SFN
www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
FEATURES
•
•
•
•
•
•
•
•
Wire bondable
Chip size: 0.020" square
Case: 0202
Resistance range: 20
Ω
to 510 kΩ
Resistor material: Nichrome
Oxidized silicon substrate
125 mW power
Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Product may not be to scale
The SFN series resistor chips offer a combination of
nichrome stability, good power rating and small size.
The SFNs are manufactured using Vishay Electro-Films (EFI)
sophisticated thin film equipment and manufacturing
technology. The SFNs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032, class H or
class K.
APPLICATIONS
Vishay EFI SFN resistor chips are widely used in hybrid
packages where space is limited. Designed with capacity to
handle substantial power loads, they also have the benefit of
nichrome stability.
Recommended for hermetic environments where die is not
exposed to moisture.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
20 to 510K
± 0.1
± 10, ± 25, ± 50, ± 100, ± 250
UNIT
Ω
%
ppm/°C
Tightest Standard Tolerance Available
0.1 %
± 10 ppm/°C
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
20
Ω
50
Ω
100
Ω
1 kΩ
510 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
to 250 kΩ
< 100
Ω
or > 251 kΩ
Stability, 1000 h, +125 °C, 50 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, +150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at +70 °C (Derated to Zero at +175 °C)
5 x Rated Power Short-Time Overload, +25 °C, 5 s
Revision: 25-Mar-2021
VALUE
-35 typ.
-20 typ.
± 0.25 max.
ΔR/R
-55 to +125
± 0.25 max.
ΔR/R
± 0.5 max.
ΔR/R
200
10
12
min.
100 max.
0.125
± 0.25 max.
ΔR/R
UNIT
dB
%
°C
%
%
V
Ω
V
W
%
Document Number: 61025
1
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SFN
www.vishay.com
DIMENSIONS
in inches
0.014
0.008
0.020
Vishay Electro-Films
0.004
0.004
0.004
0.020
0.004
0.004
TYPICAL RANGE
20
:
to 35
:
TYPICAL RANGE
20
:
to 55
:
TYPICAL RANGE
56
:
to 7.4 k:
TYPICAL RANGE
7.5 k: to 510 k:
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
Chip Thickness
Chip Size
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
VALUE
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
0.020" x 0.020" ± 0.003" (0.51 mm x 0.51 mm ± 0.076 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Nichrome (passivation optional)
0.004" x 0.004" (0.10 mm x 0.10 mm)
2
15 kÅ minimum gold (Al optional)
None, lapped semiconductor silicon (Au back optional)
GLOBAL PART NUMBER INFORMATION
Global Part Number: SFN50000FKANHWS
Global Part Number Description: SFN 5K 1 % 100 ppm Al None H WS
S
F
N
5
0
0
0
0
F
K
A
N
H
W
S
MODEL
SFN
20 x 20
size
NiCr on
silicon
RESISTANCE
First 4 digits are
significant figures
of resistance
RESISTANCE
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
TOLERANCE
CODE
(%)
B
= 0.1
C
= 0.25
D
= 0.5
F
= 1.0
G
= 2.0
J
= 5.0
K
= 10
TCR
(ppm/°C)
B
= ± 10
E
= ± 25
C
= ± 50
K
= ± 100
M
= ± 250
TERMINATION
G
= Au
A
= Al
BACK
METAL
G
= Au
N
= none
VISUAL
CLASS
H
= class H
K
= class K
PACKAGING
CODE
WS
= waffle pack
100 min., 1 mult.
FW
= full wafer
Revision: 25-Mar-2021
Document Number: 61025
2
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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Revision: 01-Jan-2021
1
Document Number: 91000