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SEAF-30-01-L-04-1-RA-GP

Board Connector, 120 Contact(s), 4 Row(s), Male, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator

器件类别:连接器    连接器   

厂商名称:SAMTEC

厂商官网:http://www.samtec.com/

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器件参数
参数名称
属性值
厂商名称
SAMTEC
Reach Compliance Code
compliant
主体宽度
0.312 inch
主体深度
0.592 inch
连接器类型
BOARD CONNECTOR
联系完成配合
AU ON NI
联系完成终止
TIN OVER NICKEL
触点性别
MALE
触点材料
PHOSPHOR BRONZE
触点模式
RECTANGULAR
触点电阻
17.1 mΩ
耐用性
100 Cycles
绝缘体颜色
BLACK
绝缘体材料
LIQUID CRYSTAL POLYMER (LCP)
制造商序列号
SEAF
插接触点节距
0.05 inch
安装选项1
LOCKING
安装方式
RIGHT ANGLE
安装类型
BOARD
连接器数
ONE
PCB行数
4
装载的行数
4
最高工作温度
125 °C
最低工作温度
-55 °C
PCB接触模式
RECTANGULAR
电镀厚度
10u inch
极化密钥
POLARIZED HOUSING
额定电流(信号)
2.1 A
参考标准
UL
可靠性
COMMERCIAL
端子节距
1.27 mm
端接类型
SURFACE MOUNT
触点总数
120
Base Number Matches
1
文档预览
REVISION Y
"H" REF (SEE TABLE 3)
"M" REF
SEAF-XX-XX-X-XX-X-RA-XX-TR
No OF POSITIONS
-20,-30,-40,-50
(PER ROW)
LEAD STYLE
-01
"A"
DO NOT
SCALE FROM
THIS PRINT
PACKAGING
-TR: TAPE & REEL
(STANDARD PACKAGING)
(SEE NOTE 4 & 7)
.522 13.26 (TYP)
TO WAFER
C
PLATING SPECIFICATION
-S: SELECTIVE GOLD,
30µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-S-X)
-L: LIGHT SELECTIVE GOLD,
10µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-L-X)
No OF ROWS
-04,-06,*-08,*-10
(* = SEE NOTE 8)
"A"
.592 15.04
REF
"F" REF
C
L
.060 1.52
REF
OPTIONS
-GP: GUIDE POST HOLE
-LP: LATCH POST
(USE WITH SEAC ONLY)
(-06 ROW ONLY)
(NOT AVAILABLE WITH -GP OPTION)
-K: KAPTON PAD
RIGHT ANGLE
-RA
SOLDER COMPOSITION
C
& STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-1)
-2: 95.5% TIN / 3.8 SILVER / 0.7% COPPER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-2)
"G" REF
"B" REF
"A"
C
.0500 1.270 (TYP)
(TOL NON-ACCUM)
C
"G"
PIN 04
.050 1.27 REF
.241 6.12
REF
.035 0.89 REF
.100 2.54 REF
.140±.007 3.55±0.18
C
C
C
L
.0500 1.270 (TYP)
"N"±.007 (SEE SECTION E-E)
(SEE NOTE 9)
"D"
C
L
C
C
PIN 01
"G"
(SEE SHT. 2)
.025 0.64
REF. (TYP)
"E" (REF)(ALIGNMENT PIN CENTERS)
PIN 01
.044 1.12
REF
.315 7.99
REF
(A-PIN C )
L
'J'
.044 1.12
NOTES:
"E"
"E"
PIN 04
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSH-OUT FORCE: .50 LBS[2.2N].
3. INSPECT DIMENSION AT FIRST POSITION WAFER LOCATION ONLY, FIRST AND LAST PIN.
4. ONLY FULL REEL QUANTITIES ARE SHIPPED ON A REEL WITH LEADER AND TRAILER.
5. NOTE DELETED
6. NOTE DELETED
7. ATTACH LABEL "SEAX-0001" TO EACH TAPE & REEL PACKAGE.
8. ON -08 & -10 ROW ASSEMBLIES, SEE FIG 10, SHEET 5 FOR CAT FIXTURE VIEW.
9. CHECK DIMENSION ON FIRST AND LAST ROW OF TAILS.
10. A 20~30°C TEMPERATURE DIFFERENCE MAY EXIST BETWEEN THIS HIGH-DENSITY
COMPONENT AND THE BOARD SURFACE DURING REFLOW. SAMTEC RECOMMENDS
A THERMAL STUDY BE PERFORMED TO UNDERSTAND THE TEMPERATURE GRADIENTS YOU
MAY EXPERIENCE.
11. SOME RELAXATION/WARPING OF THE BACK STRAP IS ACCEPTABLE AFTER PROCESSING.
12. SEE SHEET 5 FOR PROCESSING INFORMATION.
13. VOID PATTERN MAY VARY BY ROW AND END OPTION.
(SEAF-20-01-X-04-X-RA-GP)
(SOME DETAIL OMITTED FOR CLARITY)
FIG 1
.034 0.86 REF
SEE NOTE 13
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP COLOR: BLACK
CONTACT: PHOS BRONZE .006 THICK
SEAF-RA ASSEMBLY
DWG. NO.
DESCRIPTION:
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
1
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION Y
.020 0.51 REF
.008 0.20
REF
WT-XX-XX-T
(SEE TABLE 2, SHEET 1)
.036 0.92 REF
.036
- .006
0.91
- 0.15
C
+.005
+0.13
.050 1.27 (TYP)
.140 3.55 REF
"N" REF
(SEE TABLE 1, SHT 1)
.0185±.0030
[0.470 0.076]
(TYP)
.050 1.27
REF
SECTION "E"-"E"
SCALE 6 : 1
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
SEAF-XX-01-RA-XX-XX
(SEE TABLE 2, SHEET 1)
'F'
.314 7.99
C
+.008
+0.20
.059
1.51
- .005
- 0.13
C
.050 1.27
(TYP)
.085 2.16
.172 4.38
.017 0.43 REF
.301 7.65
REF
.312 7.91
REF
"C"
(SEE TABLE 2, SHT 1)
C
C
L
OF SOLDER
TAILS
.040 1.02 REF
.173 4.38 (TYP)
C
.025 0.64 REF (TYP)
SECTION "A"-"A"
SCALE 6 : 1
DETAIL 'J'
SCALE 8 : 1
"C" REF
VIEW "G"-"G"
.039 0.98 REF
.006
.002
- .003
0.051
- 0.08
(SEE NOTE 3)
C
+.002
+0.05
.009 0.23 REF
PROPRIETARY NOTE
C
.140 3.55 (SEE NOTE 9)
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SEAF-RA ASSEMBLY
(SEAF-20-01-X-04-X-RA-GP SHOWN)
(FILL FIRST WAFER TO DIMENSIONS SHOWN)
IN-PROCESS VIEW
SHEET SCALE: 2:1
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
2
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION Y
C
.904 22.95 (.924[23.47] MAX )
(AFTER PROCESSING-SEE NOTE 11)
.904 22.95 (.924[23.47] MAX)
C
(AFTER PROCESSING-SEE NOTE 11)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
"D"
.592 15.04
REF
.522 13.26 (TYP)
TO WAFER
C
.822 20.88 (TYP)
TO WAFER
C
.822 20.88 (TYP)
TO WAFER
C
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
"H" REF
(SEE TABLE 3, SHT 1)
"H" REF
(SEE TABLE 3, SHT 1)
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
"D"
"H" REF
(SEE TABLE 3, SHT 1)
.541 13.74
REF
C
L
(SEAF-20-01-X-04-X-RA SHOWN)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 2
(SEAF-20-01-X-10-X-RA SHOWN)
(SAME AS FIG 4 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 9
.704 17.87 (.724[18.39] MAX)
C
(AFTER PROCESSING-SEE NOTE 11)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
"B"
.100 2.54
(TYP)
.612 15.53
REF
.622 15.80 (TYP)
TO WAFER
C
SECTION "D"-"D"
SCALE 2 : 1
FIG 4
.059 1.49
C
"B"
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
"H" REF
(SEE TABLE 3, SHT 1)
SEE NOTE 13
.100 2.54
(TYP)
.412 10.45
REF
(SEAF-20-01-X-10-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
.341 8.66
REF
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
(SEAF-20-01-X-06-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 3
.059 1.49
C
DO NOT SCALE DRAWING
SHEET SCALE: 1:1
SEAF-RA ASSEMBLY
SECTION "B"-"B"
SCALE 2 : 1
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
3
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION Y
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
"C"
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
.804 20.41 (.824[20.93] MAX)
(AFTER PROCESSING-SEE NOTE 11)
C
(SEAF-20-01-X-08-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
.722 18.34 (TYP)
TO WAFER
C
FIG 5
.100 2.54
(TYP)
"C"
"H" REF
(SEE TABLE 3, SHT 1)
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
.512 12.99
REF
.441 11.20
REF
SECTION "C"-"C"
SCALE 2 : 1
.059 1.49
C
.692 17.58
REF
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
.622 15.80 (TYP)
TO WAFER
C
WT-44-01-N
SEAF-XX-XX-RA-XX-LP
(SEE TABLE 2, SHEET 1)
"G"
(SEE TABLE 3, SHT 1)
"H" REF
(SEE TABLE 3, SHT 1)
1.123 28.52 REF
.186 4.72
C
"D"
(SEE TABLE 1, SHT 1)
"J"
(SEE TABLE 3, SHT 1)
C
C
.140 3.56
REF
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
(SEAF-30-01-X-06-X-RA-LP)
(SOME DETAIL OMITTED FOR CLARITY)
(SAME AS FIG 3 EXCEPT AS SHOWN)
FIG 6
DO NOT SCALE DRAWING
SHEET SCALE: 1:1
SEAF-RA ASSEMBLY
SHEET
4
OF
5
SEAF-XX-XX-X-XX-X-RA-XX-TR
BY:
C. PIERCE
12/15/2007
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION Y
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
"L"
"Q"±.02 [0.5]
"K" 0.02[0.5]
"P"
DOT APPLICATOR-KAPTON TAPE: USE
-04 ROW: K-DOT-.295-.406-.005
-06 ROW: K-DOT-.295-.406-.005
-08 ROW: K-DOT-.649-.737-.010
-10 ROW: K-DOT-.649-.737-.010
(USE K-DOT-.XXX-.XXX-.XXX)
(SEAF-20-01-X-04-X-RA-GP-K)
FIG 8
-K OPTION
CAT-SEAF-XX-XX-RA PROCESSING FIXTURE-SEE TABLE 9,
FOR SPECIFIC FIXTURE NUMBER.
NOTE:
FIG 8, DIMENSION "R" INDICATES CONNECTOR/FIXTURE HEIGHT ON PCB.
TO GUARANTEE ENOUGH REFLOW OVEN WORKING SPACE, DIMENSION "R",
PCB THICKNESS, AND THE HEIGHT OF THE COMPONENTS ON THE OPPOSITE
SIDE OF THE BOARD NEED TO BE CONSIDERED.
"R"
(BEFORE PROCESSING HEIGHT)
FIG 10
SEAF-RA PROCESSING FIXTURE
(USE CAT-SEAF-XX-XX-RA FIXTURE)
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
AFTER APPLYING BACKSTRAP -
HEAT STACK IN THIS AREA TO MAKE PERMANENT
(SEE TABLE 8)
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
FIG 11
HEAT STAKING BACKSTRAP
SEAF-RA ASSEMBLY
SEAF-XX-XX-X-XX-X-RA-XX-TR
BY:
C. PIERCE
12/15/2007
SHEET
5
OF
5
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
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