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S72XS256RD0AHBJE0

Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
VFBGA, BGA133,14X14,20
针数
133
Reach Compliance Code
unknown
JESD-30 代码
S-PBGA-B133
长度
8 mm
内存密度
268435456 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
混合内存类型
FLASH+SDRAM
功能数量
1
端子数量
133
字数
16777216 words
字数代码
16000000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-25 °C
组织
16MX16
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装等效代码
BGA133,14X14,20
封装形状
SQUARE
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
电源
1.8 V
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
宽度
8 mm
文档预览
S72XS-R Based MCPs
MirrorBit
®
Flash Memory and DRAM
128/256 Mb (8/16M x 16 bit), 1.8 Volt-only, Address-High, Address-
Low, Data Multiplexed Simultaneous Read/Write,
Burst Mode Flash Memory
128 Mb (8M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
S72XS-R Based MCPs Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S72XS-R_00
Revision
01
Issue Date
October 7, 2008
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S72XS-R Based MCPs
S72XS-R_00_01 October 7, 2008
S72XS-R Based MCPs
MirrorBit
®
Flash Memory and DRAM
128/256 Mb (8/16M x 16 bit), 1.8 Volt-only, Address-High, Address-
Low, Data Multiplexed Simultaneous Read/Write,
Burst Mode Flash Memory
128 Mb (8M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speeds
– Flash = 83MHz, 104 MHz
– DDR DRAM = 166 MHz
Packages
– 8.0 x 8.0 mm, 133-ball MCP
Operating Temperature of –25°C to +85°
General Description
This document contains information on the S72XS-R MCP stacked products. Refer to the S29VS/XS-R data sheet
(S29VS_XS-R_00) for full electrical specifications of the Flash memory component.
The S72XS Series is a product line of stacked products (MCPs), and consists of:
S29NS family Address-High, Address-Low, Data Multiplexed Flash memory die
DDR DRAM
The products covered by this document are listed in the tables below.
DRAM Density
Flash Density
128 Mb
256 Mb
128 Mb
S72XS128RD0
S72XS256RD0
DDR Specification Reference
Spansion Documentation
Density
128
Publication Number
CustComspec_02
Publication Number
S72XS-R_00
Revision
01
Issue Date
October 7, 2008
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Product Selector Guide
Device OPN
S72XS128RD0AHBHE
Top
S72XS128RD0AHBHD
S72XS128RD0AHBJE
Bottom
S72XS128RD0AHBJD
S72XS128RD0AHBGE
Uniform
S72XS128RD0AHBGD
S72XS256RD0AHBHE
Top
S72XS256RD0AHBHD
S72XS256RD0AHBJE
Bottom
S72XS256RD0AHBJD
S72XS256RD0AHBGE
Uniform
S72XS256RD0AHBGD
104
256 Mb
128 Mb
104
83
104
83
166
104
83
8.0 x 8.0 mm
133-ball MCP (RLB133)
128 Mb
128 Mb
104
83
104
83
166
Flash Boot
Flash
Density
DDR DRAM
Density
Flash Speed
(MHz)
83
DDR DRAM
Speed (MHz)
Package
4
S72XS-R Based MCPs
S72XS-R_00_01 October 7, 2008
D at a
S hee t
(Adva nce
In for m ation)
2.
Product Block Diagram
F-RST#
F-VPP
F-CE#
F-OE#
F-WE#
F-AVD#
RST#
VPP
CE#
OE#
WE#
AVD#
ADQ15-ADQ0
Amax-A16 (No Connect)
CLK
RDY
ADQ15-ADQ0
F-CLK
F-RDY
NOR
FLASH
XS-R
(AADM)
VCC
VCCQ
VSS
VSSQ
F-VCC
F-VCCQ
F-VSS
D-RAS#
D-CAS#
D-BA0
D-BA1
D-CKE
D-WE#
D-CE#
D-Amax - D-A0
D-VCC
D-VCCQ
RAS#
CAS#
BA0
BA1
CKE
WE#
CS#
Amax-A0
VDD
VDDQ
CK
CK#
LDQS
UDQS
LDM
UDM
TEST
DQ15-DQ0
VSS
VSSQ
DDR
DRAM
MEMORY
D-CLK
D-CLK#
D-LDQS
D-UDQS
D-LDQM
D-UDQM
D-TEST (only for Micron DRAM)
D-DQ15 - D-DQ0
D-VSS
D-VSSQ
Notes:
1. Amax indicates highest address bit for memory component:
a. Amax = A23 for XS256R, A22 for XS128R
b. Amax = A11 for 128 Mb DDR DRAM
2. For Flash, A15 - A0 is tied to DQ15 - DQ0.
October 7, 2008 S72XS-R_00_01
S72XS-R Based MCPs
5
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