Bulletin I0509J rev. A 05/01
SC070.....5. Series
SCHOTTKY DIE 70 x 92 mils
a
c
0.35 ± 0.01
(14 ± 0.4)
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
C
A
D
b
d
Ø
40 (157)
3. DIMENSIONS AND TOLERANCES:
a = 1.78 + 0, - 0.01
(70 + 0, - 0.4)
b = 2.34 + 0, - 0.01
(92 + 0, - 0.4)
c = 1.63 + 0, - 0.01
(64 + 0, - 0.4)
d = 2.18 + 0, - 0.01
(86 + 0, - 0.4)
Ø = 0.7 ± 0.1
(30 ± 4)
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
Wafer flat alligned with
side b of the die
Ø 125 (492)
NOT TO SCALE
NOTE:
10 mils die thickness is available on specific request only.
Contact factory for information.
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1
SC070.....5.
Bulletin I0509J rev.A 05/01
Electrical Characteristics
Device
#
SC070
R
015x5x
SC070
S
020x5x
SC070
S
030x5x
SC070
S
045x5x
SC070
S
060x5x
SC070
H
045x5x
SC070
H
100x5x
SC070
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
12
5
2
90
70
Typ. I
R
@ 25°C
(µA)
Typ. I
R
@ 125°C
(mA)
Max. V
F
@ I
F
(V)
Package
Style
n.a. contact factory
n.a. contact factory
38
32
0.55 @ 12A
0.70 @ 15A
DPAK (TO-252)
TO-220
n.a. contact factory
4
2.5
1.5
0.56 @ 15A
0.95 @ 12A
1.1 @ 10A
TO-220
DPAK (TO-252)
TO-220
Mechanical Data
Device
#
SC070xxxx
A
5x
SC070xxxx
S
5x
Wire Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC070xxxxx5
B
SC070xxxxx5
R
SC070xxxxx5
P
SC070xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
2500
n.a
2500
2500
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
2
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SC070.....5.
Bulletin I0509J rev. A 05/01
Ordering Information Table
Device Code
SC 070
1
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils
Process (see Electrical Characteristics Table)
Voltage code: Code = V
RRM
2
S
3
045
4
A
5
5
6
B
7
H = 830 Process
R = OR'ing Process
S = Standard Process
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging (see Packaging Table)
Wafer on Film
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3
SC070.....5.
Bulletin I0509J rev.A 05/01
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
4
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SC070.....5.
Bulletin I0509J rev. A 05/01
WORLD HEADQUARTERS:
EUROPEAN HEADQUARTERS:
IR CANADA:
IR GERMANY:
IR ITALY:
IR FAR EAST:
IR SOUTHEAST ASIA:
IR TAIWAN:
http://www.irf.com
233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.
Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.
15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.
Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.
Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.
K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.
1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.
16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.
Data and specifications subject to change without notice.
Fax-On-Demand: +44 1883 733420
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