Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5553
Rev. 4, Apr 2012
MPC5553
Microcontroller Data Sheet
by: Microcontroller Division
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5553
microcontroller device. For functional characteristics,
refer to the
MPC5553/MPC5554 Microcontroller
Reference Manual.
Contents
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 6
3.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.4 EMI (Electromagnetic Interference) Characteristics 9
3.5 ESD (Electromagnetic Static Discharge) Characteris-
tics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.6 Voltage Regulator Controller (VRC) and Power-On
Reset (POR) Electrical Specifications . . . . . . . . . . 10
3.7 Power-Up/Down Sequencing . . . . . . . . . . . . . . . . 11
3.8 DC Electrical Specifications. . . . . . . . . . . . . . . . . . 15
3.9 Oscillator and FMPLL Electrical Characteristics . . 21
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 23
3.11 H7Fa Flash Memory Electrical Characteristics . . . 24
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.14 Fast Ethernet AC Timing Specifications . . . . . . . . 46
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 MPC5553 208 MAP BGA Pinout . . . . . . . . . . . . . .
4.2 MPC5553 324 PBGA Pinouts . . . . . . . . . . . . . . . .
4.3 MPC5553 416 PBGA Pinout . . . . . . . . . . . . . . . . .
4.4 MPC5553 208-Pin Package Dimensions . . . . . . .
4.5 MPC5553 324-Pin Package Dimensions . . . . . . .
4.6 MPC5553 416-Pin Package Dimensions . . . . . . .
50
50
51
51
55
57
59
1
Overview
The MPC5553 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers built on the
Power Architecture
embedded technology. This family
of parts has many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
The host processor core of this device complies with the
Power Architecture embedded category that is 100%
user-mode compatible (including floating point library)
with the original PowerPC instruction set. The embedded
architecture enhancements improve the performance in
embedded applications. The core also has additional
instructions, including digital signal processing (DSP)
instructions, beyond the original PowerPC instruction
set.
4
5
Revision History for the MPC5553 Data Sheet . . . . . . 61
5.1 Information Changed Between
Revisions 3.0 and 4.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
5.2 Information Changed Between
Revisions 2.0 and 3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
© Freescale Semiconductor, Inc., 2008-2012. All rights reserved.
Overview
The MPC5500 family of parts contains many new features coupled with high performance CMOS
technology to provide significant performance improvement over the MPC565.
The MPC5553 has two levels of memory hierarchy. The fastest accesses are to the 8-kilobytes (KB)
unified cache. The next level in the hierarchy contains the 64-KB on-chip internal SRAM and
1.5-megabytes (MB) internal flash memory. The internal SRAM and flash memory hold instructions and
data. The external bus interface is designed to support most of the standard memories used with the
MPC5xx family.
The complex input/output timer functions of the MPC5553 are performed by an enhanced time processor
unit (eTPU) engine. The eTPU engine controls 32 hardware channels. The eTPU has been enhanced over
the TPU by providing: 24-bit timers, double-action hardware channels, variable number of parameters per
channel, angle clock hardware, and additional control and arithmetic instructions. The eTPU is
programmed using a high-level programming language.
The less complex timer functions of the MPC5553 are performed by the enhanced modular input/output
system (eMIOS). The eMIOS’ 24 hardware channels are capable of single-action, double-action,
pulse-width modulation (PWM), and modulus-counter operations. Motor control capabilities include
edge-aligned and center-aligned PWM.
Off-chip communication is performed by a suite of serial protocols including controller area networks
(FlexCANs), enhanced deserial/serial peripheral interfaces (DSPIs), and enhanced serial communications
interfaces (eSCIs).
The MCU has an on-chip enhanced queued dual analog-to-digital converter (eQADC). The 324 and 416
packages have 40-channels.
The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration
and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset
control are also determined by the SIU. The internal multiplexer submodule (SIU_DISR)provides
multiplexing of eQADC trigger sources and external interrupt signal multiplexing.
The Fast Ethernet (FEC) module is a RISC-based controller that supports both 10 and 100 Mbps
Ethernet/IEEE® 802.3 networks and is compatible with three different standard MAC (media access
controller) PHY (physical) interfaces to connect to an external Ethernet bus. The FEC supports the 10 or
100 Mbps MII (media independent interface), and the 10 Mbps-only with a seven-wire interface, which
uses a subset of the MII signals. The upper 16-bits of the 32-bit external bus interface (EBI) are used to
connect to an external Ethernet device. The FEC contains built-in transmit and receive message FIFOs and
DMA support.
MPC5553 Microcontroller Data Sheet, Rev. 4
2
Freescale Semiconductor
Ordering Information
2
Ordering Information
M PC 5553 M ZP 80 R
Qualification status
Core code
Device number
Temperature range
Package identifier
Operating frequency (MHz)
Tape and reel status
Operating Frequency
Package Identifier
80 = 80 MHz
ZP = 416PBGA SnPb
112 = 112 MHz
VR = 416PBGA Pb-free
132 = 132 MHz
VF = 208MAPBGA SnPb
VM = 208MAPBGA Pb-free
ZQ = 324PBGA SnPb
VZ = 324PBGA Pb-free
Note:
Not all options are available on all devices. Refer to
Table 1.
Temperature Range
M = –40° C to 125° C
Tape and Reel Status
R = Tape and reel
(blank) = Trays
Qualification Status
P = Pre qualification
M = Fully spec. qualified, general market flow
S = Fully spec. qualified, automotive flow
Figure 1. MPC5500 Family Part Number Example
Unless noted in this data sheet, all specifications apply from T
L
to T
H
.
Table 1. Orderable Part Numbers
Freescale Part Number
MPC5553MVR132
MPC5553MVR112
MPC5553MVR80
MPC5553MVZ132
MPC5553MVZ112
MPC5553MVZ80
MPC5553MVM132
MPC5553MVM112
MPC5553MVM80
MPC5553MZP132
MPC5553MZP112
MPC5553MZP80
MPC5553MZQ132
MPC5553MZQ112
MPC5553MZQ80
MPC5553 324 package
Leaded (SnPb)
MPC5553 416 package
Leaded (SnPb)
MPC5553 208 package
Lead-free (Pb-free)
MPC5553 324 package
Lead-free (Pb-free)
MPC5553 416 package
Lead-free (Pb-free)
1
Speed (MHz)
Package Description
Nominal
132
112
80
132
112
80
132
112
80
132
112
80
132
112
80
Max.
3
(f
MAX
)
132
114
82
132
114
82
132
114
82
132
114
82
132
114
82
Operating Temperature
2
Min. (T
L
)
Max. (T
H
)
–40° C
125° C
–40° C
125° C
–40° C
125° C
–40° C
125° C
–40° C
125° C
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
3
Electrical Characteristics
Table 1. Orderable Part Numbers (continued)
Freescale Part
MPC5553MVF132
MPC5553MVF112
MPC5553MVF80
1
2
3
Number
1
Speed (MHz)
Package Description
Nominal
132
MPC5553 208 package
Leaded (SnPb)
112
80
Max.
3
(f
MAX
)
132
114
82
Operating Temperature
2
Min. (T
L
)
Max. (T
H
)
–40° C
125° C
All devices are PPC5553, rather than MPC5553 or SPC5553, until product qualifications are complete. Not all configurations are
available in the PPC parts.
The lowest ambient operating temperature is referenced by T
L
; the highest ambient operating temperature is referenced by T
H
.
Speed is the nominal maximum frequency. Max. speed is the maximum speed allowed including frequency modulation (FM).
82 MHz parts allow for 80 MHz system clock + 2% FM; 114 MHz parts allow for 112 MHz system clock + 2% FM; and132 MHz
parts allow for 128 MHz system clock + 2% FM.
3
Electrical Characteristics
This section contains detailed information on power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MCU.
3.1
Spec
1
2
4
5
6
7
8
9
10
11
12
Maximum Ratings
Table 2. Absolute Maximum Ratings
1
Characteristic
1.5 V core supply voltage
2
Flash program/erase voltage
Flash read voltage
SRAM standby voltage
Clock synthesizer voltage
3.3 V I/O buffer voltage
Voltage regulator control input voltage
Analog supply voltage (reference to V
SSA
)
I/O supply voltage (fast I/O pads)
3
I/O supply voltage (slow and medium I/O pads)
3
DC input voltage
4
V
DDEH
powered I/O pads
V
DDE
powered I/O pads
Analog reference high voltage (reference to V
RL
)
V
SS
to V
SSA
differential voltage
V
DD
to V
DDA
differential voltage
V
REF
differential voltage
V
RH
to V
DDA
differential voltage
V
RL
to V
SSA
differential voltage
Symbol
V
DD
V
PP
V
FLASH
V
STBY
V
DDSYN
V
DD33
V
RC33
V
DDA
V
DDE
V
DDEH
V
IN
Min.
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–1.0
5
–1.0
5
–0.3
–0.1
–V
DDA
–0.3
–5.5
–0.3
Max.
1.7
6.5
4.6
1.7
4.6
4.6
4.6
5.5
4.6
6.5
6.5
6
4.6
7
5.5
0.1
V
DD
5.5
5.5
0.3
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
13
14
15
16
17
18
V
RH
V
SS
– V
SSA
V
DD
– V
DDA
V
RH
– V
RL
V
RH
– V
DDA
V
RL
– V
SSA
MPC5553 Microcontroller Data Sheet, Rev. 4
4
Freescale Semiconductor
Electrical Characteristics
Table 2. Absolute Maximum Ratings
1
(continued)
Spec
19
20
21
22
23
24
25
26
27
28
Characteristic
V
DDEH
to V
DDA
differential voltage
V
DDF
to V
DD
differential voltage
V
SSSYN
to V
SS
differential voltage
V
RCVSS
to V
SS
differential voltage
Maximum DC digital input current
8
(per pin, applies to all digital pins)
4
Maximum DC analog input current
9
(per pin, applies to all analog pins)
Maximum operating temperature range
10
Die junction temperature
Storage temperature range
Maximum solder temperature
11
Lead free (Pb-free)
Leaded (SnPb)
Moisture sensitivity level
12
Symbol
V
DDEH
– V
DDA
V
DDF
– V
DD
V
SSSYN
– V
SS
V
RCVSS
– V
SS
I
MAXD
I
MAXA
T
J
T
STG
T
SDR
MSL
Min.
–V
DDA
–0.3
Max.
V
DDEH
0.3
Unit
V
V
V
RC33
to V
DDSYN
differential voltage spec has been moved to
Table 9
DC Electrical Specifications, Spec 43a.
–0.1
–0.1
–2
–3
T
L
–55.0
—
—
—
0.1
0.1
2
3
150.0
150.0
260.0
245.0
3
V
V
mA
mA
o
C
C
o
o
C
29
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2
1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150
o
C.
3
All functional non-supply I/O pins are clamped to V
SS
and V
DDE
, or V
DDEH
.
4
AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
6
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH
supplies, if the
maximum injection current specification is met (2 mA for all pins) and V
DDEH
is within the operating voltage specifications.
7
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE
supplies, if the maximum
injection current specification is met (2 mA for all pins) and V
DDE
is within the operating voltage specifications.
8
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9
Total injection current for all analog input pins must not exceed 15 mA.
10
Lifetime operation at these specification limits is not guaranteed.
11
Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12
Moisture sensitivity per JEDEC test method A112.
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
5
