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SIHU6N62E-GE3

MOSFET 620V Vds 30V Vgs IPAK (TO-251)

器件类别:半导体    分立半导体   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
Vishay(威世)
产品种类
Product Category
MOSFET
RoHS
Details
技术
Technology
Si
安装风格
Mounting Style
Through Hole
封装 / 箱体
Package / Case
TO-251-3
Number of Channels
1 Channel
Transistor Polarity
N-Channel
Vds - Drain-Source Breakdown Voltage
620 V
Id - Continuous Drain Current
6 A
Rds On - Drain-Source Resistance
900 mOhms
Vgs th - Gate-Source Threshold Voltage
4 V
Vgs - Gate-Source Voltage
30 V
Qg - Gate Charge
17 nC
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 150 C
Configuration
Single
Pd-功率耗散
Pd - Power Dissipation
78 W
Channel Mode
Enhancement
系列
Packaging
Bulk
高度
Height
6.22 mm
长度
Length
6.73 mm
宽度
Width
2.39 mm
Fall Time
16 ns
Rise Time
10 ns
工厂包装数量
Factory Pack Quantity
3000
Typical Turn-Off Delay Time
22 ns
Typical Turn-On Delay Time
12 ns
单位重量
Unit Weight
0.011640 oz
文档预览
SiHU6N62E
www.vishay.com
Vishay Siliconix
E Series Power MOSFET
PRODUCT SUMMARY
V
DS
(V) at T
J
max.
R
DS(on)
max. at 25 °C (Ω)
Q
g
max. (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
34
4
8
Single
700
0.9
FEATURES
• Low figure-of-merit (FOM) R
on
x Q
g
Low input capacitance (C
iss
)
Reduced switching and conduction losses
Ultra low gate charge (Q
g
)
Avalanche energy rated (UIS)
Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
D
IPAK
(TO-251)
D
G
G
D
S
S
N-Channel MOSFET
Server and telecom power supplies
Switch mode power supplies (SMPS)
Power factor correction power supplies (PFC)
Lighting
- High-intensity discharge (HID)
- Fluorescent ballast lighting
• Industrial
- Welding
- Induction heating
- Motor drives
- Battery chargers
- Renewable energy
- Solar (PV inverters)
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
IPAK (TO-251)
SiHU6N62E-GE3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain
Current
a
b
SYMBOL
V
DS
V
GS
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
I
D
I
DM
E
AS
P
D
T
J
, T
stg
T
J
= 125 °C
for 10 s
dV/dt
LIMIT
620
± 30
6
4
12
0.63
88
78
-55 to +150
37
12
300
UNIT
V
A
W/°C
mJ
W
°C
V/ns
°C
Linear Derating Factor
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Drain-Source Voltage Slope
Reverse Diode dV/dt
d
Soldering Recommendations (Peak Temperature)
c
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 28.2 mH, R
g
= 25
Ω,
I
AS
= 2.5 A.
c. 1.6 mm from case.
d. I
SD
I
D
, dI/dt = 100 A/μs, starting T
J
= 25 °C.
S15-0291-Rev. B, 23-Feb-15
Document Number: 91548
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHU6N62E
www.vishay.com
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
SYMBOL
R
thJA
R
thJC
TYP.
-
-
MAX.
62
1.6
UNIT
°C/W
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage (N)
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Effective Output Capacitance, Energy
Related
a
Effective Output Capacitance, Time
Related
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Input Resistance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
S
I
SM
V
SD
t
rr
Q
rr
I
RRM
T
J
= 25 °C, I
F
= I
S
= 3 A,
dI/dt = 100 A/μs, V
R
= 400 V
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
ΔV
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
C
o(er)
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 20 V
V
GS
= ± 30 V
V
DS
= 620 V, V
GS
= 0 V
V
DS
= 496 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 3 A
V
DS
= 30 V, I
D
= 3 A
620
-
2
-
-
-
-
-
-
-
-
-
-
-
0.76
-
-
-
-
-
0.78
1.8
578
36
4
31
87
17
4
8
12
10
22
16
1.3
-
-
4
± 100
±1
1
10
0.90
-
-
-
-
V
V/°C
V
nA
μA
μA
Ω
S
V
GS
= 0 V,
V
DS
= 100 V,
f = 1 MHz
pF
-
-
34
-
-
24
20
44
32
-
Ω
ns
nC
V
DS
= 0 V to 496 V, V
GS
= 0 V
C
o(tr)
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
g
f = 1 MHz, open drain
V
DD
= 496 V, I
D
= 3 A,
V
GS
= 10 V, R
g
= 9.1
Ω
V
GS
= 10 V
I
D
= 3 A, V
DS
= 496 V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.9
190
1.3
11
7
A
12
1.2
-
-
-
V
ns
μC
A
G
S
T
J
= 25 °C, I
S
= 3 A, V
GS
= 0 V
Notes
a. C
oss(er)
is a fixed capacitance that gives the same energy as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
.
b. C
oss(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
.
S15-0291-Rev. B, 23-Feb-15
Document Number: 91548
2
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHU6N62E
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Vishay Siliconix
15
I
D
, Drain-to-Source Current (A)
R
DS(on)
, Drain-to-Source
On Resistance (Normalized)
12
9
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
7V
6V
BOTTOM 5 V
TOP
3
T
J
= 25 °C
2.5
2
1.5
1
0.5
0
- 60 - 40 - 20 0
I
D
= 3 A
V
GS
= 10 V
6
3
0
0
5
10
15
20
25
30
20 40 60 80 100 120 140 160
V
DS
, Drain-to-Source Voltage (V)
Fig. 1 - Typical Output Characteristics
T
J
, Junction Temperature (°C)
Fig. 4 - Normalized On-Resistance vs. Temperature
8
I
D
, Drain-to-Source Current (A)
Capacitance (pF)
6
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
7V
6V
BOTTOM 5 V
TOP
T
J
= 150 °C
10 000
1000
C
oss
100
C
iss
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
Shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
4
2
10
C
rss
0
0
5
10
15
20
25
30
1
0
100
200
300
400
500
600
V
DS
, Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
V
DS
, Drain-to-Source Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
15
T
J
= 25 °C
24
V
GS
,
Gate-to-Source
Voltage (V)
I
D
, Drain-to-Source Current (A)
12
20
16
12
8
4
0
V
DS
= 496 V
V
DS
= 310 V
V
DS
= 124 V
9
T
J
= 150 °C
6
3
V
DS
= 32 V
0
0
5
10
15
20
25
0
5
10
15
20
25
30
V
GS
, Gate-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
S15-0291-Rev. B, 23-Feb-15
Q
g
, Total
Gate
Charge (nC)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Document Number: 91548
3
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHU6N62E
www.vishay.com
Vishay Siliconix
6
I
SD
, Reverse Drain Current (A)
10
5
T
J
= 150 °C
T
J
= 25 °C
I
D
, Drain Current (A)
4
3
2
1
1
V
GS
= 0 V
0.1
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
25
50
75
100
125
150
V
SD
,
Source-Drain
Voltage (V)
Fig. 7 - Typical Source-Drain Diode Forward Voltage
T
C
, Case Temperature (°C)
Fig. 9 - Maximum Drain Current vs. Case Temperature
100
Operation in this Area
Limited by R
DS(on)
775
I
DM
= Limited
750
10
I
D
, Drain Current (A)
100 μs
1
S
Limited by R
D (on)
*
V
DS
, Drain-to-Source
Breakdown Voltage (V)
725
700
675
650
625
600
1 ms
0.1
T
C
= 25 °C
T
J
= 150 °C
Single
Pulse
0.01
1
10 ms
BVDSS Limited
10
100
1000
V
DS
, Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is
specified
575
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
T
J
, Junction Temperature (°C)
Fig. 10 - Temperature vs. Drain-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single
Pulse
0.01
0.0001
0.001
0.01
0.1
1
Pulse Time (s)
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case
S15-0291-Rev. B, 23-Feb-15
Document Number: 91548
4
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHU6N62E
www.vishay.com
Vishay Siliconix
R
D
10 V
Q
G
V
DS
V
GS
R
G
D.U.T.
+
-
V
DD
Q
GS
Q
GD
10 V
Pulse width
1 µs
Duty factor
0.1 %
V
G
Charge
Fig. 12 - Switching Time Test Circuit
Fig. 16 - Basic Gate Charge Waveform
Current regulator
Same type as D.U.T.
50 kΩ
12 V
V
DS
90 %
0.2 µF
0.3 µF
+
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
V
GS
3 mA
D.U.T.
-
V
DS
Fig. 13 - Switching Time Waveforms
I
G
I
D
Current sampling resistors
L
Vary t
p
to obtain
required I
AS
R
G
V
DS
Fig. 17 - Gate Charge Test Circuit
D.U.T
I
AS
+
-
V
DD
10 V
t
p
0.01
Ω
Fig. 14 - Unclamped Inductive Test Circuit
V
DS
t
p
V
DD
V
DS
I
AS
Fig. 15 - Unclamped Inductive Waveforms
S15-0291-Rev. B, 23-Feb-15
Document Number: 91548
5
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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