PSRAM IS ORGANIZED AS 4M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 代码
R-PBGA-B84
JESD-609代码
e0
长度
11.6 mm
内存密度
134217728 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
功能数量
1
端子数量
84
字数
8388608 words
字数代码
8000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
8MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
8 mm
Base Number Matches
1
文档预览
S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_01
Revision
A
Amendment
4
Issue Date
September 15, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, includ-
ing development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion LLC therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product
life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with the DC Characteristics table and the AC Erase and Program table (in the
table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S71WS-Nx0 Based MCPs
S71WS-N_01_A4 September 15, 2005
S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
ADVANCE
INFORMATION
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists
of the following items:
One or more flash memory die
pSRAM Type 4—Compatible pSRAM
The products covered by this document are listed in the table below. For details about their spec-
ifications, please refer to the individual constituent datasheet for further details.
Device
S71WS512ND0
S71WS256ND0
S71WS256NC0
S71WS128NC0
Flash Density
512 Mb
256
Mb
128
Mb
64
Mb
128 Mb
pSRAM Density
64 Mb
32 Mb
16 Mb
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz
Package
— 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
— Wireless, –25° C to +85° C
Publication Number
S71WS-N_01
Revision
A
Amendment
4
Issue Date
September 15, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.