Bulletin I0499J rev. C 03/07
SC100.....5. Series
SCHOTTKY DIE 105 x 105 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
D
b
d
C
A
NOTES:
Ø
Ø 125 (492)
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
NOT TO SCALE
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 +0, - 0.005
(2 +0, - 0.2)
5. DIMENSIONS AND TOLERANCES
Device
#
SC100
R
015x5x
SC100
S
020x5x
SC100
S
030x5x
SC100
S
045x5x
SC100
S
060x5x
SC100
H
045x5x
SC100
H
100x5x
SC100
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
n.a. contact factory
n.a. contact factory
2.67 + 0, - 0.01
(105+ 0, - 0.4)
2.67 + 0, - 0.01
(105+ 0, - 0.4)
2.67 + 0, - 0.01
(105+ 0, - 0.4)
2.67 + 0, - 0.01
(105+ 0, - 0.4)
2.51 + 0, - 0.01
(99+ 0, - 0.4)
2.51 + 0, - 0.01
(99+ 0, - 0.4)
2.51 + 0, - 0.01
(99+ 0, - 0.4)
2.51 + 0, - 0.01
(99+ 0, - 0.4)
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
2.67 + 0, - 0.01 2.67 + 0, - 0.01 2.51 + 0, - 0.01 2.51 + 0, - 0.01
(105+ 0, - 0.4) (105+ 0, - 0.4) (99+ 0, - 0.4) (99+ 0, - 0.4)
2.67 + 0, - 0.01 2.67 + 0, - 0.01 2.51 + 0, - 0.01 2.51 + 0, - 0.01
(105+ 0, - 0.4) (105+ 0, - 0.4) (99+ 0, - 0.4) (99+ 0, - 0.4)
2.67 + 0, - 0.01 2.67 + 0, - 0.01 2.51 + 0, - 0.01 2.51 + 0, - 0.01
(105+ 0, - 0.4) (105+ 0, - 0.4) (99+ 0, - 0.4) (99+ 0, - 0.4)
2.67 + 0, - 0.01 2.67 + 0, - 0.01 2.51 + 0, - 0.01 2.51 + 0, - 0.01
(105+ 0, - 0.4) (105+ 0, - 0.4) (99+ 0, - 0.4) (99+ 0, - 0.4)
Document Number: 93864
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1
SC100.....5.
Bulletin I0499J rev. C 03/07
Electrical Characteristics
Device
#
SC100
R
015x5x
SC100
S
020x5x
SC100
S
030x5x
SC100
S
045x5x
SC100
S
060x5x
SC100
H
045x5x
SC100
H
100x5x
SC100
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
220
65
60
35
7
3
Typ. I
R
@ 25°C
(μA)
Typ. I
R
@ 125°C
(mA)
Max. V
F
@ I
F
(V)
Package
Style
n.a. contact factory
n.a. contact factory
100
55
40
10
4.5
2.7
0.49 @ 15A
0.76 @ 30A
0.60 @ 15A
0.62 @ 15 A
0.95 @ 20A
0.96 @ 20A
TO-220
TO-220
TO-247
TO-220
TO-220
TO-220
Mechanical Data
Device
#
SC100xxxx
A
5x
SC100xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC100xxxxx5
B
SC100xxxxx5
R
SC100xxxxx5
P
SC100xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
1420
8000
1420
1420
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
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Document Number: 93864
SC100.....5.
Bulletin I0499J rev. C 03/07
Ordering Information Table
Device Code
SC 100
1
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils
2
H
3
150
4
A
5
5
6
B
7
H = 830 Process
R = OR'ing Process
S = Standard Process
Process (see Electrical Characteristics Table)
Voltage code: Code = V
RRM
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging (see Packaging Table)
Wafer on Film
Document Number: 93864
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SC100.....5.
Bulletin I0499J rev. C 03/07
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
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Document Number: 93864
SC100.....5.
Bulletin I0499J rev. C 03/07
Tape and Reel
REEL FRAME
BARE DIE CARRIER TAPE
Data and specifications subject to change without notice.
This product has been designed for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
Document Number: 93864
www.vishay.com
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