描述 |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo-Pwr Config Mult- Function Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
Logic Gates Lo PWR Config Multi Funct Gate |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
SOT-23 |
SOT |
SOIC |
BGA |
SOIC |
SOIC |
SOT-23 |
SOT-23 |
SOT-23 |
包装说明 |
LSSOP, TSOP6,.11,37 |
VSOF, FL6,.047,20 |
TSSOP, TSSOP6,.08 |
VFBGA, BGA6,2X3,20 |
TSSOP, TSSOP6,.08 |
TSSOP, TSSOP6,.08 |
LSSOP, TSOP6,.11,37 |
LSSOP, TSOP6,.11,37 |
LSSOP, TSOP6,.11,37 |
针数 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
Reach Compliance Code |
unknow |
unknow |
unknow |
compli |
unknow |
unknow |
unknow |
unknow |
unknow |
系列 |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
JESD-30 代码 |
R-PDSO-G6 |
R-PDSO-F6 |
R-PDSO-G6 |
R-XBGA-B6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
JESD-609代码 |
e4 |
e4 |
e4 |
e1 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
2.9 mm |
1.6 mm |
2 mm |
1.4 mm |
2 mm |
2 mm |
2.9 mm |
2.9 mm |
2.9 mm |
负载电容(CL) |
30 pF |
30 pF |
30 pF |
30 pF |
30 pF |
30 pF |
30 pF |
30 pF |
30 pF |
逻辑集成电路类型 |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
最大I(ol) |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
0.0017 A |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
LSSOP |
VSOF |
TSSOP |
VFBGA |
TSSOP |
TSSOP |
LSSOP |
LSSOP |
LSSOP |
封装等效代码 |
TSOP6,.11,37 |
FL6,.047,20 |
TSSOP6,.08 |
BGA6,2X3,20 |
TSSOP6,.08 |
TSSOP6,.08 |
TSOP6,.11,37 |
TSOP6,.11,37 |
TSOP6,.11,37 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
包装方法 |
TR |
TAPE AND REEL |
TR |
TAPE AND REEL |
TR |
TR |
TR |
TR |
TR |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
Prop。Delay @ Nom-Su |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
26.6 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
施密特触发器 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
座面最大高度 |
1.45 mm |
0.6 mm |
1.1 mm |
0.625 mm |
1.1 mm |
1.1 mm |
1.45 mm |
1.45 mm |
1.45 mm |
最大供电电压 (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
最小供电电压 (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
标称供电电压 (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
FLAT |
GULL WING |
BALL |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.95 mm |
0.5 mm |
0.65 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.95 mm |
0.95 mm |
0.95 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
BOTTOM |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
1.6 mm |
1.2 mm |
1.25 mm |
0.9 mm |
1.25 mm |
1.25 mm |
1.6 mm |
1.6 mm |
1.6 mm |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |