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S75PL127NBGJFWGZ0

Stacked Multi-Chip Product (MCP)

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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S75PL-N MirrorBit
ORNAND
MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND Interface)
3V pSRAM
Data Sheet
(Advance Information)
S75PL-N MirrorBit
ORNAND
MCPs Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S75PL-N_00
Revision
01E
Issue Date
April 21, 2006
Data
Sheet
( A dva nce
I nf or ma ti on)
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
LLC therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion LLC.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion LLC reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion LLC applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion LLC deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical
or specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
ii
S75PL-N MirrorBit
ORNAND
MCPs
April 21, 2006 S75PL-N_00-01E
S75PL-N MirrorBit
ORNAND
MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND interface)
3V pSRAM
Data Sheet
(Advance Information)
Features
„
Speed
– PL-N: 70 ns (initial access, 30 ns page access)
– ML-P: 30 ns (page access)
– pSRAM: 70 ns
„
107-Ball Fine-Pitch Ball Grid Array (FBGA)
– 9 x 12 x 1.4mm for ML512P based MCP's
– 11 x 13 x 1.4mm for ML01GP based MCPs
„
Operating Temperature Range
– Temperature Range of –25°C to +85°C
General Description
This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following
devices:
„
S29PL-N
„
S30ML-P
„
3 V pSRAM
Flash/RAM Combinations Table
pSRAM Density
S29PL127N +
S30ML512P
S30ML01GP
32 Mb
S75PL127NBF
64 Mb
Product Selector Guide
Device
S75PL127NBF
pSRAM Density
32 Mb
pSRAM Type
pSRAM Type 7
For detailed specifications, please refer to the individual data sheets:
Document
S29PL-N
S30ML-P
32M pSRAM Type 7
Publication Identification Number (PID)
S29PL-N_M0
S30ML-GP_00
pSRAM_29
Publication Number
S75PL-N_00
Revision 01E
Issue Date
April 21, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
( A dva nce
I nf or ma ti on)
1.
S75PL
Ordering Information
The ordering part number is formed by a valid combination of the following:
127
N
B
F
JF
W
GZ
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit™ Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
2
S75PL-N MirrorBit
ORNAND
MCPs
S75PL-N_00_01E April 21, 2006
D a ta
S h e e t
( A dv anc e
In fo rm at ion )
1.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Valid Combinations
Base Ordering
Part Number
(2)
S75PL127NBF
Package &
Temperature
JAW, JFW
Model
Number
GZ
Packing
Type
0, 2, 3
(1), (2)
pSRAM
Type
Type 7
PL-N
Linear Mode
Access Time
70 ns
ML-P Page
Mode Access
Time
30 ns
pSRAM
Linear Mode
Access Time
70 ns
Package Name
FMH107
9x12x1.4mm,
107 ball
Notes:
1.
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2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Contact factory for availability for any of the OPNs listed since RAM type availability may vary over time.
2. Block Diagram (S29PL-N and pSRAM on Bus 1, S30ML-P on Bus 2)
A0-A20
A21-A22
A0-A20
A21-A22
RY/BY#
RY/BY#
DQ0-DQ15
DQ0-DQ15
S29PL127N
F-CE#
OE#
F-RST#
F-ACC/WP#
WE#
CE#
OE#
RESET#
ACC/WP#
WE#
VSS
VSS
VCC
VCCQ
F-VCC
A0-A20
DQ0-DQ15
R-CE#
CE#
OE#
LB#
UB#
WE#
R-CE2
R-LB#
R-UB#
R-CE2
32Mb
pSRAM
Memory
VSS
VCC
VCCQ
R-VCC
I/O0-I/O7
I/O0-I/O7
N-RY/BY#
RY/BY#
VCC
N-VCC
N-CLE
N-CE#
N-ALE
N-RE#
N-WP#
N-WE#
N-PRE
CLE
CE#
ALE
RE#
WP#
WE#
PRE
S30ML512P
x8 ORNAND
FP#
I/O0-I/O7
VSS
I/O0-I/O7
N-VSS
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBit
ORNAND
MCPs
3
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