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SFN8A2262FAPLF13

Array/Network Resistor, Isolated, Thin Film, 0.4W, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1616, SON, ROHS COMPLIANT

器件类别:无源元件    电阻器   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
1598100516
包装说明
SON, ROHS COMPLIANT
Reach Compliance Code
compliant
YTEOL
0
其他特性
PRECISION
元件功耗
0.1 W
第一元件电阻
22600 Ω
JESD-609代码
e3
制造商序列号
SFN08A
安装特点
SURFACE MOUNT
网络类型
ISOLATED
元件数量
1
功能数量
4
端子数量
8
最高工作温度
150 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
TR, 13 INCH
额定功率耗散 (P)
0.4 W
额定温度
70 °C
电阻器类型
ARRAY/NETWORK RESISTOR
尺寸代码
1616
表面贴装
YES
技术
THIN FILM
温度系数
50 ppm/°C
温度系数跟踪
5 ppm/°C
端子面层
Matte Tin (Sn)
端子形状
WRAPAROUND
容差
1%
工作电压
100 V
文档预览
MODELS
SFN08A, SFN08B
Isolated and bussed circuits
Thin film resistor network
RoHS compliant available
FEATURES
Precision Nichrome Resistors on Silicon
Industry Standard Packaging
Ratio Tolerances
TCR Tracking Tolerances
Passivation coating provides protection in humid environments
8 pad SON
1
4mm square with 0.8 mm pitch (JEDEC MO-229D)
< ± 0.05%
< ± 5 ppm/°C
SCHEMATICS
ELECTRICAL
2
Standard Resistance Range
3
Resistor Tolerances
Ratio Tolerances
TCR
Operating Temperature Range
Interlead Capacitance
Insulation Resistance
Maximum Operating Voltage
Noise, Maximum (MIL-STD-202, Method 308)
Resistor Power Rating at 70°C
1K ohms to 100K ohms (Isolated)
1K ohms to 30K ohms (Bussed)
± 0.25%
± 0.05%
Reference TCR table
-55°C to +125°C
< 2 pF
= 10,000 Megohms
100 Vdc or v PR
-25 dB
0.1 Watts
1
2
3
Small outline no lead (SO N) package is also referred to as quad flat no lead (QFN) or dual flat no lead (DFN) packages.
Specifications subject to change without notice.
E96 codes available.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 6, 2009
page 1 of 3
BI technologies
SFN08A, SFN08B
PACKAGE POWER, WATTS @ 70°C
4
SFN08
0.4
POWER DERATING CURVE
ENVIRONMENTAL (MIL-R-83401)
Thermal Shock plus Power Conditioning
Short Time Overload
Terminal Strength
Moisture Resistance
Mechanical Shock
Vibration
Low Temperature Operation
High Temperature Exposure
Resistance to Solder Heat
Marking Permanency
Flammability
Storage Temperature Range
∆R
0.25%
∆R
0.1%
∆R
0.1%
∆R
0.2%
∆R
0.25%
∆R
0.25%
∆R
0.05%
∆R
0.1%
∆R
0.1%
Per MIL-STD-202, Method 215
UL-94V-0 Rated
-55°C to +125°C
MECHANICAL
Pad Plating
Pad Material
Pad Coplanarity
Substrate Material
Resistor Material
Body Material
80/20 Tin Lead (non-RoHS compliant)
100 matte Tin (RoHS compliant)
Copper Alloy
0.003” (0.08 mm)
Silicon
Passivated Nichrome
Molded Epoxy
4
Maximum power per resistor @ 70°C is 100 mW, not to exceed package power.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 6, 2009
page 2 of 3
BI technologies
SFN08A, SFN08B
ORDERING INFORMATION
5
S FN 8 A XXXX F S LF 13
Model Series:
S = Passivated Nichrome
on Silicon
Package Type:
Pad Count:
Circuit Type:
A=Isolated
B=Bussed
Bulk packaging option:
7=7” Tape & Reel
13 = 13" Tape & Reel
Lead Finish:
No Code=SnPb
LF=Lead Free (RoHS)
TCR Code:
Tolerance Code:
Resistance code:
PACKAGE TYPE
Package Codes
SON
FN
Package Size
4mm x 4mm
Pad count
8
Mechanical Outline
MO-229D
RESISTANCE
First 3 digits are significant. Fourth digit denotes number of trailing zeros. For values less than 100, use “R” to denote a
decimal point. Example, 51 and 10000 ohms are coded as 51R0 and 1002 respectively. Standard values follow E96.
RESISTANCE TOLERANCE
Accuracy Code at 25°C
Absolute Resistance Tolerances (%)
Ratio Tolerances (R1 Ref) (%)
CA
± 0.25
± 0.05
CB
± 0.25
± 0.1
D
± 0.5
± 0.1
FA
± 1.0
± 0.05
F
± 1.0
± 1.0
G
± 2.0
N/A
J
± 5.0
N/A
TEMPERATURE COEFFICIENT OF RESISTANCE (TCR)
TCR Code (-55°C to 125°C)
Absolute (ppm/°C)
Tracking (R1 Ref) (ppm/°C)
Q
± 25
±5
P
± 50
±5
S
± 100
N/A
L
± 200
N/A
BULK PACKAGING OPTIONS
Quantity
Model + Pad Count
SFN08
7” Reel
1000
13” Reel
3000
5
Contact customer service for custom designs and features.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 6, 2009
page 3 of 3
BI technologies
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