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S71GL032A8BAW0F3

Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-56

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
TFBGA,
针数
56
Reach Compliance Code
compliant
其他特性
SRAM IS ORGANISED AS 512K X 16-BIT
JESD-30 代码
R-PBGA-B56
JESD-609代码
e0
长度
9 mm
内存密度
33554432 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
56
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
2MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
240
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.1 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
TIN LEAD
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
7 mm
文档预览
S71GL032A Based MCPs
Stacked Multi-Chip Product (MCP)
Flash Memory and RAM
32 Megabit (2 M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash
Memory and 16/8/4 Megabit (1M/512K/256K x 16-bit) pSRAM
Data Sheet
(Advance Information)
S71GL032A Based MCPs Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71GL032A_00
Revision
A
Amendment
3
Issue Date
August 3, 2006
Data
Sheet
( A dvan ce
I nfo r ma ti on)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S71GL032A Based MCPs
S71GL032A_00_A3 August 3, 2006
S71GL032A Based MCPs
Stacked Multi-Chip Product (MCP)
Flash Memory and RAM
32 Megabit (2 M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash
Memory and 16/8/4 Megabit (1M/512K/256K x 16-bit) pSRAM
Data Sheet
(Advance Information)
Features
Power supply voltage of 2.7 V to 3.1 V
High performance
– 100 ns (100 ns Flash, 70 ns pSRAM/SRAM)
Packages
– 7 x 9 x 1.2 mm 56 ball FBGA
Operating Temperature
– –25°C to +85°C
General Description
The S71GL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:
One S29GL032A Flash memory die
pSRAM or SRAM
The products covered by this document are listed in the table below:
Flash Memory Density
32Mb
4 Mb
(p)SRAM Density
8 Mb
16 Mb
S71GL032A40
S71GL032A80/S71GL032A08
S71GL032AA0
For detailed specifications, please refer to the individual data sheets:
Document
S29GL-A MirrorBit™ Flash Family Data Sheet
4 Mb pSRAM Type 4
4/8 Mb SRAM Type 1
pSRAM Type 1
16 Mb pSRAM Type 7
Note:
8M pSRAM Type 4 is identical to pSRAM Type 1, which is the publication pSRAM_12.
Publication Identification Number (PID)
S29GL-A_00
pSRAM_18
SRAM_02
pSRAM_12
pSRAM_13
Publication Number
S71GL032A_00
Revision
A
Amendment
3
Issue Date
August 3, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
( A dvan ce
I nfo r ma ti on)
1.
1.1
Product Selector Guide
32 Mb Flash Memory
Device-Model#
S71GL032A40-0B
4 M pSRAM
S71GL032A40-0F
S71GL032A08-0B
8 M SRAM
S71GL032A08-0F
S71GL032A80-0K
8 M pSRAM
S71GL032A80-0P
S71GL032AA0-0U
16 M pSRAM
S71GL032AA0-0Z
Top (W3)
Top (W3)
Bottom (W4)
pSRAM7
Top (W3)
TLC056
Bottom (W4)
pSRAM4
Top (W3)
Bottom (W4)
SRAM1
(p)SRAM density
Boot Option (Discrete Model#)
Bottom (W4)
pSRAM4
pSRAM type
Package
2. MCP Block Diagram
V
CC
f
CE#
WP#/ACC
RESET#
Flash-only Address
Shared Address
OE#
WE#
V
CC
Flash
V
SS
RY/BY#
DQ
15
to DQ
0
V
CCS
V
CC
pSRAM/SRAM
CE#s
UB#s
LB#s
CE2
CE#
UB#
LB#
IO
15
-IO
0
2
S71GL032A Based MCPs
S71GL032A_00_A3 August 3, 2006
Da ta
S h ee t
( Ad va nce
I nfor m at ion )
3. Connection Diagram (S71GL032A)
56-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
A2
A7
B1
A3
C1
A2
D1
A1
E1
A0
F1
CE1#f
G1
CE1#s
B2
A6
C2
A5
D2
A4
E2
VSS
F2
OE#
G2
DQ0
H2
DQ8
A3
LB#
B3
UB#
C3
A18
D3
A17
E3
DQ1
F3
DQ9
G3
DQ10
H3
DQ2
A4
WP/ACC
B4
RST#f
C4
RY/BY#
A5
WE#
B5
CE2s
C5
A20
A6
A8
B6
A19
C6
A9
D6
A10
E6
DQ6
A7
A11
B7
A12
C7
A13
D7
A14
E7
RFU
F7
DQ15
G7
DQ7
H7
DQ14
B8
A15
C8
RFU
D8
RFU
E8
A16
F8
RFU
G8
VSS
Legend
Density Specific
(Note 1)
Flash only
RAM only
F4
DQ3
G4
VCCf
H4
DQ11
F5
DQ4
G5
VCCs
H5
RFU
F6
DQ13
G6
DQ12
H6
DQ5
Reserved for
Future Use
Shared
Note:
May be shared depending on density.
MCP
S71GL032AA0
S71GL032A80
S71GL032A08
S71GL032A40
Flash-only Addresses
A20
A20-A19
A20-A19
A20-A18
Shared Addresses
A19-A0
A18-A0
A18-A0
A17-A0
August 3, 2006 S71GL032A_00_A3
S71GL032A Based MCPs
3
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