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S98WS064RBOHI0013

Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
厂商名称
Cypress(赛普拉斯)
包装说明
TFBGA,
Reach Compliance Code
unknown
JESD-30 代码
R-PBGA-B88
长度
10 mm
内存密度
67108864 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
功能数量
1
端子数量
88
字数
4194304 words
字数代码
4000000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
宽度
8 mm
文档预览
S98WS064RB0HI001, -002
Stacked Multi-Chip Product (MCP)
64 Megabit (4 M x 16-Bit), 1.8 Volt-only Simultaneous Read/Write,
Burst Mode Flash Memory with
32 Megabit (2M x 16-Bit) CellularRAM
Data Sheet
(Advance Information)
S98WS064RB0HI001, -002 Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S98WS064RB0HI001-002
Revision
01
Issue Date
August 20, 2010
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S98WS064RB0HI001, -002
S98WS064RB0HI001-002_01 August 20, 2010
S98WS064RB0HI001, -002
Stacked Multi-Chip Product (MCP)
64 Megabit (4 M x 16-Bit), 1.8 Volt-only Simultaneous Read/Write,
Burst Mode Flash Memory with
32 Megabit (2M x 16-Bit) CellularRAM
Data Sheet
(Advance Information)
Features
Single 1.8 volt read, program and erase (1.7 to 1.95 volt)
Simultaneous Read/Write operation
– Data can be continuously read from one bank while executing
erase/program functions in other bank
– Zero latency between read and write operations
Speed
– Flash and CellularRAM: 108 MHz
Page Mode Read Access
– Flash: 8-word page with page access time of 20 ns
– CellularRAM: 16-word page with page access time of 20 ns
Package
– 88-ball Thin Fine pitch BGA
– 10.0 x 8.0 x 1.2 mm
For detailed specifications, please refer to the individual data sheets:
Document
S29WS064R
32 Mb Async/Page/Burst CellularRAM
Publication Identification Number (PID)
S29WS064R_00
SWM032D133S3R
Publication Number
S98WS064RB0HI001-002
Revision
01
Issue Date
August 20, 2010
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Ordering Information
The order number is formed by a valid combination of the following:
S98WS
064
R
B0
H
W
001
0
Packing Type
0 = Tray
3 = 13-inch Tape and Reel
Additional Ordering Options
See valid combinations table
Temperature Range
I = Industrial (–40°C to +85°C)
W = Wireless (–25°C to +85°C)
Package Material
H = Low-Halogen, Lead (Pb) Free Package
DRAM Density
B0 = 32 Megabit (2M x 16-Bit)
Process Technology
R = 65 nm MirrorBit
®
Technology
Flash Density
064 = 64 Megabit (4M x 16-Bit)
Product Family
S98WS = Stacked Multi-Chip Product, Simultaneous Read/Write, Burst Mode
Flash Memory, 1.8-Volt Operation
1.1
Valid Combinations
The following configurations are planned to be supported for this device. Consult the local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 1.1
Valid Combinations
Product
Family
S98WS
Flash
Density
064
Process
Technology
R
DRAM
Density
B0
Package Material / Temperature Range
HI, HW
Model Number
001, 002
Packing
Type
0, 3
Note:
BGA package marking omits leading S and packing type designator from ordering part number.
2. Product Selector Guide
Part#
Flash Burst Frequency
CellularRAM Frequency
DYB
Factory Secured Silicon Region
Customer Secured Silicon Region
Boot option
S98WS064RB0HW001x/
S98WS064RB0HI001x
108 MHz
108 MHz
Unlocked
Locked
Unlocked
Top Boot
S98WS064RB0HW002x/
S98WS064RB0HI002x
108 MHz
108 MHz
Unlocked
Locked
Unlocked
Bottom Boot
4
S98WS064RB0HI001, -002
S98WS064RB0HI001-002_01 August 20, 2010
D at a
S hee t
(Adva nce
In for m ation)
3.
MCP Block Diagram
A0-A20
A21
A 0-A 20
A 21
RDY
RDY
D Q 0-D Q 15
DQ0-DQ15
CLK
AVD#
F-CE#
F-OE#
F-RST#
F-ACC
F-WE#
C LK
A V D#
CE #
OE#
R E S E T#
A CC
W E#
WS064R
Flash
Memory
VSS
VSS
V CC
V IO
F-VCC
VCCQ
A 0-A 20
D Q 0-D Q 15
R-CE#
R-OE#
R-LB#
R-UB#
R-WE#
R-CRE
C LK
A V D#
CE #
OE#
LB #
UB #
W E#
CRE
32 Mb
CellularRAM
W A IT
VSS, VSSQ
V CC
V CCQ
R-VCC
August 20, 2010 S98WS064RB0HI001-002_01
S98WS064RB0HI001, -002
5
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参数对比
与S98WS064RBOHI0013相近的元器件有:S98WS064RBOHW0023、S98WS064RBOHW0020、S98WS064RBOHW0010、S98WS064RBOHI0010。描述及对比如下:
型号 S98WS064RBOHI0013 S98WS064RBOHW0023 S98WS064RBOHW0020 S98WS064RBOHW0010 S98WS064RBOHI0010
描述 Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 10 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-88
包装说明 TFBGA, TFBGA, TFBGA, TFBGA, TFBGA,
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 代码 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88
长度 10 mm 10 mm 10 mm 10 mm 10 mm
内存密度 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
内存宽度 16 16 16 16 16
功能数量 1 1 1 1 1
端子数量 88 88 88 88 88
字数 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000 4000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -25 °C -25 °C -25 °C -40 °C
组织 4MX16 4MX16 4MX16 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TFBGA TFBGA TFBGA TFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL OTHER OTHER OTHER INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 8 mm 8 mm 8 mm 8 mm 8 mm
厂商名称 Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
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