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SII101CT80V360

Consumer Circuit, PQFP80, TQFP-80

器件类别:其他集成电路(IC)    消费电路   

厂商名称:Silicon image

厂商官网:http://www.siliconimage.com/

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器件参数
参数名称
属性值
厂商名称
Silicon image
零件包装代码
QFP
包装说明
TFQFP,
针数
80
Reach Compliance Code
unknown
商用集成电路类型
CONSUMER CIRCUIT
JESD-30 代码
S-PQFP-G80
长度
12 mm
端子数量
80
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
TFQFP
封装形状
SQUARE
封装形式
FLATPACK, THIN PROFILE, FINE PITCH
认证状态
Not Qualified
座面最大高度
1.15 mm
最大压摆率
150 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
表面贴装
YES
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
12 mm
Base Number Matches
1
文档预览
SiI100/SiI101 Datasheet
Silicon Image, Inc.
Version 1.1
June 1998
SiI/DS-0001-B
Silicon Image, Inc.
SiI/DS-0001-B
Copyright Notice
This manual is copyrighted by Silicon Image, Inc. Do not reproduce, transform to any other format, or send/transmit any part
of this documentation without the express written permission of Silicon Image, Inc.
Trademark Acknowledgment
PanelLink
TM
and TMDS
TM
are trademarks of Silicon Image, Inc.
VESA® a registered trademark of Video Electronics Standards Association.
is
All other trademarks are the property of their respective holders.
Disclaimer
This document is provided for technical information for the user. Silicon Image, Inc. reserves the right to modify the
information in this document as necessary. The customer should make sure that it has the most recent data sheet version.
Silicon Image, Inc. holds no responsibility for any errors that may appear in this document. Customers should take
appropriate action to ensure their use of the products does not infringe upon any patents. Silicon Image, Inc. respects valid
patent rights of third parties and does not infringe upon or assist others to infringe upon such rights.
Revision 1.0
2
Subject to Change without Notice
Silicon Image, Inc.
SiI/DS-0001-B
Revision History
Revision
1.0
1.1
Date
8/97
6/98
Comment
Version 1.0 of SiI100/101 Datasheet
Version 1.1 of SiI100/101 Datasheet
Revision 1.0
3
Subject to Change without Notice
Silicon Image, Inc.
SiI/DS-0001-B
(This page left intentionally blank)
Revision 1.0
4
Subject to Change without Notice
Silicon Image, Inc.
SiI/DS-0001-B
Table of Contents
Revision History ..........................................................................................................................................................................3
Table of Contents.........................................................................................................................................................................5
List of Figures ..............................................................................................................................................................................6
List of Tables ...............................................................................................................................................................................7
1. Feature Review ........................................................................................................................................................................8
2. Product Summary.....................................................................................................................................................................9
3. Order Information ..................................................................................................................................................................10
4.
PanelLink™
Technology Overview........................................................................................................................................11
5. SiI100 Overview ....................................................................................................................................................................12
5.1 Data Input ........................................................................................................................................................................13
6. SiI101 Overview ....................................................................................................................................................................14
6.1 Output Modes...................................................................................................................................................................16
6.1.1 One Pixel Per Clock Mode........................................................................................................................................16
6.1.2 Two Pixels Per Clock Mode .....................................................................................................................................16
6.2 Data Mapping (TFT) - VESA®
Compatible.......................................................................................................................17
6.2.1 One Pixel Per Clock Data Mapping ..........................................................................................................................17
6.2.2 Two Pixels Per Clock Data Mapping........................................................................................................................18
6.3 Output Clock Modes for 24-bit DSTN.............................................................................................................................19
6.4 Data Mapping (DSTN) - VESA®
Compatible .................................................................................................................20
TM
7. TMDS Interconnect Layer .................................................................................................................................................22
7.1 Voltage Swing Control (EXT_SWING) ..........................................................................................................................23
7.2 Termination Control (EXT_RES) ....................................................................................................................................23
8. PLL Synchronization .............................................................................................................................................................24
9. SiI100 Pin Description...........................................................................................................................................................25
9.1 SiI100 Pin Diagram..........................................................................................................................................................25
9.2 SiI100 Pins Grouped by Functionality .............................................................................................................................26
9.2.1 SiI100 Input Pin Description.....................................................................................................................................26
9.2.2 SiI100 Test Output Pin Description ..........................................................................................................................27
9.2.3 SiI100 Synchronization Pin Description ...................................................................................................................27
9.2.4 SiI100 Configuration Pin Description.......................................................................................................................27
9.2.5 SiI100 Analog Data Pin Description.........................................................................................................................27
9.2.6 SiI100 Power and Ground Pin Description ...............................................................................................................28
9.3 SiI100 Pins Listed Numerically .......................................................................................................................................29
10. SiI101 Pin Description.........................................................................................................................................................31
10.1 SiI101 Pin Diagram........................................................................................................................................................31
10.2 SiI101 Pins Grouped by Functionality ...........................................................................................................................32
10.2.1 SiI101 Data Output Pin Description .......................................................................................................................32
10.2.2 SiI101 Test Output Pin Description ........................................................................................................................33
10.2.3 SiI101 Synchronization Pin Description .................................................................................................................33
10.2.4 SiI101 Analog Data Pin Description.......................................................................................................................33
10.2.5 SiI101 Configuration Pin Description.....................................................................................................................33
10.2.6 SiI101 Power and Ground Pin Description .............................................................................................................34
10.3 SiI101 Pins Listed Numerically .....................................................................................................................................35
11. Electrical Specifications.......................................................................................................................................................38
11.1 Absolute Conditions.......................................................................................................................................................38
11.2 DC Specifications ..........................................................................................................................................................39
11.3 AC Specifications ..........................................................................................................................................................40
11.4 Timing Diagrams ...........................................................................................................................................................41
11.4.1 SiI100 Input Timing................................................................................................................................................42
11.4.2 SiI101 Output Timing .............................................................................................................................................43
12. Package Dimensions ............................................................................................................................................................44
12.1 SiI100 Package Dimensions.............................................................................................................................................1
12.2 SiI101 Package Dimensions...........................................................................................................................................45
Revision 1.0
5
Subject to Change without Notice
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参数对比
与SII101CT80V360相近的元器件有:SII100CT64V351。描述及对比如下:
型号 SII101CT80V360 SII100CT64V351
描述 Consumer Circuit, PQFP80, TQFP-80 Consumer Circuit, PQFP64, TQFP-64
厂商名称 Silicon image Silicon image
零件包装代码 QFP QFP
包装说明 TFQFP, TFQFP,
针数 80 64
Reach Compliance Code unknown unknown
商用集成电路类型 CONSUMER CIRCUIT CONSUMER CIRCUIT
JESD-30 代码 S-PQFP-G80 S-PQFP-G64
长度 12 mm 10 mm
端子数量 80 64
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFQFP TFQFP
封装形状 SQUARE SQUARE
封装形式 FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified
座面最大高度 1.15 mm 1.15 mm
最大压摆率 150 mA 150 mA
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V
表面贴装 YES YES
温度等级 COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 QUAD QUAD
宽度 12 mm 10 mm
Base Number Matches 1 1
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