Fast reponse time: typically less than 1ps from 0 volts to
V
BR
min.
♦
Typical I
D
less than 1µA above 10V
♦
High temperature soldering: 250°C/10 seconds
at terminals
♦
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
0.060 (1.52)
0.030 (0.76)
0.320 (8.13)
0.305 (7.75)
MECHANICAL DATA
0.008 (0.203)
MAX.
Dimensions in inches and (millimeters)
Case:
JEDEC DO-214AB (SMC) molded plastic over
passivated junction
Terminals:
Solder plated solderable per MIL-STD-750,
Method 2026
Polarity:
For uni-directional types: Color band
denotes positive end (cathode)
Standard Packaging:
12mm tape (EIA STD RS-481)
Weight:
0.003 ounces, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified
SYMBOLS
VALUE
UNIT
Peak Pulse Power Dissipation on 10/1000µs
waveform
(NOTES 1, 2, Fig. 1)
Peak Pulse Current on 10/1000µs
waveform
(NOTE 1, Fig. 3)
Power Dissipation on Infinite Heatsink, T
A
=50°C
Peak Forward Surge Current, 10ms Single Half Sine-wave,
Undirectional Only
Max. Junction Temperature
Storage Temperature Range
Thermal Resistance Junction to Ambient Air
(NOTE 2)
Thermal Resistance Junction to Leads
P
PPM
I
PPM
P
M(AV)
I
FSM
T
J
T
STG
R
ΘJA
R
ΘJL
Minimum 1500
See Table 1
6.5
200
150
-65 to +175
75
15
Watts
Amps
Watts
Amps
°C
°C
°C/W
°C/W
NOTES:
(1) Non-repetitive current pulse, per Fig. 3 and derated above T
A
=25°C per Fig. 2
(2) Mounted on 5.0mm
2
(.013mm thick) land areas.
(3) Measured on 8.3ms single half sine-wave or equivalent squarewave, duty cycle 4 pulses per minute maximum.
1/21/99
ELECTRICAL CHARACTERISTICS RATINGS at (T
A
=25ºC unless otherwise noted)
Device
Marking Code
Uni
SM15T6V8A
SM15T7V5A
SM15T10A
SM15T12A
SM15T15A
SM15T18A
SM15T22A
SM15T24A
SM15T27A
SM15T30A
SM15T33A
SM15T36A
SM15T39A
SM15T68A
SM15T100A
SM15T150A
SM15T200A
SM15T220A
GDE7
GDK7
GDT7
GDX7
GEG7
GEM7
GET7
GEV7
GEX7
GFE7
GFG7
GFK7
GFM7
GGG7
GGV7
GHK7
GHR7
GHR8
Bi
GDE7
BDK7
BDT7
BDX7
GEG7
BEM7
BET7
GEV7
BEX7
BFE7
GFG7
BFK7
BFM7
GGG7
GGV7
GHK7
GHR7
GHR8
Standoff Leakage
Voltage Current
(3)
V
RM
I
RM
@ V
RM
(Volts)
5.80
6.40
8.55
10.2
12.8
15.3
18.8
20.5
23.1
25.6
28.2
30.8
33.3
58.1
85.5
128
171
188
(µA)
1000
500
10.0
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
5.00
Breakdown Voltage
V
BR
@ I
T
(2)
(Volts)
Min
6.45
7.13
9.50
11.4
14.3
17.1
20.9
22.8
25.7
28.5
31.4
34.2
37.1
64.6
95.0
143
190
209
Max
7.14
7.88
10.5
12.6
15.8
18.9
23.1
25.2
28.4
31.5
34.7
37.8
41.0
71.4
105
158
210
231
Test
Current
I
T
(mA)
10
10
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Clamping Voltage Clamping Voltage
V
C
@ I
PP
V
C
@ I
PP
10/1000µs
8/20µs
(Volts)
10.5
11.3
14.5
16.7
21.2
25.2
30.6
33.2
37.5
41.5
45.7
49.9
53.9
92.0
137
207
274
328
(Amps)
143
132
103
90.0
71.0
59.5
49.0
45.0
40.0
36.0
33.0
30.0
28.0
16.3
11.0
7.20
5.50
4.60
(Volts)
13.4
14.5
18.6
21.7
27.2
32.5
39.3
42.8
48.3
53.5
59.0
64.3
69.7
121
178
265
353
388
(Amps)
746
690
538
461
368
308
254
234
207
187
169
156
143
83
56
38
28
26
5.7
6.1
7.3
7.8
8.4
8.8
9.2
9.4
9.6
9.7
9.8
9.9
10.0
10.4
10.6
10.8
10.8
10.8
α
T
Max
10
-4
/°C
Type
(1)
NOTES:
(1) For bi-directional devices add “C” for ±10% and “CA” for ±5% tolerance of V
BR
(2) V
BR
measured after I
T
applied for 300µs square wave pulse
(3) For bipolar devices with V
R
=10 Volts or under, the I
T
limit is doubled
APPLICATION NOTES
A 1500W (SMC) device is normally selected when the threat of transients is from lightning induced transients, conducted via external leads or I/O lines. It is also used to
protect against switching transients induced by large coils or industrial motors. Source impedance at component level in a system is usually high enough to limit the current
within the peak pulse current (I
PP
) rating of this series. In an overstress condition, the failure mode is a short circuit.
RECOMMENDED PAD SIZES
The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for
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嵌入式系统
