S71AL016M Based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and
RAM
16 Megabit (1 M x 16-bit) CMOS 3.0 Volt-only
Flash Memory and 4 Megabit (256K x 16-bit) Static RAM/
Pseudo Static RAM
ADVANCE
INFORMATION
Notice to Readers:
The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion LLC
reserves the right to change or discontinue work on this proposed product
without notice.
Publication Number
S71AL016M_00
Revision
A
Amendment
0
Issue Date
February 23, 2005
This page intentionally left blank.
S71AL016M based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and
RAM
16 Megabit (1 M x 16-bit) CMOS 3.0 Volt-only Flash
Memory and 4 Megabit (256K x 16-bit) Static RAM/
Pseudo Static RAM
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 2.7 to 3.1 volt
High performance
— 90 ns
Packages
— 7 x 9 x 1.2 mm 56 ball FBGA
Operating Temperature
— –25°C to +85°C (Wireless)
General Description
The S71AL series is a product line of stacked Multi-Chip Product (MCP) packages
and consists of:
One S29AL Flash memory die
pSRAM or SRAM
The products covered by this document are listed in the table below:
Flash Memory Density
16Mb
SRAM / pSRAM Density
4Mb
S71AL016M40
Publication Number
S71AL016M_00_A0
Revision
A
Amendment
0
Issue Date
February 23, 2005
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designa-
tions to advise readers of product information or intended specifications throughout
the product life cycle, including development, qualification, initial production, and full
production. In all cases, however, readers are encouraged to verify that they have the
latest information before finalizing their design. The following descriptions of Spansion
data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one
or more specific products, but has not committed any design to production. Informa-
tion presented in a document with this designation is likely to change, and in some
cases, development on the product may discontinue. Spansion LLC therefore places
the following conditions upon Advance Information content:
“This document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product. Do
not design in this product without contacting the factory. Spansion LLC reserves
the right to change or discontinue work on this proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed
such that a commitment to production has taken place. This designation covers sev-
eral aspects of the product life cycle, including product qualification, initial production,
and the subsequent phases in the manufacturing process that occur before full pro-
duction is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under con-
sideration. Spansion places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion
product(s) described herein. The Preliminary status of this document indicates that
product qualification has been completed, and that initial production has begun.
Due to the phases of the manufacturing process that require maintaining efficiency
and quality, this document may be revised by subsequent versions or modifications
due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations
(Advance Information, Preliminary, or Full Production). This type of document will dis-
tinguish these products and their designations wherever necessary, typically on the
first page, the ordering information page, and pages with DC Characteristics table and
AC Erase and Program table (in the table notes). The disclaimer on the first page re-
fers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or
only nominal changes are expected, the Preliminary designation is removed from the
data sheet. Nominal changes may include those affecting the number of ordering part
numbers available, such as the addition or deletion of a speed option, temperature
range, package type, or V
IO
range. Changes may also include those needed to clarify
a description or to correct a typographical error or incorrect specification. Spansion
LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion LLC deems the products to have been in suf-
ficient production volume such that subsequent versions of this document are not
expected to change. However, typographical or specification corrections, or modi-
fications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD
or Fujitsu sales office.
4
S71AL016M based MCPs
S71AL016M_00_A0 February 23, 2005
A d v a n c e
I n f o r m a t i o n
Table of Contents
S71AL016M based MCPs ............................. 3
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .6
16 Mb Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . .7
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . .8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10
Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . 11
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 12
RY/BY#: Ready/Busy# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Reading Toggle Bits DQ6/DQ2 . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 8. Toggle Bit Algorithm............................................ 42
DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . . . . . . . . . . .42
DQ3: Sector Erase Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Table 11. Write Operation Status . . . . . . . . . . . . . . . . . . . . 43
Figure 9. Maximum Negative Overshoot Waveform ............... 44
Figure 10. Maximum Positive Overshoot Waveform ............... 44
S29AL016M .................................................13
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 12. CMOS Compatible . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 11. Test Setup ....................................................... 46
Table 13. Test Specifications . . . . . . . . . . . . . . . . . . . . . . . 46
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 13
General Description . . . . . . . . . . . . . . . . . . . . . . . . 14
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 1. S29AL016M Device Bus Operations . . . . . . . . . . . . .17
Key to Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . .46
Figure 12. Input Waveforms and Measurement Levels ...........
Table 14. Read Operations . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13. Read Operations Timings....................................
Table 15. Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . .
Figure 14. RESET# Timings ...............................................
Figure 15. Program Operation Timings ................................
Figure 16. Chip/Sector Erase Operation Timings ...................
Figure 17. Data# Polling Timings
(During Embedded Algorithms) ..........................................
Figure 18. Toggle Bit Timings
(During Embedded Algorithms) ..........................................
Figure 19. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations.................................................
Table 16. Temporary Sector Unprotect . . . . . . . . . . . . . . . .
Figure 20. Temporary Sector Unprotect/Timing Diagram........
Figure 21. Sector Protect/Unprotect Timing Diagram.............
Table 17. Alternate CD# Controlled Erase/Program
Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 22. Alternate CE# Controlled Write Operation T
imings ............................................................................
Table 18. Erase and Programming Performance . . . . . . . . . .
Table 19. TSOP Pin and BGA Package Capcitance . . . . . . . . .
46
47
47
48
48
50
51
52
52
53
53
53
54
55
56
57
57
Requirements for Reading Array Data . . . . . . . . . . . . . . . . . . .17
Writing Commands/Command Sequences . . . . . . . . . . . . . . . 18
Program and Erase Operation Status . . . . . . . . . . . . . . . . . . . 18
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Automatic Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
RESET#: Hardware Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 2. Sector Address Tables (Model 01, Top Boot
Device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Table 3. Sector Address Tables (Model 02, Bottom Boot
Device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 4. Autoselect Codes (High Voltage Method) . . . . . . . . .22
Sector Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . 22
Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 1. Temporary Sector Unprotect Operation................... 23
Figure 2. In-System Single High Voltage Sector Protect/
Unprotect Algorithms ........................................................ 24
SecSi (Secured Silicon) Sector Flash Memory Region . . . . . . . 25
Table 5. SecSi Sector Addressing . . . . . . . . . . . . . . . . . . . . .25
Figure 3. SecSi Sector Protect Verify ................................... 26
Type 4 pSRAM .......................................... 59
Common Flash Memory Interface (CFI) . . . . . . . . . . . . . . . . . 26
Table 6. CFI Query Identification String . . . . . . . . . . . . . . . .27
Table 7. System Interface String . . . . . . . . . . . . . . . . . . . . .27
Table 8. Device Geometry Definition . . . . . . . . . . . . . . . . . .28
Table 9. Primary Vendor-Specific Extended Query . . . . . . . . .28
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Functional Description. . . . . . . . . . . . . . . . . . . . . . 59
Product Portfolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . 60
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 20. DC Electrical Characteristics (Over the
Operating Range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . 30
Word Program Command Sequence . . . . . . . . . . . . . . . . . . . .31
Figure 4. Program Operation .............................................. 32
Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . .61
AC Test Loads and Waveforms . . . . . . . . . . . . . . .61
Figure 23. AC Test Loads and Waveforms ............................ 61
Table 21. Switching Characteristics . . . . . . . . . . . . . . . . . . . 62
Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . 32
Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . 33
Erase Suspend/Erase Resume Commands . . . . . . . . . . . . . . . . 33
Figure 5. Erase Operation .................................................. 35
Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . 63
Figure 24. Read Cycle 1 (Address Transition Controlled) ........
Figure 25. Read Cycle 2 (OE# Controlled)............................
Figure 26. Write Cycle 1 (WE# Controlled)...........................
Figure 27. Write Cycle 2 (CE#1 or CE2 Controlled) ...............
Figure 28. Write Cycle 3 (WE# Controlled, OE# Low) ............
Figure 29. Write Cycle 4 (BHE#/BLE# Controlled, OE# Low) ..
63
63
64
65
66
66
Program Suspend/Program Resume Command Sequence . . . 35
Figure 6. Program Suspend/Program Resume ....................... 36
Table 10. Command Definitions . . . . . . . . . . . . . . . . . . . . . .37
DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 7. Data# Polling Algorithm ....................................... 39
Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 68
February 23, 2005 S71AL016M_00_A0_A0
S71AL016M based MCPs
5
