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S71GL032A Based MCPs

Stacked Multi-Chip Product (MCP) Flash Memory and

RAM

32 Megabit (2 M x 16-bit) CMOS 3.0 Volt-only

Page Mode Flash Memory and

16/8/4 Megabit (1M/512K/256K x 16-bit)

Pseudo Static RAM

Data Sheet

ADVANCE

INFORMATION

Notice to Readers:

The Advance Information status indicates that this

document contains information on one or more products under development

at Spansion LLC. The information is intended to help you evaluate this product.

Do not design in this product without contacting the factory. Spansion LLC

reserves the right to change or discontinue work on this proposed product

without notice.

Publication Number

S71GL032A_00

Revision

Amendment

Issue Date

March 31, 2005

Notice On Data Sheet Designations

Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, including

development, qualification, initial production, and full production. In all cases, however, readers are

encouraged to verify that they have the latest information before finalizing their design. The follow-

ing descriptions of Spansion data sheet designations are presented here to highlight their presence

and definitions.

Advance Information

The Advance Information designation indicates that Spansion LLC is developing one or more specific

products, but has not committed any design to production. Information presented in a document

with this designation is likely to change, and in some cases, development on the product may discon-

tinue. Spansion LLC therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion LLC. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a com-

mitment to production has taken place. This designation covers several aspects of the product life cy-

cle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical specifi-

cations presented in a Preliminary document should be expected while keeping these aspects of pro-

duction under consideration. Spansion places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance Infor-

mation, Preliminary, or Full Production). This type of document will distinguish these products and

their designations wherever necessary, typically on the first page, the ordering information page, and

pages with DC Characteristics table and AC Erase and Program table (in the table notes). The dis-

claimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes

may include those affecting the number of ordering part numbers available, such as the addition or

deletion of a speed option, temperature range, package type, or V

range. Changes may also in-

clude those needed to clarify a description or to correct a typographical error or incorrect specifica-

tion. Spansion LLC applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or

Fujitsu sales office.

S71GL032A Based MCPs

Stacked Multi-Chip Product (MCP) Flash Memory and RAM

32 Megabit (2 M x 16-bit) CMOS 3.0 Volt-only

Page Mode Flash Memory and

16/8/4 Megabit (1M/512K/256K x 16-bit)

Pseudo Static RAM

ADVANCE

INFORMATION

General Description

The S71GL series is a product line of stacked Multi-Chip Product (MCP) packages and consists

of:

One S29PL032A (Simultaneous Read/Write) Flash memory die

pSRAM or SRAM

The products covered by this document are listed in the table below:

Flash Memory Density

32Mb

pSRAM

Density

4Mb

8Mb

S71GL032A40

S71GL032A80/S71GL032A08

Distinctive Characteristics

MCP Features

Power supply voltage of 2.7 V to 3.1 V

High performance

— 100 ns (100 ns Flash, 70 ns pSRAM/SRAM)

Packages

— 7 x 9 x 1.2 mm 56 ball FBGA

Operating Temperature

— –25°C to +85°C

— –40°C to +85°C

Publication Number

S71GL032A_00

Revision

Amendment

Issue Date

March 31, 2005

This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not

design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.

Product Selector Guide

32 Mb Flash Memory

Device-Model#

S71GL032A40-0B

S71GL032A40-0F

S71GL032A08-0B

S71GL032A08-0F

100

8 M pSRAM

Flash Access time (ns)

(p)SRAM density

4 M pSRAM

SRAM1

(p)SRAM Access time (ns) pSRAM type

pSRAM4

TLC056

Package

S71GL032A Based MCPs

S71GL032A_00_A0 March 31, 2005

A d v a n c e

I n f o r m a t i o n

Contents

S71GL032A Based MCPs

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .4

32 Mb Flash Memory ............................................................................................4

Figure 1. Temporary Sector Group Unprotect Operation.......... 35

Figure 2. In-System Sector Group

Protect/Unprotect Algorithms .............................................. 36

Connection Diagram (S71GL032A) . . . . . . . . . . . . .8

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 12

TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA)

9 x 7 mm Package ............................................................................................... 12

Secured Silicon Sector Flash Memory Region ........................................... 37

Write Protect (WP#) ....................................................................................... 38

Hardware Data Protection ............................................................................. 38

Low VCC Write Inhibit ................................................................................ 39

Write Pulse “Glitch” Protection ............................................................... 39

Logical Inhibit ................................................................................................... 39

Power-Up Write Inhibit ............................................................................... 39

Common Flash Memory Interface (CFI) . . . . . . . 40

Table 18. CFI Query Identification String .............................. 40

Table 19. System Interface String........................................ 41

Table 20. Device Geometry Definition................................... 42

Table 21. Primary Vendor-Specific Extended Query ................ 43

S29GL-A MirrorBit™ Flash Family

General Description . . . . . . . . . . . . . . . . . . . . . . . . 14

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 16

S29GL064A, S29GL032A .................................................................................. 16

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 44

Reading Array Data ...........................................................................................44

Reset Command .................................................................................................44

Autoselect Command Sequence .................................................................... 45

Enter Secured Silicon Sector/Exit Secured Silicon

Sector Command Sequence ............................................................................ 45

Word Program Command Sequence ...................................................... 45

Unlock Bypass Command Sequence ........................................................46

Write Buffer Programming ..........................................................................46

Accelerated Program ....................................................................................48

Figure 3. Write Buffer Programming Operation ...................... 49

Figure 4. Program Operation ............................................... 50

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Logic Symbol-S29GL064A (Model R6, R7) ................................................. 20

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 21

Table 1. Device Bus Operations ........................................... 21

Requirements for Reading Array Data ........................................................ 22

Page Mode Read ............................................................................................. 22

Writing Commands/Command Sequences ................................................ 22

Write Buffer .....................................................................................................23

Accelerated Program Operation ...............................................................23

Autoselect Functions .....................................................................................23

Standby Mode .......................................................................................................23

Automatic Sleep Mode ......................................................................................23

RESET#: Hardware Reset Pin ........................................................................ 24

Output Disable Mode ....................................................................................... 24

Table 2. S29GL032M (Models R1, R2) Sector Addresses ......... 24

Table 3. S29GL032M (Models R3) Top Boot Sector Addresses . 25

Table 4. S29GL032M (Models R4) Bottom

Boot Sector Addresses ....................................................... 25

Table 5. S29GL064A (Models R1, R2, R8, R9)

Sector Addresses .............................................................. 26

Table 6. S29GL064A (Model R3) Top Boot Sector Addresses ... 27

Table 7. S29GL064A (Model R4) Bottom Boot Sector Addresses 28

Table 8. S29GL064A (Model R5) Sector Addresses ................. 29

Table 9. S29GL064A (Models R6, R7) Sector Addresses .......... 30

Program Suspend/Program Resume Command Sequence ....................50

Figure 5. Program Suspend/Program Resume........................ 51

Chip Erase Command Sequence .................................................................... 51

Sector Erase Command Sequence . . . . . . . . . . . . 53

Figure 6. Erase Operation ................................................... 54

Erase Suspend/Erase Resume Commands .................................................. 54

Table 22. Command Definitions (x16 Mode) .......................... 56

DQ7: Data# Polling ............................................................................................ 57

Figure 7. Data# Polling Algorithm ........................................ 58

RY/BY#: Ready/Busy# .......................................................................................58

Figure 8. Toggle Bit Algorithm ............................................. 60

Reading Toggle Bits DQ6/DQ2 ......................................................................61

DQ5: Exceeded Timing Limits .........................................................................61

DQ3: Sector Erase Timer ................................................................................62

DQ1: Write-to-Buffer Abort ........................................................................... 62

Table 23. Write Operation Status ......................................... 63

Figure 9. Maximum Negative Overshoot Waveform ................ 64

Figure 10. Maximum Positive

Overshoot Waveform ......................................................... 64

Autoselect Mode ..................................................................................................31

Sector Group Protection and Unprotection ...............................................31

Table 10. S29GL032A (Models R1, R2) Sector Group Protection/

Unprotection Addresses ...................................................... 32

Table 11. S29GL032A (Models R3) Sector Group Protection/

Unprotection Address Table ................................................ 32

Table 12. S29GL032A (Models R4) Sector Group Protection/

Unprotection Address Table ................................................ 32

Table 13. S29GL064A (Models R1, R2, R8, R9) Sector Group

Protection/Unprotection Addresses ...................................... 32

Table 14. S29GL064A (Model R3) Top Boot Sector Protection/

Unprotection Addresses ...................................................... 34

Table 15. S29GL064A (Model R4) Bottom Boot Sector Protection/

Unprotection Addresses ...................................................... 34

Table 16. S29GL064A (Model R5) Sector Group Protection/

Unprotection Addresses ...................................................... 34

Table 17. S29GL064A (Models R6, R7) Sector Group Protection/

Unprotection Addresses ...................................................... 34

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . .64

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 65

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Figure 11. Test Setup......................................................... 66

Table 24. Test Specifications ............................................... 66

Key to Switching Waveforms . . . . . . . . . . . . . . . 66

Figure 12. Input Waveforms and Measurement Levels ............ 66

Read-Only Operations-S29GL064A only .................................................... 67

Read-Only Operations-S29GL032A only .................................................... 67

Figure 13. Read Operation Timings ...................................... 68

Figure 14. Page Read Timings ............................................. 68

Hardware Reset (RESET#) ..............................................................................69

Figure 15. Reset Timings .................................................... 69

March 31, 2005 S71GL032A_00_A0

S71GL032A Based MCPs