05138
SMF05C
thru
Only One Name Means ProT
ek’Tion™
SMF24C
ST
ANDARD CAPACIT
ANCE TVS ARRA
Y
APPLICA
TIONS
✔
✔
✔
✔
Notebook Computers
Cellular Phone Base Stations
Personnal Digital Assistant (PDA)
Digital Cameras
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
100 Watts Peak Pulse Power per Line (tp=8/20µs)
✔
Monolithic Design
✔
Available in Multiple Voltage Types Ranging From 5V to 24V
✔
Protect 4 Lines Bidirectional and 5 Lines Unidirectional
✔
ESD Protection > 25 kilovolts
✔
Low Clamping Voltage
✔
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
✔
✔
✔
Molded JEDEC SC-70-6L Package
Weight 7 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔
Flammability rating UL 94V-0
✔
8mm Tape and Reel Per EIA Standard 481
✔
Marking: Marking Code & Pin One Defined By DOT on Package
SC-70-6L
PIN CONFIGURA
TIONS
1
2
3
6
5
4
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
100
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
DEVICE
MARKING
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 5A
V
C
VOLTS
9.8
-
-
-
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
(See Note 1)
V
WM
VOLTS
SMF05C
SMF12C
SMF15C
SMF24C
05C
12C
15C
24C
5.0
12.0
15.0
24.0
@ 1mA
V
(BR)
VOLTS
6.0
13.3
16.7
26.7
@8/20µs
V
C
@ I
PP
12.0V @ 9.0A
23.8V @ 4.2A
33.3V @ 3.0A
55.5V @ 1.8A
@V
WM
I
D
µA
5
1
1
1
@0V, 1 MHz
C
J
pF
60
30
25
20
Note 1:
Pins 1, 3, 4, 5 or 6 to pin 2.
10,000
P
PP
- Peak Pulse Power - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
I
PP
- Peak Pulse Current - % of I
PP
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
e
-t
100W 8/20µs Waveform
100
t
d
= t I /2
PP
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
05138.R8 6/05
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GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
% Of Rated Power
60
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
16
V
C
- Clamping Voltage - Volts
FIGURE 4
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT
12
8
4
0
0
2
4
6
I
PP
- Peak Pulse Current - Amps
8
10
05138.R8 6/05
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SMF24C
APPLICA
TION NOTE
The SMFC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides both
unidirectional and bidirectional protection, with a surge capability of 100 Watts P
PP
per line for an 8/20µs waveshape and ESD protection > 25
kilovolts.
UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
The SMFC Series provides up to four (4) lines of protection in a common-mode
configuration as depicted in Figure 1.
Circuit connectivity is as follows:
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
✔
✔
✔
✔
✔
Line 1 is connected to Pin 1.
Line 2 is connected to Pin 3.
Line 3 is connected to Pin 4.
Line 4 is connected to Pin 6.
Pin 2 is connected to ground.
I/O PORT
LINE 1
LINE 2
3
2
1
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 2)
The SMFC Series provides up to five (5) lines of protection in a differential-mode
configuration as depicted in Figure 2.
Circuit connectivity is as follows:
✔
✔
✔
✔
✔
✔
Line 1 is connected to Pin 1.
Line 2 is connected to Pin 3.
Line 3 is connected to Pin 4.
Line 4 is connected to Pin 5.
Line 5 is connected to Pin 6.
Pin 2 is not connected.
4
5
6
LINE 3
LINE 4
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
Figure 2 - Bidirectional Configuration
Differential-Mode I/O Port Protection
✔
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
The path length between the TVS device and
the protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
I/O PORT
LINE 1
LINE 2
3
2
1
✔
✔
✔
4
5
6
LINE 3
LINE 4
LINE 5
✔
05138.R8 6/05
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
D
E
SC70-6L
6
5
4
K
0° - 8°
PACKAGE DIMENSIONS
DIM
MILLIMETERS
MIN
MAX
1.90
1.15
0.80
0.15
0.65 BSC
1.30 BSC
0.80
0.08
2.00
0
0.26
2.15
1.35
1.00
0.30
-
-
1.10
0.25
2.20
0.10
0.46
3
2
1
L
J
B
M
INCHES
MIN
MAX
0.074
0.045
0.031
0.006
0.0255 BSC
0.0512 BSC
0.031
0.003
0.078
0
0.010
0.084
0.055
0.040
0.012
-
-
0.043
0.010
0.086
0.004
0.018
F
A
G
C
A
B
C
D
E
F
G
J
K
L
M
NOTES
MOUNTING PAD
TYPICAL
DIM Millimeters Inches
1
2
3
4
5
6
7
0.50
1.30
0.65
1.72
0.60
1.11
2.33
0.020
0.051
0.026
0.068
0.024
0.044
0.092
4
1. Dimensioning and tolerances per ANSI Y14.5M, 1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal burrs.
3
2
1
5
6
7
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape, i.e.,
SMF005C-T7.
3. Suffix-LF = Lead-Free, Pure Tin Plating, i.e.,
SMF05C-LF-T7.
Outline & Dimensions: Rev 3 - 9/05, 06019
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
tmax
0.25
2.25 ± 0.10 2.34 ± 0.10 1.22 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
E
Top cover tape
A0
K0
B0
Pin 1
Indicated
by Dot
F
W
P
User Direction of Feed
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
05138.R8 6/05
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