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SMP08FP

8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6us ACQUISITION TIME, PDIP16, PLASTIC, DIP-16

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Rochester Electronics
零件包装代码
DIP
包装说明
PLASTIC, DIP-16
针数
16
Reach Compliance Code
unknown
标称采集时间
3.6 µs
放大器类型
SAMPLE AND HOLD CIRCUIT
最大模拟输入电压
17 V
最小模拟输入电压
-17 V
最大下降率
0.02 V/s
JESD-30 代码
R-PDIP-T16
JESD-609代码
e0
长度
20.13 mm
湿度敏感等级
NOT APPLICABLE
负供电电压上限
-8.5 V
标称负供电电压 (Vsup)
-5 V
功能数量
8
端子数量
16
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT APPLICABLE
认证状态
COMMERCIAL
采样并保持/跟踪并保持
SAMPLE
座面最大高度
5.33 mm
供电电压上限
8.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT APPLICABLE
宽度
7.62 mm
文档预览
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SMP08–SPECIFICATIONS
(@ V
ELECTRICAL CHARACTERISTICS
Parameter
Linearity Error
Buffer Offset Voltage
Hold Step
Droop Rate
Output Source Current
Output Sink Current
Output Voltage Range
LOGIC CHARACTERISTICS
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
DYNAMIC PERFORMANCE
2
Acquisition Time
3
Hold Mode Settling Time
Channel Select Time
Channel Deselect Time
Inhibit Recovery Time
Slew Rate
Capacitive Load Stability
Analog Crosstalk
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio
Supply Current
Symbol
V
OS
V
HS
∆V
CH
/∆t
I
SOURCE
I
SINK
= +5 V, V
SS
= –5 V, DGND = 0 V, R
L
= No Load, T
A
= –40 C to +85 C for SMP08F,
unless otherwise noted)
DD
Conditions
–3 V
V
IN
+3 V
T
A
= +25°C, V
IN
= 0 V
–40°C
T
A
+85°C, V
IN
= 0 V
V
IN
= 0 V, T
A
= +25°C to +85°C
V
IN
= 0 V, T
A
= –40°C
T
A
= +25°C, V
IN
= 0 V
V
IN
= 0 V
1
V
IN
= 0 V
1
R
L
= 20 kΩ
Min
Typ
0.01
2.5
3.5
2.5
2
Max
10
20
4
5
20
+3.0
1.2
0.5
–3.0
2.4
Units
%
mV
mV
mV
mV
mV/s
mA
mA
V
V
V
µA
µs
µs
ns
ns
ns
V/µs
pF
dB
dB
mA
mA
V
INH
V
INL
I
IN
t
AQ
t
H
t
CH
t
DCS
t
IR
SR
V
IN
= 2.4 V
T
A
= +25°C, –3 V to +3 V to 0.1%
To
±
1 mV of Final Value
0.5
3.6
1
90
45
90
3
500
–72
60
75
4
5
0.8
1
7
<30% Overshoot
–3 V to +3 V Step
PSRR
I
DD
V
S
=
±
5 V to
±
6 V
T
A
= +25°C
–40°C
T
A
+85°C
7.5
9.5
ELECTRICAL CHARACTERISTICS
Parameter
Linearity Error
Buffer Offset Voltage
Hold Step
Droop Rate
Output Source Current
Output Sink Current
Output Voltage Range
LOGIC CHARACTERISTICS
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
DYNAMIC PERFORMANCE
2
Acquisition Time
3
Hold Mode Settling Time
Channel Select Time
Channel Deselect Time
Inhibit Recovery Time
Slew Rate
Capacitive Load Stability
Analog Crosstalk
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio
Supply Current
Symbol
V
OS
V
HS
∆V
CH
/∆t
I
SOURCE
I
SINK
(@ V
DD
= +12 V, V
SS
= 0 V, DGND = 0 V, R
L
= No Load, T
A
= –40 C to +85 C for SMP08F,
unless otherwise noted)
Conditions
60 mV
V
IN
10 V
T
A
= +25°C, V
IN
= 6 V
–40°C
T
A
+85°C, V
IN
= 6 V
V
IN
= 6 V, T
A
= +25°C to +85°C
V
IN
= 6 V, T
A
= –40°C
T
A
= +25°C, V
IN
= 6 V
V
IN
= 6 V
1
V
IN
= 6 V
1
R
L
= 20 kΩ
R
L
= 10 kΩ
Min
Typ
0.01
2.5
3.5
2.5
2
1.2
0.5
0.06
0.06
2.4
V
IN
= 2.4 V
T
A
= +25°C, 0 V to 10 V to 0.1%
–40°C
T
A
+85°C
To
±
1 mV of Final Value
0.5
3.5
3.75
1
90
45
90
4
500
–72
75
6.0
8.0
0.8
1
4.25
6.00
Max
10
20
4
5
20
10.0
9.5
Units
%
mV
mV
mV
mV
mV/s
mA
mA
V
V
V
V
µA
µs
µs
µs
ns
ns
ns
V/µs
pF
dB
dB
mA
mA
V
INH
V
INL
I
IN
t
AQ
t
H
t
CH
t
DCS
t
IR
SR
R
L
= 20 kΩ
4
<30% Overshoot
0 V to 10 V Step
10.8 V
V
DD
13.2 V
T
A
= +25°C
–40°C
T
A
+85°C
3
PSRR
I
DD
60
8.0
10.0
NOTES
1
Outputs are capable of sinking and sourcing over 20 mA but offset is guaranteed at specified load levels.
2
All input control signals are specified with t
r
= t
f
= 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.
3
This parameter is guaranteed without test.
4
Slew rate is measured in the sample mode with 0 V to 10 V step from 20% to 80%.
Specifications subject to change without notice.
–2–
REV. D
SMP08
ABSOLUTE MAXIMUM RATINGS
ORDERING GUIDE
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
LOGIC
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
V
IN
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
V
OUT
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .
±
20 mA
(Not Short-Circuit Protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type
16-Pin Plastic DIP (P)
16-Pin SOIC (S)
JA
*
JC
Model
SMP08FP
SMP08FS
Temperature
Range
–40°C to +85°C
–40°C to +85°C
Package
Description
Plastic DIP
SO-16
Package
Option
N-16
R-16A
PIN CONNECTIONS
CH
4
OUT 1
CH
6
OUT 2
INPUT 3
CH
7
OUT 4
16 V
DD
15 CH
2
OUT
14 CH
1
OUT
Units
°C/W
°C/W
76
92
33
27
13 CH
0
OUT
TOP VIEW
CH
5
OUT 5 (Not to Scale) 12 CH
3
OUT
INH 6
V
SS
7
DGND 8
11 A CONTROL
10 B CONTROL
9 C CONTROL
SMP08
JA
is specified for worst case mounting conditions, i.e.,
θ
JA
is specified for device
in socket for plastic DIP package;
θ
JA
is specified for device soldered to printed
circuit board for SO package.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP08 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. D
–3–
SMP08–Typical Performance Characteristics
1000
V
DD
= +12V
V
SS
= 0V
V
I N
= +5V
R
L
= 10kΩ
3
1800
1600
V
DD
= +12V
V
SS
= 0V
T
A
= +125
°
C
NO LOAD
1400
2
100
DROOP RATE – mV/s
DROOP RATE – mV/s
1
DROOP RATE – mV/s
10
0
1200
–1
V
DD
= +12V
V
SS
= 0V
–2
T
A
= +25
°
C
NO LOAD
–3
2 3
4
5
6 7
8
0 1
INPUT VOLTAGE – Volts
1000
1
800
0.1
–55 –35 –15
600
9
10
0
1
2
3
4 5
6
7 8
INPUT VOLTAGE – Volts
9
10
5
25 45 65 85 105 125
TEMPERATURE –
°
C
Figure 1. Droop Rate vs. Temperature
Figure 2. Droop Rate vs. Input Voltage
Figure 3. Droop Rate vs. Input Voltage
2
1
HOLD STEP – mV
V
DD
= +12V
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
0
2
V
DD
= +12V
V
SS
= 0V
V
I N
= +5V
NO LOAD
7
1
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
6
HOLD STEP – mV
0
SLEW RATE – V/µs
–SR
5
+SR
4
–1
–1
–2
–2
–3
–3
3
10
–4
0
1
2
3
4 5
6
7 8
INPUT VOLTAGE – Volts
9
10
–4
–55
–35
–15
5
25
45
TEMPERATURE –
°
C
65
85
11
12
13
14
15
V
DD
– Volts
16
17
18
Figure 4. Hold Step vs. Input Voltage
Figure 5. Hold Step vs. Temperature
Figure 6. Slew Rate vs. V
DD
4
2
OFFSET VOLTAGE – mV
0
–2
–4
–6
–8
–10
0
1
2
R
L
= 20kΩ
R
L
= 10kΩ
R
L
=
V
DD
= +12V
V
SS
= 0V
OFFSET VOLTAGE – mV
20
15
10
5
0
–5
–10
–15
–20
V
DD
= +12V
V
SS
= 0V
NO LOAD
OFFSET VOLTAGE – mV
T
A
= +85
°
C
4
2
0
–2
–4
–6
–8
–10
R
L
= 10kΩ
R
L
=
V
DD
= +12V
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
T
A
= –40
°
C
NO LOAD
R
L
= 20kΩ
R
L
=
R
L
= 10kΩ
R
L
= 20kΩ
3
4 5
6
7 8
INPUT VOLTAGE – Volts
9
10
0
1
2
3
4 5
6
7 8
INPUT VOLTAGE – Volts
9
10
0
1
2
3
4 5
6
7 8
INPUT VOLTAGE – Volts
9
10
Figure 7. Offset Voltage vs. Input
Voltage
Figure 8. Offset Voltage vs. Input
Voltage
Figure 9. Offset Voltage vs. Input
Voltage
–4–
REV. D
查看更多>
参数对比
与SMP08FP相近的元器件有:SMP08FS-REEL、SMP08FPZ、SMP08FSZ、SMP08FS。描述及对比如下:
型号 SMP08FP SMP08FS-REEL SMP08FPZ SMP08FSZ SMP08FS
描述 8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6us ACQUISITION TIME, PDIP16, PLASTIC, DIP-16 8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6 us ACQUISITION TIME, PDSO16, SOIC-16 8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6 us ACQUISITION TIME, PDIP16, PLASTIC, DIP-16 8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6 us ACQUISITION TIME, PDSO16, SOIC-16 8 CHANNEL, SAMPLE AND HOLD AMPLIFIER, 3.6 us ACQUISITION TIME, PDSO16, SOIC-16
是否无铅 含铅 含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 不符合 符合 符合 不符合
零件包装代码 DIP SOIC DIP SOIC SOIC
包装说明 PLASTIC, DIP-16 SOP, DIP, SOP, SOP,
针数 16 16 16 16 16
Reach Compliance Code unknown unknown unknown unknown unknown
标称采集时间 3.6 µs 3.6 µs 3.6 µs 3.6 µs 3.6 µs
放大器类型 SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT
最大模拟输入电压 17 V 17 V 17 V 17 V 17 V
最小模拟输入电压 -17 V -17 V -17 V -17 V -17 V
最大下降率 0.02 V/s 0.02 V/s 0.02 V/s 0.02 V/s 0.02 V/s
JESD-30 代码 R-PDIP-T16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e0 e0 e3 e3 e0
长度 20.13 mm 9.9 mm 20.13 mm 9.9 mm 9.9 mm
湿度敏感等级 NOT APPLICABLE NOT APPLICABLE NOT APPLICABLE 1 1
负供电电压上限 -8.5 V -8.5 V -8.5 V -8.5 V -8.5 V
标称负供电电压 (Vsup) -5 V -5 V -5 V -5 V -5 V
功能数量 8 8 8 8 8
端子数量 16 16 16 16 16
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP DIP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT APPLICABLE 220 NOT APPLICABLE 260 240
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
采样并保持/跟踪并保持 SAMPLE SAMPLE SAMPLE SAMPLE SAMPLE
座面最大高度 5.33 mm 1.75 mm 5.33 mm 1.75 mm 1.75 mm
供电电压上限 8.5 V 8.5 V 8.5 V 8.5 V 8.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD TIN LEAD MATTE TIN MATTE TIN TIN LEAD
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING
端子节距 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT APPLICABLE 30 NOT APPLICABLE 40 30
宽度 7.62 mm 3.9 mm 7.62 mm 3.9 mm 3.9 mm
Base Number Matches - 1 1 1 -
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