DRAM IS ORGANISED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 代码
S-PBGA-B128
长度
12 mm
内存密度
536870912 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
功能数量
1
端子数量
128
字数
33554432 words
字数代码
32000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
32MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
SQUARE
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态
Not Qualified
座面最大高度
1.05 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
BALL
端子节距
0.65 mm
端子位置
BOTTOM
宽度
12 mm
文档预览
S72NS-P MCP/PoP Memory System
Solutions
MirrorBit
®
Flash Memory and DRAM
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only, Multiplexed
Simultaneous Read/Write, Burst Mode Flash Memory
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
S72NS-P MCP/PoP Memory System Solutions Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S72NS-P_00
Revision
07
Issue Date
September 24, 2008
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S72NS-P MCP/PoP Memory System Solutions
S72NS-P_00_07 September 24, 2008
S72NS-P MCP/PoP Memory System
Solutions
MirrorBit
®
Flash Memory and DRAM
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only, Multiplexed
Simultaneous Read/Write, Burst Mode Flash Memory
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speeds
– Flash = 66 MHz, 83 MHz
– DRAM = 133 MHz, 166 MHz
Packages
– 11.0 x 10.0 mm, 133-ball MCP
– 8.0 x 8.0 mm, 133-ball MCP
– 12.0 x 12.0 mm, 128-ball PoP
Operating Temperature of –25°C to +85°C
General Description
This document contains information on the S72NS-P MCP stacked products. Refer to the S29NS-P data sheet (S29NS-P_00)
for full electrical specifications of the Flash memory component.
The S72NS Series is a product line of stacked products (MCPs and PoPs), and consists of:
NS family multiplexed Flash memory die
DDR DRAM
The products covered by this document are listed in the tables below.
DRAM Density
Flash Density
128 Mb
256 Mb
512 Mb
128 Mb
S72NS128PD0
S72NS256PD0
S72NS512PD0
S72NS512PE0
256 Mb
For detailed specifications, please refer to the individual data sheets.
Density
Manufacturer
DRAM1
128
DRAM5
Publication Number
DRAM_07
SDRAM_07 (90 nm)
DRAM_15 (70 nm)
Density
Manufacturer
DRAM1
Publication Number
DRAM_08
SDRAM_11 (90 nm)
DRAM_14 (70 nm)
256
DRAM5
Publication Number
S72NS-P_00
Revision
07
Issue Date
September 24, 2008
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Product Selector Guide
Device OPN
S72NS128PD0AJBGG
S72NS128PD0AJBGC
128 Mb
S72NS128PD0AHBLG
S72NS128PD0AHBLC
S72NS256PD0AJBGG
S72NS256PD0AJBGC
256 Mb
S72NS256PD0AJBLG
S72NS256PD0AJBLC
S72NS512PD0AJGGG
S72NS512PD0AJGGC
S72NS512PD0AJGLG
512 Mb
S72NS512PD0AHGLG
S72NS512PD0AJGLC
S72NS512PD0AHGL4
(2)
S72NS512PE0AJGLG
512 Mb
S72NS512PE0AJGLC
S72NS512PE0KFFGG
512 Mb
S72NS512PE0KFFG0
256 Mb
83
256 Mb
83
66
133
166
DRAM1
128 Mb
66
DRAM5
83
66
66
166
133
DRAM5
11.0 x 10.0 mm 133-ball MCP
(NLC133)
12.0 x 12.0 mm 128-ball PoP
0.48 mm ball (ALF128)
128 Mb
66
DRAM5
83
66
DRAM1
83
66
133
11.0 x 10.0 mm 133-ball MCP
(NLC133)
128 Mb
66
DRAM5
83
66
DRAM1
83
133
8.0 x 8.0 mm 133-ball MCP
(NSC133)
Flash
Density
DDR DRAM
Density
Flash Speed
(MHz)
66
DRAM1
83
133
8.0 x 8.0 mm 133-ball MCP
(NSC133)
DDR DRAM
Speed (MHz)
Supplier
(1)
Package
Note
1. Please contact your local Spansion sales representative for exact RAM version as multiple DRAM5 versions may exist for a given product.
2. Not recommended for new designs.
4
S72NS-P MCP/PoP Memory System Solutions
S72NS-P_00_07 September 24, 2008
D at a
S hee t
(Adva nce
In for m ation)
2. Product Block Diagram
F-RST#
F-ACC
F-WP#
F-CE#
F-OE#
F-WE#
AVD#
F-V
SS
F2-CE#
RST#
ACC
WP#
CE#
OE#
WE#
AVD#
V
SS
A15-A0
DQ15-DQ0
ADQ15-ADQ0
MUX
Flash
Memory
NS-P
CLK
RDY
F-CLK
F-RDY
Amax - A16
V
CC
V
CCQ
Amax - A16
F-V
CC
F-V
CCQ
D-RAS#
D-CAS#
D-BA0
D-BA1
D-CKE
D-WE#
D-CE#
D-Amax - D-A0
D-V
CC
D-V
CCQ
RAS#
CAS#
BA0
BA1
CKE
WE#
CE#
CLK
CLK#
DQS0
DQS1
D-CLK
D-CLK#
D-LDQS
D-UDQS
D-LDQM
D-UDQM
D-TEST
D-DQ15 - D-DQ0
D-V
SS
D-V
SSQ
DDR
DRAM
Memory
LDQM
UDQM
TEST
DQ15-DQ0
V
SS
V
SSQ
V
CC
V
CCQ
Notes:
1. Amax indicates highest address bit for memory component:
a. Amax = A24 for NS512P, A23 for NS256P, A22 for NS128P
b. Amax = A11 for 128 Mb DDR DRAM
c. Amax = A12 for 256 Mb DDR DRAM
2. For Flash, A15 - A0 is tied to DQ15 - DQ0.
3. F2-CE# applicable for second Flash die, if any.
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