首页 > 器件类别 > 存储 > 存储

S71WS256NC0BAWAJ2

IC,MIXED MEMORY,FLASH+PSRAM,CMOS,BGA,84PIN,PLASTIC

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Cypress(赛普拉斯)
Reach Compliance Code
compliant
Is Samacsys
N
最长访问时间
80 ns
JESD-30 代码
R-PBGA-B84
内存集成电路类型
MEMORY CIRCUIT
混合内存类型
FLASH+PSRAM
端子数量
84
最高工作温度
85 °C
最低工作温度
-25 °C
封装主体材料
PLASTIC/EPOXY
封装代码
FBGA
封装等效代码
BGA84,10X12,32
封装形状
RECTANGULAR
封装形式
GRID ARRAY, FINE PITCH
电源
1.8 V
认证状态
Not Qualified
最大待机电流
0.00007 A
最大压摆率
0.06 mA
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
Base Number Matches
1
文档预览
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet
S71WS-N Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
7
Issue Date
April 4, 2008
D at a
S hee t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S71WS-N
S71WS-N_00_A7 April 4, 2008
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz, 80 MHz
Package
– 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
– Wireless, –25° C to +85° C
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:
One or more flash memory die (for the S71WS512N, two S29WS256N devices are used)
CellularRAM Type 2 pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the
individual constituent datasheet for further details.
pSRAM
Flash Density
S29WS128N
S29WS256N
S29WS512N
32 Mb
S71WS128NB0
64 Mb
S71WS128NC0
S71WS256NC0
S71WS512NC0
S71WS256ND0
S71WS512ND0
128 Mb
For detailed specifications, please refer to the individual data sheets.
Document
S29WS-N
32 M CellularRAM Type 2
64 M CellularRAM Type 2
128 M CellularRAM Type 2
Publication Identification Number (PID)
S29WS-N_00
CellularRAM_08
Cellram_07
Cellram_07
Publication Number
S71WS-N_00
Revision
A
Amendment
7
Issue Date
April 4, 2008
D at a
S hee t
1.
Product Selector Guide
Model
Numbers
AK
54
AP
AJ
S71WS128NB0
AN
AH
80
AM
AK
54
AP
AJ
S71WS128NC0
AN
AH
80
AM
AK
54
AP
AJ
S71WS256NC0
AN
AH
80
AM
WS256N
YK
54
YP
YJ
S71WS256ND0
YN
YH
80
YM
AK
54
AP
TJ
S71WS512NC0
TN
TH
80
TM
WS512N
EK
54
EP
EJ
S71WS512ND0
EN
EH
80
EM
Note:
0 (Protected), 1 (Unprotected [Default State])
80
1
128
66
66
1
0
54
1
0
2
9x12x1.4
0
80
1
64
66
66
1
11.6x8.0x1.4
0
2
54
1
0
2
80
1
0
2
11.6x8.0x1.2
128
66
66
1
0
54
1
0
2
9x12x1.2
0
80
1
64
66
66
1
0
2
54
1
0
2
11.6x8.0x1.2
80
1
0
2
WS128N
64
66
66
1
0
54
1
0
2
8.0X11.6X1.2
80
1
0
WS128N
32
66
66
1
0
54
1
0
2
8.0X11.6X1.2
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(See
Note)
0
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
Device
Flash
2
S71WS-N
S71WS-N_00_A7 April 4, 2008
Data
She et
2.
Ordering Information
The order number is formed by a valid combinations of the following:
S71WS
256
N
C
0
BA
W
A
K
0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J = 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T = 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
Chip Contents—2
No content
pSRAM Density
B = 32 Mb
C = 64 Mb
D = 128 Mb
Process Technology
N = 110-nm MirrorBit
®
Technology
Code Flash Density
512= 512 Mb (2x256Mb)
256= 256 Mb
128= 128 Mb
Product Family
S71WS = Multi-Chip Product, 1.8 Volt-only Simultaneous Read/Write Burst
Mode Flash Memory + pSRAM
2.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Table 2.1
MCP Configurations and Valid Combinations
Valid Combinations
B
S71WS128N
C
C
S71WS256N
D
C
S71WS512N
D
Package Marking Note:
The package marking omits the leading
S
from the ordering part number.
T
E
J, N, H, M
K, P, J, N, H, M
0
BAW, BFW
Y
A
K, P, J, N, H, M
K, P, H, M
A
A
K, P, J, N, H, M
K, P, J, N, H, M
A
K, P, J, N, H, M
April 4, 2008 S71WS-N_00_A7
S71WS-N
3
查看更多>
求一款国产双节锂电池保护IC
产品里需要用到一款双节锂电池保护IC,在立创里找了发现大多数国产的保护芯片都是单节的比较多,像DW...
littleshrimp 国产芯片交流
msp430 USART模块-双向串口通信,接受长度为8的字符串,再发送回PC机
msp430 USART模块。下边是TI官方的源码 功能:双向串口通信,先接受长度为8的字符串,再发...
zhangxiajoa 微控制器 MCU
SVPWM没有输出波
本帖最后由 dontium 于 2015-1-23 13:40 编辑 最近用2407的板子做SV...
Codemaster 模拟与混合信号
这个驱动电路能不能工作到5KHZ
我有一个项目要求驱动2A的负载,工作频率为5KHZ,准备用下面的这个电路,不知道能不能到5K频率。...
飞絮 模拟电子
DSP中如何调用.asm文件里面汇编函数呢?
DSP中如何调用.asm文件里面汇编函数呢?请大侠指点。 DSP中如何调用.asm文件里面汇编函数呢...
zhaolanbao DSP 与 ARM 处理器
(SPI、I2C、Uart、并口)转串口Uart扩展技术资料下载
(SPI、I2C、Uart、并口)转串口Uart扩展技术资料下载 VK系列UART芯片介绍 ...
福跃电子 嵌入式系统
热门器件
热门资源推荐
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
需要登录后才可以下载。
登录取消