型号 | S631001-12J | S631000-10P | S631000-12P | S631001-15J | S631001-15P |
---|---|---|---|---|---|
描述 | MASK ROM, 128KX8, 120ns, CMOS, PQCC32 | MASK ROM, 128KX8, 100ns, CMOS, PDIP28 | MASK ROM, 128KX8, 120ns, CMOS, PDIP28 | MASK ROM, 128KX8, 150ns, CMOS, PQCC32 | MASK ROM, 128KX8, 150ns, CMOS, PDIP32 |
厂商名称 | Gould Ami | Gould Ami | Gould Ami | Gould Ami | Gould Ami |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 100 ns | 120 ns | 150 ns | 150 ns |
JESD-30 代码 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T32 |
内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 28 | 28 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL |