型号
- 型号
- 关键词
| 型号 | SN74HC175NP1 | 5962-01-238-5504 | SN74HC175N1 | SN54HC175FH |
|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC JBAR-KBAR FLIP-FLOP, FF/Latch | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-XQCC-N20 |
| 逻辑集成电路类型 | D FLIP-FLOP | JBAR-KBAR FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | QCCN |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 包装说明 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
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