型号
- 型号
- 关键词
| 型号 | SN74LVC2G79DCURG4 | SN74LVC2G79YZPR | SN74LVC2G79DCTR | SN74LVC2G79DCURE4 | SN74LVC2G79DCUR |
|---|---|---|---|---|---|
| 描述 | Dual Positive-Edge-Triggered D-Type Flip-Flop 8-VSSOP -40 to 125 | Dual Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85 | Dual Positive-Edge-Triggered D-Type Flip-Flop 8-SM8 -40 to 125 | Flip Flops DTyp Dual Pos Edge Triggered FlipFlop | Dual Positive-Edge-Triggered D-Type Flip-Flop 8-VSSOP -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | BGA | SOIC | SOIC | SOIC |
| 包装说明 | VSSOP, TSSOP8,.12,20 | VFBGA, BGA8,2X4,20 | LSSOP, SSOP8,.16 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| Factory Lead Time | 6 weeks | 1 week | 1 week | 1 week | 6 weeks |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G8 | R-XBGA-B8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e1 | e4 | e4 | e4 |
| 长度 | 2.3 mm | 1.9 mm | 2.95 mm | 2.3 mm | 2.3 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Su | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | 0.024 A | 0.032 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSSOP | VFBGA | LSSOP | VSSOP | VSSOP |
| 封装等效代码 | TSSOP8,.12,20 | BGA8,2X4,20 | SSOP8,.16 | TSSOP8,.12,20 | TSSOP8,.12,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR | TR | TR | TAPE AND REEL | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns |
| 传播延迟（tpd） | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.9 mm | 0.5 mm | 1.3 mm | 0.9 mm | 0.9 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | BALL | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 2 mm | 0.9 mm | 2.8 mm | 2 mm | 2 mm |
| 最小 fmax | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最大电源电流（ICC） | 0.005 mA | 0.005 mA | 0.005 mA | - | 0.005 mA |
