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S29GL032M
MirrorBit Flash Memory
TM
32 Megabit (2 M x 16-Bit / 4 M x 8-Bit)
Spansion
™
Overview
Flash memory subsidiary of AMD and Fujitsu, is the
world’s leading manufacturer of NOR Flash Memory. Spansion is
committed to delivering outstanding customer service and expert
technical support, as well as providing the highest level of quality
and reliability in its products. All Spansion production fabs are
certified to the demanding ISO/TS16949:2002 global technical
specification, ISO9001:2000 quality standards, and the ISO14001
environmental standard.
Spansion
™
, the
FEATURES AND BENEFITS
• Based on Proven, High-Volume
Production MirrorBit
™
Technology
• Lower Cost Alternative
• Drop-in Replacement for
Standard Floating Gate Products
• High Quality and Reliability
General Description
Spansion S29GL032M devices, manufactured using 230-
nanometer, high-volume production MirrorBit
™
(two-bit-
per-cell) technology, are drop-in replacements to standard
floating gate products and offer a compelling solution for
lowering your bill of materials. Several packages are available,
offering the widest variety for all applications.
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL
Target Applications
• Set-top Boxes
• DVD / DVD-RW
• Printers
• MP3 Players
• Modems
• Mobile Devices
• Established 230nm
MirrorBit technology
• Single 3.3V power supply
• Boot and uniform sector
architecture options
• 16-word/32-byte write buffer
• 4-word/8-byte page read buffer
• Industrial operating temperature
range -40 ºC to +85 ºC
• JEDEC pinout and software
standards compliant
SOFTWARE AND HARDWARE
PERFORMANCE CHARACTERISTICS
ACCESS SPEED
Max. Access Time (ns)
Max. CE
#
Access Time (ns)
Max. Page Access Time (ns)
Max. OE
#
Access Time (ns)
90
90
25
25
100
100
30
30
110
110
30
30
• Program and Erase
Suspend and Resume
• CFI (Common Flash Interface)
compliant
• ACC pin accelerates factory
programming
SECURITY
CURRENT CONSUMPTION
Active Read (@ 10 MHz) (mA)
Intra-Page Read (@ 10MHz) (mA)
Program (mA)
Erase (mA)
Standby Mode (µA)
Note: Typical values shown.
35
5
50
50
1
• Sector Protection/Unprotection
• WP# protects top/bottom boot
sectors or highest/lowest address
sectors
• 128-word/256-byte one-time
programmable Secured Silicon
Sector
QUALITY AND RELIABILITY
• Cycling endurance: 100,000 cycles
per sector typical
• Data retention: 20 years typical
PACKAGING
PROGRAM & ERASE PERFORMANCE
Effective Word Program Time, (16-word buffer) (µs)
Effective Word Program Time, Accel (16-word buffer) (µs)
Typical Sector Erase (sec)
Note: Typical values shown.
15
12.5
0.5
• 48-pin TSOP Package
• 56-pin TSOP Package
• 48-ball Fine-pitch BGA Package
• 64-ball Fortified BGA Package
• Standard and Pb-Free packages
available
For more information about Spansion Flash memory solutions, please visit www.spansion.com.
Ordering Information
S29GL032M
10
T
A
I
R1
0
PACKING TYPE
0
2
3
= Tray
= 7˝ Tape and Reel
= 13˝ Tape and Reel
MODEL NUMBER
x8,Vcc = 3.0 - 3.6 V device:
R0 = Uniform sector device
x8/x16,Vcc = 3.0 - 3.6V devices:
R1 = Uniform sectors; highest address
sector protect
R2 = Uniform sectors; lowest address
sector protect
R3 = Boot sectors; top 2 address sector
protect
R4 = Boot sectors; bottom 2 address
sector protect
TEMPERATURE RANGE
I
= Industrial (-40
o
C to +85
o
C)
= Standard
= Pb-Free
PACKAGING MATERIAL SET
A
F
T
B
F
PACKAGE TYPE
= TSOP Package
= Fine-pitch BGA Package
= Fortified BGA Package
= 90 ns
= 100 ns
= 110 ns
SPEED OPTIONS
90
10
11
DEVICE NUMBER/DESCRIPTION
32 Mb (2 M x 16-Bit/4 M x 8-Bit), Page-
Mode Flash Memory manufactured using
0.23 µm MirrorBit
TM
process technology,
3.0 Volt-only Read, Program, and Erase
AVAILABLE ORDERING PART NUMBERS FOR S29GL032M FLASH MEMORY
Device
Number
Speed
Option
Package & Material
Temperature
TAI, TFI
BAI, BFI
TAI, TFI
FAI, FFI
TAI, TFI
BAI, BFI
FAI, FFI
Model
Number
R0
R1, R2
R3, R4
Packing
Type
Package
Description
TS040 (TSOP)
2
FBC048 (Fine-Pitch BGA)
3
TS056 (TSOP)
2
LAA064 (Fortified BGA)
3
TS048 (TSOP)
2
FBC048 (Fine-Pitch BGA)
3
LAA064 (Fortified BGA)
3
S29GL032M
90, 10, 11
0, 2, 3
1
PRODUCT SELECTION GUIDE
4
Part Number for New Designs
S29GL032M
Legacy Part Numbers
Am29LV033MU
Am29LV320MH/L
Am29LV320MT/B
MBM29PL32T/BM
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can
be packed in Types 0 and 3; BGAs in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator
from ordering part numbers
3. BGA package marking omits leading “S29” and packing
type designator from ordering number. For example, the
package marking for Part Number S29GL032M10FA1010
is GL032M10FAI01.
SPANSION
915 Deguigne Drive, PO Box 3453 Sunnyvale, CA 94088-3453, USA Tel 408-962-2500 1-866-SPANSION
SPANSION JAPAN
4-33-4 Nishi Shinjuku Shinjuku, Tokyo, 160-0023, Japan Tel. +81-3-5302-2200 Fax +81-3-5302-2674
© 2005 Spansion LLC. All rights reserved. Spansion, the Spansion logo, MirrorBit, and combinations thereof are trademarks of Spansion LLC. AMD is a trademark of Advanced
Micro Devices, Inc. Fujitsu is a registered trademark of Fujitsu Limited. Other names used are for informational purposes only and may be trademarks of their respective owners.
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