大待机电流
0.000005 A
最大压摆率
0.06 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
切换位
YES
类型
NOR TYPE
宽度
11 mm
文档预览
ADVANCE
INFORMATION
S29GLxxxA MirrorBit™ Flash Family
S29GL064A, S29GL032A
64 Megabit, 32 Megabit 3.0, Volt-only Page Mode Flash
Memory Featuring 200 nm MirrorBit Process Technology
Data Sheet
Notice to Readers:
The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion LLC
reserves the right to change or discontinue work on this proposed product
without notice.
Publication Number
S29GLxxxA_00
Revision
A
Amendment
2
Issue Date
January 28, 2005
This page intentionally left blank.
S29GLxxxA MirrorBit™ Flash Family
S29GL064A, S29GL032A
64 Megabit, 32 Megabit 3.0, Volt-only Page Mode Flash
Memory Featuring 200 nm MirrorBit Process Technology
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
Architectural Advantages
Single power supply operation
— 3 volt read, erase, and program operations
Manufactured on 200 nm MirrorBit process
technology
Secured Silicon Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
Flexible sector architecture
— 64Mb (uniform sector models): 128 32 Kword (64 KB)
sectors
— 64Mb (boot sector models): 127 32 Kword (64 KB)
sectors + 8 4Kword (8KB) boot sectors
— 32Mb (uniform sector models): 64 32Kword (64KB)
sectors
— 32Mb (boot sector models): 63 32Kword (64KB)
sectors + 8 4Kword (8KB) boot sectors
Compatibility with JEDEC standards
— Provides pinout and software compatibility for single-
power supply flash, and superior inadvertent write
protection
100,000 erase cycles typical per sector
20-year data retention typical
Package options
— 48-pin TSOP
— 56-pin TSOP
— 64-ball Fortified BGA
— 48-ball fine-pitch BGA
Software & Hardware Features
Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
— Unlock Bypass Program command reduces overall
multiple-word programming time
Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Unprotect: V
ID
-level method of
charging code in locked sectors
— WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings on uniform
sector models
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
Performance Characteristics
High performance
— 90 ns access time
— 4-word/8-byte page read buffer
— 25 ns page read times
— 16-word/32-byte write buffer which reduces overall
programming time for multiple-word updates
Low power consumption (typical values at 3.0 V, 5
MHz)
— 18 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
Publication Number
S29GLxxxA_00
Revision
A
Amendment
2
Issue Date
January 28, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, in-
cluding development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to high-
light their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a doc-
ument with this designation is likely to change, and in some cases, development on the product
may discontinue. Spansion LLC therefore places the following conditions upon Advance Informa-
tion content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the prod-
uct life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon Prelimi-
nary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
2
S29GLxxxA MirrorBit™ Flash Family
S29GLxxxA_00_A2 January 28, 2005
A d v a n c e
I n f o r m a t i o n
General Description
The S29GLxxxA family of devices are 3.0 V single power Flash memory manufac-
tured using 200 nm MirrorBit technology. The S29GL064A is a 64 Mb, organized
as 4,194,304 words or 8,388,608 bytes. The S29GL032A is a 32 Mb, organized
as 2,097,152 words or 4,194,304 bytes. Depending on the model number, the
devices have an 8-bit wide data bus only, 16-bit wide data bus only, or a 16-bit
wide data bus that can also function as an 8-bit wide data bus by using the BYTE#
input. The devices can be programmed either in the host system or in standard
EPROM programmers.
Access times as fast as 90 ns are available. Note that each access time has a spe-
cific operating voltage range (V
CC
) as specified in the
Product Selector Guide
and
the
Ordering Information
sections. Package offerings include 48-pin TSOP, 56-pin
TSOP, 48-ball fine-pitch BGA and 64-ball Fortified BGA, depending on model num-
ber. Each device has separate chip enable (CE#), write enable (WE#) and output
enable (OE#) controls.
Each device requires only a
single 3.0 volt power supply
for both read and
write functions. In addition to a V
CC
input, a high-voltage
accelerated program
(ACC)
feature provides shorter programming times through increased current on
the WP#/ACC input. This feature is intended to facilitate factory throughput dur-
ing system production, but may also be used in the field if desired.
The device is entirely command set compatible with the
JEDEC single-power-
supply Flash standard.
Commands are written to the device using standard mi-
croprocessor write timing. Write cycles also internally latch addresses and data
needed for the programming and erase operations.
The
sector erase architecture
allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through command sequences.
Once a program or erase operation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle)
status bits
or monitor the
Ready/Busy#
(RY/BY#)
output to determine whether the operation is complete. To facilitate
programming, an
Unlock Bypass
mode reduces command sequence overhead
by requiring only two write cycles to program data instead of four.
Hardware data protection
measures include a low V
CC
detector that automat-
ically inhibits write operations during power transitions. The hardware sector
protection feature disables both program and erase operations in any combina-
tion of sectors of memory. This can be achieved in-system or via programming
equipment.
The
Erase Suspend/Erase Resume
feature allows the host system to pause an
erase operation in a given sector to read or program any other sector and then
complete the erase operation. The
Program Suspend/Program Resume
fea-
ture enables the host system to pause a program operation in a given sector to
read any other sector and then complete the program operation.
The
hardware RESET# pin
terminates any operation in progress and resets the
device, after which it is then ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would thus also reset the device,
enabling the host system to read boot-up firmware from the Flash memory
device.
January 28, 2005 S29GLxxxA_00_A2
S29GLxxxA MirrorBit™ Flash Family
3
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