型号 | SCM23C256E-3 | SCM23C256E-2 | 883/23C256MC | 883/23C256MD | SCM23C256C-1 | SCM23C256C-2 | SCM23C256C-3 | SCM23C256E-1 | SCM23C256MC |
---|---|---|---|---|---|---|---|---|---|
描述 | Memory IC | Memory IC | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, CDIP28 | MASK ROM, 32KX8, 120ns, CMOS, CDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, PDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 |
包装说明 | , | , | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | - | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) |
最长访问时间 | - | - | 150 ns | 150 ns | 100 ns | 120 ns | 150 ns | 100 ns | 150 ns |
JESD-30 代码 | - | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 |
JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | - | - | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi |
内存集成电路类型 | - | - | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | - | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | - | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | - | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | - | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
最高工作温度 | - | - | 125 °C | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C | 125 °C |
组织 | - | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | - | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | - | - | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | - | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | - | - | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | - | - | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | - | NO | NO | NO | NO | NO | NO | NO |
技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY |
端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |