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S29PL064J65BFW122

Flash, 4MX16, 65ns, PBGA48, 8.15 X 6.15 MM, LEAD FREE, FBGA-48

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
8.15 X 6.15 MM, LEAD FREE, FBGA-48
针数
48
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
最长访问时间
65 ns
启动块
BOTTOM/TOP
JESD-30 代码
R-PBGA-B48
JESD-609代码
e1
长度
8.15 mm
内存密度
67108864 bit
内存集成电路类型
FLASH
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
48
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
编程电压
3 V
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
类型
NOR TYPE
宽度
6.15 mm
文档预览
S29PL-J
128/128/64/32 Megabit (8/8/4/2 M x 16-Bit)
CMOS 3.0-Volt only, Simultaneous Read/Write
Flash Memory with Enhanced VersatileIO
TM
Control
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See the section
Notice On Data Sheet Designations
for definitions.
Publication Number
S29PL-J_00
Revision
A
Amendment
8
Issue Date
July 29, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, in-
cluding development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion LLC therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the prod-
uct life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance
Information, Preliminary, or Full Production). This type of document will distinguish these prod-
ucts and their designations wherever necessary, typically on the first page, the ordering
information page, and pages with DC Characteristics table and AC Erase and Program table (in
the table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or in-
correct specification. Spansion LLC applies the following conditions to documents in this
category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S29PL-J
S29PL-J_00_A8 July 29, 2005
S29PL-J
128/128/64/32 Megabit (8/8/4/2 M x 16-Bit)
CMOS 3.0 Volt-only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO™ Control
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
Architectural Advantages
128/128/64/32 Mbit Page Mode devices
Page size of 8 words: Fast page read access from random
locations within the page
Full Voltage range: 2.7 to 3.6 volt read, erase, and program
operations for battery-powered applications
Two CE# inputs control selection of each half of the memory
space
Data can be continuously read from one bank while executing
erase/program functions in another bank
Zero latency switching from write to read operations
4 separate banks, with up to two simultaneous operations per
device
Bank A:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
Bank B:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
Bank C:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
Bank D:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
4 separate banks, with up to two simultaneous operations per
device
CE#1 controlled banks:
Bank 1A: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Bank 1B: PL129J - 48Mbit (32Kw x 96)
CE#2 controlled banks:
Bank 2A: PL129J - 48 Mbit (32Kw x 96)
Bank 2B: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Output voltage generated and input voltages tolerated on all
control inputs and I/Os is determined by the voltage on the
V
IO
pin
V
IO
options at 1.8 V and 3 V I/O for PL127J and PL129J
devices
3V V
IO
for PL064J and PL032J devices
Up to 128 words accessible through a command sequence
Up to 64 factory-locked words
Up to 64 customer-lockable words
Performance Characteristics
High Performance
Page access times as fast as 20 ns
Random access times as fast as 55 ns
45 mA active read current
17 mA program/erase current
0.2 µA typical standby mode current
Single power supply operation
Power consumption (typical values at 10 MHz)
Dual Chip Enable inputs (only in PL129J)
Software Features
Software command-set compatible with JEDEC 42.4
standard
Backward compatible with Am29F, Am29LV, Am29DL, and
AM29PDL families and MBM29QM/RM, MBM29LV, MBM29DL,
MBM29PDL families
Provides device-specific information to the system, allowing
host software to easily reconfigure for different Flash devices
Suspends an erase operation to allow read or program
operations in other sectors of same bank
Suspends a program operation to allow read operation from
sectors other than the one being programmed
Reduces overall programming time when issuing multiple
program command sequences
Simultaneous Read/Write Operation
FlexBank Architecture (PL127J/PL064J/PL032J)
CFI (Common Flash Interface) compliant
Erase Suspend / Erase Resume
Program Suspend / Program Resume
Unlock Bypass Program command
Hardware Features
Ready/Busy# pin (RY/BY#)
Provides a hardware method of detecting program or erase
cycle completion
Hardware method to reset the device to reading array data
At V
IL
, hardware level protection for the first and last two 4K
word sectors.
At V
IH
, allows removal of sector protection
At V
HH
, provides accelerated programming in a factory setting
A command sector protection method to lock combinations of
individual sectors and sector groups to prevent program or
erase operations within that sector
Sectors can be locked and unlocked in-system at V
CC
level
A sophisticated sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector using
a user-defined 64-bit password
Standard discrete pinouts
11 x 8 mm, 80-ball Fine-pitch BGA (PL127J) (VBG080)
8.15 x 6.15 mm, 48-ball Fine pitch BGA (PL064J/PL032J)
(VBK048)
MCP-compatible pinout
8 x 11.6 mm, 64-ball Fine-pitch BGA (PL127J)
7 x 9 mm, 56-ball Fine-pitch BGA (PL064J and PL032J)
Compatible with MCP pinout, allowing easy integration of RAM
into existing designs
20 x 14 mm, 56-pin TSOP (PL127J) (TS056)
FlexBank Architecture (PL129J)
Hardware reset pin (RESET#)
WP#/ ACC (Write Protect/Acceleration) input
Persistent Sector Protection
Enhanced VersatileI/O (V
IO
) Control
Password Sector Protection
Secured Silicon Sector region
Package options
Both top and bottom boot blocks in one device
Manufactured on 110 nm process technology
Data Retention: 20 years typical
Cycling Endurance: 1 million cycles per sector typical
Publication Number
S29PL-J_00
Revision
A
Amendment
8
Issue Date
July 29, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
General Description
The PL127J/PL129J/PL064J/PL032J is a 128/128/64/32 Mbit, 3.0 volt-only Page Mode and Si-
multaneous Read/Write Flash memory device organized as 8/8/4/2 Mwords. The devices are
offered in the following packages:
11 mm x 8 mm, 80-ball Fine-pitch BGA standalone (PL127J)
8 mm x 11.6 mm, 64-ball Fine-pitch BGA multi-chip compatible (PL127J)
8.15 mm x 6.15 mm, 48-ball Fine-pitch BGA standalone (PL064J/PL032J)
7 mm x 9 mm, 56-ball Fine-pitch BGA multi-chip compatible (PL064J and PL032J)
20 mm x 14 mm, 56-pin TSOP (PL127J)
The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or
in standard EPROM programmers. A 12.0 V V
PP
is not required for write or erase operations.
The device offers fast page access times of 20 to 30 ns, with corresponding random access times
of 55 to 70 ns, respectively, allowing high speed microprocessors to operate without wait states.
To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and
output enable (OE#) controls. Note: Device PL129J has 2 chip enable inputs (CE1#, CE2#).
Simultaneous Read/Write Operation with Zero Latency
The Simultaneous Read/Write architecture provides
simultaneous operation
by dividing the
memory space into 4 banks, which can be considered to be four separate memory arrays as far
as certain operations are concerned. The device can improve overall system performance by al-
lowing a host system to program or erase in one bank, then immediately and simultaneously
read from another bank with zero latency (with two simultaneous operations operating at any
one time). This releases the system from waiting for the completion of a program or erase op-
eration, greatly improving system performance.
The device can be organized in both top and bottom sector configurations. The banks are orga-
nized as follows:
Bank
A
B
C
D
Bank
1A
1B
2A
2B
PL127J Sectors
16 Mbit (4 Kw x 8 and 32 Kw x 31)
48 Mbit (32 Kw x 96)
48 Mbit (32 Kw x 96)
16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J Sectors
8 Mbit (4 Kw x 8 and 32 Kw x 15)
24 Mbit (32 Kw x 48)
24 Mbit (32 Kw x 48)
8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J Sectors
4 Mbit (4 Kw x 8 and 32 Kw x 7)
12 Mbit (32 Kw x 24)
12 Mbit (32 Kw x 24)
4 Mbit (4 Kw x 8 and 32 Kw x 7)
CE# Control
CE1#
CE1#
CE2#
CE2#
PL129J Sectors
16 Mbit (4 Kw x 8 and 32 Kw x 31)
48 Mbit (32 Kw x 96)
48 Mbit (32 Kw x 96)
16 Mbit (4 Kw x 8 and 32 Kw x 31)
Page Mode Features
The page size is 8 words. After initial page access is accomplished, the page mode operation pro-
vides fast read access speed of random locations within that page.
Standard Flash Memory Features
The device requires a
single 3.0 volt power supply
(2.7 V to 3.6 V) for both read and write
functions. Internally generated and regulated voltages are provided for the program and erase
operations.
The device is entirely command set compatible with the
JEDEC 42.4 single-power-supply
Flash standard.
Commands are written to the command register using standard microproces-
sor write timing. Register contents serve as inputs to an internal state-machine that controls the
2
S29PL-J
S29PL-J_00_A8 July 29, 2005
A d v a n c e
I n f o r m a t i o n
erase and programming circuitry. Write cycles also internally latch addresses and data needed
for the programming and erase operations. Reading data out of the device is similar to reading
from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. The Unlock Bypass
mode facilitates faster programming times by requiring only two write cycles to program data
instead of four. Device erasure occurs by executing the erase command sequence.
The host system can detect whether a program or erase operation is complete by reading the
DQ7 (Data# Polling) and DQ6 (toggle)
status bits.
After a program or erase cycle has been
completed, the device is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without
affecting the data contents of other sectors. The device is fully erased when shipped from the
factory.
Hardware data protection
measures include a low V
CC
detector that automatically inhibits
write operations during power transitions. The hardware sector protection feature disables both
program and erase operations in any combination of sectors of memory. This can be achieved
in-system or via programming equipment.
The Erase Suspend/Erase Resume
feature enables the user to put erase on hold for any pe-
riod of time to read data from, or program data to, any sector that is not selected for erasure.
True background erase can thus be achieved. If a read is needed from the Secured Silicon Sector
area (One Time Program area) after an erase suspend, then the user must use the proper com-
mand sequence to enter and exit this region.
The
Program Suspend/Program Resume
feature enables the user to hold the program op-
eration to read data from any sector that is not selected for programming. If a read is needed
from the Secured Silicon Sector area, Persistent Protection area, Dynamic Protection area, or the
CFI area, after a program suspend, then the user must use the proper command sequence to
enter and exit this region.
The device offers two power-saving features. When addresses have been stable for a specified
amount of time, the device enters the
automatic sleep mode.
The system can also place the
device into the standby mode. Power consumption is greatly reduced in both these modes.
The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunnel-
ing. The data is programmed using hot electron injection.
July 29, 2005 S29PL-J_00_A8
S29PL-J
3
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