SDM2U30CSP
P
2A SCHOTTKY BARRIER RECTIFIER CHIP SCALE PACKAGE
Product Summary
V
RRM
(V)
30
I
O
(A)
2.0
V
F max
(V)
0.48
I
R max
(µA)
150
Features and Benefits
Low forward voltage (V
F
) minimizes conduction losses and
improves efficiency.
Reduced high temperature reverse leakage; Increased reliability
against thermal runaway failure in high temperature operation.
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
INFORMATION
ADVANCED NEW PRODUCT
Description and Applications
The SDM2U30CSP is a 30-volt 2A Schottky Barrier Rectifier that is
optimized for low forward voltage drop and low leakage current,
housed in a compact chip scale package (CSP) that occupies only
1.28mm
2
board space with low profile. The low thermal resistance
enables designers to meet design challenges of increasing efficiency
whilst at the same time reducing board space. It is ideally suited for
use in portable applications as a:
Blocking Diode
Boost Diode
Switching Diode
Reverse Protection Diode
Mechanical Data
Case: X3-WLB1608-2
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiAu Bump. Solderable per MIL-STD-202, Method
208
e4
Polarity: Cathode Dot
Weight: 0.001 grams (Approximate)
Pin #1
Cathode
Notch
Device Schematic
Anode
Cathode
Ordering Information
(Note 4)
Part Number
SDM2U30CSP-7B
SDM2U30CSP-7
Notes:
Case
X3-WLB1608-2
X3-WLB1608-2
Packaging
10,000/Tape & Reel
5,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. SDM2U30CSP-7B uses carrier tapes
with 2mm pocket-to- pocket pitch; SDM2U30CSP-7 uses carrier tapes with 4mm pocket-to-pocket pitch.
Marking Information
Pi
n 1
X2= Product Type Marking Code
YM=Date Code Marking
Y or Y = Year (ex: E = 2017)
M=Month (ex: 9= September)
Dot Denotes Cathode Pin
X
Date Code Key
Year
Code
Month
Code
X2
YM
2014
B
2015
C
Feb
2
Mar
3
Apr
4
2016
D
May
5
Jun
6
2017
E
Jul
7
2018
F
Aug
8
Sep
9
2019
G
Oct
O
Nov
N
2020
H
Dec
D
May 2017
© Diodes Incorporated
Jan
1
SDM2U30CSP
Document number: DS36600 Rev. 10 - 2
1 of 4
www.diodes.com
SDM2U30CSP
P
Maximum Ratings
(@T
A
= +25° unless otherwise specified.)
C,
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Average Rectified Output Current
Symbol
V
RRM
I
O
I
FRM
I
FSM
Value
30
2.0
4.2
20
Unit
V
A
A
A
INFORMATION
ADVANCED NEW PRODUCT
Repetitive Peak Forward Current
(Pulse Wave = 1 Sec, Duty Cycle = 66%)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Thermal Characteristics
Characteristic
Typical Thermal Resistance Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
R
θJA
T
J
, T
STG
Value
155
-55 to +150
Unit
°
C/W
°
C
Electrical Characteristics
Characteristic
Forward Voltage Drop
Reverse Current (Note 6)
Junction Capacitance
Notes:
(@T
A
= +25° unless otherwise specified.)
C,
Symbol
V
F
I
R
C
J
Min
—
—
—
—
Typ
0.38
0.45
—
110
Max
0.42
0.48
150
—
Unit
V
µA
pF
I
F
= 1.0A
I
F
= 2.0A
V
R
= 30V
V
R
= 4V, f = 1.0MHz
Test Condition
5. Device mounted on FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
10
T
A
= 150°
C
100000
T
A
= 150°
C
10000
I
R
, LEAKAGE CURRENT (µ
A)
T
A
= 125°
C
T
A
= 85°
C
1
T
A
= 125°
C
1000
100
0.1
T
A
= 25°
C
10
1
0.1
0.01
T
A
= -55°
C
T
A
= 85°
C
0.01
T
A
= 25°
C
0.001
T
A
= -55°
C
0.0001
0
100
200
300
400
500
600
700
0.001
0
10
20
V
R
, REVERSE VOLTAGE (V)
Figure 2 Typical Reverse Characteristics
30
V
F
, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 1 Typical Forward Characteristics
SDM2U30CSP
Document number: DS36600 Rev. 10 - 2
2 of 4
www.diodes.com
May 2017
© Diodes Incorporated
SDM2U30CSP
P
1000
f = 1MHz
INFORMATION
ADVANCED NEW PRODUCT
C
T
, JUNCTION CAPACITANCE (pF)
100
10
0
5
10
15
20
25
V
R
, REVERSE VOLTAGE (V)
Figure 3 Typical Junction Capacitance
30
Package Outline Dimensions
(Note 7)
Please see http://www.diodes.com/package-outlines.html for the latest version.
A1
A
Seating Plane
D
R=0.10
b1
b
E
X3-WLB1608-2
Dim
Min
Max Typ
A
0.250 0.300 0.275
A1
-
0.015
-
b
-
-
0.600
b1
-
-
0.600
D
1.57 1.63 1.60
E
0.77 0.83 0.80
K
-
-
0.282
L1
0.25 0.35 0.30
L2
0.90 1.00 0.95
All Dimensions in mm
L1
K
L2
Note 7
:
Device side walls are electrically active bare silicon. Avoid contact of solder or flux on the side walls during the PCB assembly process.
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
.
X2
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.385
1.035
1.622
0.690
X
X1
SDM2U30CSP
Document number: DS36600 Rev. 10 - 2
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May 2017
© Diodes Incorporated
SDM2U30CSP
P
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com
INFORMATION
ADVANCED NEW PRODUCT
SDM2U30CSP
Document number: DS36600 Rev. 10 - 2
4 of 4
www.diodes.com
May 2017
© Diodes Incorporated