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SAB-XC164LM-4F40F

Microcontroller, 16-Bit, FLASH, 40MHz, CMOS, PQFP64, 0.50 MM PITCH, GREEN, PLASTIC, TQFP-64

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Infineon(英飞凌)

厂商官网:http://www.infineon.com/

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器件参数
参数名称
属性值
厂商名称
Infineon(英飞凌)
零件包装代码
QFP
包装说明
0.50 MM PITCH, GREEN, PLASTIC, TQFP-64
针数
64
Reach Compliance Code
compli
ECCN代码
3A991.A.2
具有ADC
NO
其他特性
ALSO REQUIRES 5V SUPPLY
地址总线宽度
位大小
16
最大时钟频率
40 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
S-PQFP-G64
长度
10 mm
I/O 线路数量
47
端子数量
64
最高工作温度
70 °C
最低工作温度
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
认证状态
Not Qualified
ROM可编程性
FLASH
座面最大高度
1.6 mm
速度
40 MHz
最大供电电压
2.7 V
最小供电电压
2.35 V
标称供电电压
2.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
10 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
Data Sheet, V1.1, Aug. 2006
XC164LM
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
Edition 2006-08
Published by
Infineon Technologies AG
81726 München, Germany
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-
infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
©
Infineon Technologies AG 2006.
Data Sheet, V1.1, Aug. 2006
XC164LM
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
XC164LM
Derivatives
Preliminary
XC164LM
Revision History: V1.1, 2006-08
Previous Version(s):
V1.0, 2005-11
Page
6
9
12
16
39
46
47, 48
56
57
Subjects (major changes since last revision)
New derivatives with 128 Kbytes Flash and 4 Kbytes DSRAM added.
EX4IN and EX5IN alternate pin mapping corrected.
Footnote added about pin XTAL1 belonging to
V
DDI
power domain.
Memory map corrected regarding Program Flash.
Instructions Set Summary improved.
Footnote added about amplitude at XTAL1 pin.
Supply current modified for product design steps starting with BA
Package changed to green.
Thermal Resistance:
R
THA
replaced by
R
ΘJC
and
R
ΘJL
because
R
THA
strongly depends on the external system (PCB, environment).
P
DISS
removed, because no static parameter, but derived from thermal
resistance.
Datasheet marked as preliminary due to introduction of new design step BA
all
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet
V1.1, 2006-08
XC164LM
Derivatives
Preliminary
Table of Contents
Table of Contents
1
2
2.1
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
4
4.1
4.2
4.3
4.3.1
4.3.2
4.3.3
5
5.1
5.2
Summary of Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
General Device Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Unit (CAPCOM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) . . . . . . . . . .
High Speed Synchronous Serial Channels (SSC0/SSC1) . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-chip Flash Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
15
17
19
24
25
28
32
33
34
35
36
37
38
39
42
42
45
50
50
54
55
Package and Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Data Sheet
3
V1.1, 2006-08
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