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SDI322520-220JF

General Purpose Inductor, 22uH, 5%, 1210,

器件类别:无源元件    电感器   

厂商名称:SUPERWORLD

厂商官网:http://www.superworld.com.sg/

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
763664637
包装说明
1210
Reach Compliance Code
unknown
ECCN代码
EAR99
大小写代码
1210
构造
Chip
直流电阻
2.8 Ω
标称电感 (L)
22 µH
电感器类型
GENERAL PURPOSE INDUCTOR
最高工作温度
85 °C
最低工作温度
-25 °C
封装高度
2 mm
封装长度
3.2 mm
封装形式
SMT
封装宽度
2.5 mm
包装方法
TR
最小质量因数(标称电感时)
35
最大额定电流
0.15 A
自谐振频率
14 MHz
容差
5%
文档预览
WIREWOUND CHIP INDUCTORS
1. PART NO. EXPRESSION :
SDI322520 SERIES
SDI322520-1R0MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : 1R0 = 1.0uH
(d) Tolerance code : J = ±5%, K = ±10%, M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
B
E
F
E
I
J
I
C
PCB Pattern
Unit:m/m
A
3.2±0.3
B
2.5±0.2
C
2.0±0.3
E
0.7 Min.
F
0.7 Min.
H
2.0 Ref.
I
1.5 Ref.
J
1.0 Ref.
3. SCHEMATIC :
1
2
4. GENERAL SPECIFICATION :
a) Ambient temp. : 20°C
b) Operating temp. : -25°C to 85°C
c) Rated current : Base on temp. rise & L/L0A=10% Max.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
WIREWOUND CHIP INDUCTORS
5. ELECTRICAL CHARACTERISTICS :
Part No.
SDI322520-R10 F
SDI322520-R18 F
SDI322520-R27 F
SDI322520-R39 F
SDI322520-R56 F
SDI322520-R68 F
SDI322520-R82 F
SDI322520-1R0 F
SDI322520-1R2 F
SDI322520-1R5 F
SDI322520-1R8 F
SDI322520-2R2 F
SDI322520-2R7 F
SDI322520-3R3 F
SDI322520-3R9 F
SDI322520-4R7 F
SDI322520-5R6 F
SDI322520-6R8 F
SDI322520-8R2 F
SDI322520-100 F
SDI322520-120 F
SDI322520-150 F
SDI322520-180 F
SDI322520-220 F
SDI322520-270 F
SDI322520-330 F
SDI322520-390 F
SDI322520-470 F
SDI322520-560 F
SDI322520-680 F
SDI322520-820 F
Inductance tolerance :
: J = ±5%
K = ±10%
M = ±20%
Inductance
( uH )
0.10
0.18
0.27
0.39
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
Tolerance
M
M
M
M
M
M
M
M
M
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
Test
Frequency
( Hz )
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
Q
Min.
20
20
25
25
30
30
30
20
20
20
20
20
20
20
20
20
20
20
20
35
35
35
35
35
35
40
40
40
40
40
40
Test
Frequency
( Hz )
25.2M
25.2M
25.2M
25.2M
25.2M
25.2M
25.2M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
SDI322520 SERIES
SRF
( MHz )
Min.
200
200
200
200
160
160
120
100
100
75
60
50
43
38
35
31
28
25
23
20
18
16
15
14
13
12
11
11
10.0
9.0
8.5
DCR
( )
Max.
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.50
0.60
0.60
0.70
0.80
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.5
2.8
3.1
3.5
3.9
4.3
4.9
5.5
6.2
IDC
( mA )
Max.
700
650
600
530
530
470
450
445
425
400
390
370
320
300
290
270
250
240
225
190
180
170
165
150
125
115
110
100
85
80
70
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
WIREWOUND CHIP INDUCTORS
5. ELECTRICAL CHARACTERISTICS :
Part No.
SDI322520-101 F
SDI322520-121 F
SDI322520-151 F
SDI322520-181 F
SDI322520-221 F
SDI322520-271 F
SDI322520-331 F
SDI322520-391 F
SDI322520-471 F
SDI322520-561 F
Inductance tolerance :
: J = ±5%
K = ±10%
M = ±20%
Inductance
( uH )
100
120
150
180
220
270
330
390
470
560
Tolerance
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
K, J
Test
Frequency
( Hz )
1M
1M
1M
1M
1M
1M
1M
1M
1K
1K
Q
Min.
40
40
40
40
40
40
40
50
50
50
Test
Frequency
( Hz )
796K
796K
796K
796K
796K
796K
796K
796K
796K
796K
SDI322520 SERIES
SRF
( MHz )
Min.
8.0
7.5
7.0
6.0
5.5
5.0
5.0
5.0
5.0
5.0 ( Ref. )
DCR
( )
Max.
7.0
8.0
9.3
10.2
11.8
12.5
15.0
22.0
25.0
28.0
IDC
( mA )
Max.
80
75
70
65
65
65
65
50
45
40
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
WIREWOUND CHIP INDUCTORS
6. RELIABILITY AND TEST CONDITION :
SDI322520 SERIES
ITEM
Environmental Tests
High Temperature Storage Test
Reference documents:
MIL-STD-202G Method 108A
PERFORMANCE
TEST CONDITION
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Temperature : 85±2°C
Time : 96±2 hours
Tested after 1 hour (less than 2 hours) at room temperature
Temp
85°C
Room
Temp
0
High temperature
1H
96H Test Time
Low Temperature Storage Test
Reference documents:
IEC 68-2-1A 6.1 6.2
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Temperature : -25±2°C
Time : 96±2 hours
Tested after 1 hour (less than 2 hours) at room temperature
Room
Temp
0
-25°C
Temp
Low temperature
96H
Test
Time
Humidity Test
Reference documents:
MIL-STD-202G Method 103B
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Dry oven at temperature of 40±5°C for 24 hours
Measured after 24 hours
Exposure : Temperature : 40±2°C, Humidity : 93±3% RH,
Time : 96±2 hours
Tested while the specimens are still in the chamber
Tested after 1 hour (less than 2 hours) at room temperature
40°C
93%RH
Temp & Humidity
High temperature
High humidity
Room
Conditions
1H
0
96H Test
Time
Thermal shock test
Reference documents:
MIL-STD-202G Method 107G
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
T : weight< 28g : 15 Min.
28g<weight<136g : 30 Min.
Conditions of 1 cycle :
Step 1 : -40°C for T time
Step 2 : 125°C for T time
Total : 20 cycles
Temp
125°C
Room
Temp
0
-40°C
T
Time
Change time < 5 min
T
Physical Characteristics Tests
Solderability Test
Reference documents:
MIL-STD-202G Method 208H
IPC J-STD-002B
More than 95% of termincal electrode should
be covered with solder.
Solder temperature : 245±5°C
Dip time : 5 secs.
Solder : Sn(63)/Pb(37)
Flux : rosin flux
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
WIREWOUND CHIP INDUCTORS
6. RELIABILITY AND TEST CONDITION :
SDI322520 SERIES
ITEM
Heat Endurance of
Reflow Soldering
Reference documents:
IPC J-STD-020B
PERFORMANCE
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
TEST CONDITION
Refer to reflow curve.
No. of cycle : 3
Peak temp. : 245±5°C
Vibration Test
Reference documents:
MIL-STD-202G Method 201A
Frequency : 10~55Hz
Amplitude : 0.75mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Freq
55Hz
10Hz
1Min
Time
Drop Test
Reference documents:
MIL-STD-202G Method 203C
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Pulling Test :
A : Sectional area of terminal
Drop from a height of 1m with 981m/s² (100G) altitude
(1 angle, 1 ridge and 2 surface orientations)
Terminal Strength Push Test
Reference documents:
JIS C 5321:1997
Bend PCB at middle point, the deflection shall be 2mm.
Pulling Test :
Force
A<8mm²
8mm²<A<20mm²
20mm²<A
>5N
>10N
>20N
Time (sec)
30
10
10
X
Bending Test :
R0.5
1.0
Y
Bending Test : The terminal electrode & the
dielectric must not be damaged by the forces
applied on the right conditions.
Sample
Reflow Curve
300
250
270
200
150
100
50
Preheat
Ramp-up
Peak
Ramp-down
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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