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SPC5642AF2MLU1

32-bit Microcontrollers - MCU GPC5642AF2MLU1/LQFP176///

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厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Reach Compliance Code
compliant
ECCN代码
3A991.A.2
位大小
32
CPU系列
E200
JESD-30 代码
S-PQFP-G176
JESD-609代码
e3
湿度敏感等级
3
端子数量
176
最高工作温度
125 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装等效代码
QFP176,1.0SQ,20
封装形状
SQUARE
封装形式
FLATPACK
峰值回流温度(摄氏度)
260
电源
1.2 V
认证状态
Not Qualified
RAM(字节)
131072
ROM(单词)
2097152
ROM可编程性
FLASH
筛选级别
AEC-Q100
速度
150 MHz
最大压摆率
400 mA
标称供电电压
1.2 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
40
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
Base Number Matches
1
文档预览
Freescale Semiconductor
MPC5642A
Rev. 3.2, 12/2014
MPC5642A Microcontroller
Datasheet
This is the MPC5642A Datasheet set consisting of the following files:
• MPC5642A Datasheet
Addendum (MPC5642A_AD),
Rev. 1
• MPC5642A Datasheet
(MPC5642A),
Rev. 3.1
© Freescale Semiconductor, Inc., 2014. All rights reserved.
Freescale Semiconductor
Datasheet Addendum
MPC5642A_AD
Rev. 1, 12/2014
MPC5642A Microcontroller
Datasheet Addendum
This addendum describes corrections to the
MPC5642A
Microcontroller Datasheet,
order number MPC5642A.
For convenience, the addenda items are grouped by
revision. Please check our website at
http://www.freescale.com/powerarchitecture for the
latest updates.
The current version available of the
MPC5642A
Microcontroller Datasheet
is Revision 3.1.
Table of Contents
1
2
Addendum List for Revision 3.1 . . . . . . . . . . . . . . 2
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . 2
© Freescale Semiconductor, Inc., 2014. All rights reserved.
1
Addendum List for Revision 3.1
Table 1. MPC5642A Rev 3.1 Addendum
Location
Description
In “Temperature Sensor Electrical Characteristics” table, update the Min and Max value of
“Accuracy” parameter to -20
o
C and +20
o
C, respectively.
Section 3.11, “Temperature
Sensor Electrical
Characteristics”,
Page 77
2
Revision History
Table 2. Revision History Table
Rev. Number
1.0
Initial release.
Substantive Changes
Date of Release
12/2014
Table 2
provides a revision history for this datasheet addendum document.
MPC5642A_AD, Rev. 1
2
Freescale Semiconductor
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address:freescale.com/SalesTermsandConditions.
Freescale, the Freescale logo, AltiVec, C-5, CodeTest, CodeWarrior, ColdFire,
C-Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor
Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of
Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack,
ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge,
QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic
are trademarks of Freescale Semiconductor, Inc. All other product or service names
are the property of their respective owners.
© 2014 Freescale Semiconductor, Inc.
Document Number: MPC5642A_AD
Rev. 1
12/2014
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5642A
Rev. 3.1, 06/2012
MPC5642A
Qorivva MPC5642A
Microcontroller Data Sheet
208 MAPBGA
(17 x 17 mm)
176 LQFP
(24 × 24 mm)
324 TEPBGA
(23 × 23 mm)
• 150 MHz e200z4 Power Architecture core
– Variable length instruction encoding (VLE)
– Superscalar architecture with 2 execution units
– Up to 2 integer or floating point instructions per cycle
– Up to 4 multiply and accumulate operations per cycle
• Memory organization
– 2 MB on-chip flash memory with ECC and
read-while-write (RWW)
– 128 KB on-chip SRAM with standby functionality (32
KB) and ECC
– 8 KB instruction cache (with line locking), configurable
as 2- or 4-way
– 14 + 3 KB eTPU code and data RAM
– 4
4 crossbar switch (XBAR)
– 24-entry MMU
• Fail Safe Protection
– 16-entry Memory Protection Unit (MPU)
– CRC unit with 3 submodules
– Junction temperature sensor
• Interrupt
– Configurable interrupt controller (INTC) with
non-maskable interrupt (NMI)
– 64-channel eDMA
• Serial channels
– 3 eSCI modules
– 3 DSPI modules (2 of which support downstream Micro
Second Channel [MSC])
– 3 FlexCAN modules with 64 message buffers each
– 1 FlexRay module (V2.1) up to 10 Mbit/s w/dual or
single channel, 128 message objects, ECC
• 1 eMIOS
– 24 unified channels
• 1 eTPU2 (second generation eTPU)
—32 standard channels
– 1 reaction module (6 channels with 3 outputs per
channel)
2 enhanced queued analog-to-digital converters (eQADCs)
– Forty 12-bit input channels (multiplexed on 2 ADCs);
expandable to 56 channels with external multiplexers
– 6 command queues
– Trigger and DMA support
– 688 ns minimum conversion time
On-chip CAN/SCI Bootstrap loader with Boot Assist
Module (BAM)
Nexus: Class 3+ for core; Class 1 for eTPU
JTAG (5-pin)
Development Trigger Semaphore (DTS)
– EVTO pin for communication with external tool
Clock generation
– On-chip 4–40 MHz main oscillator
– On-chip FMPLL (frequency-modulated phase-locked
loop)
Up to 112 general purpose I/O lines
– Individually programmable as input, output or special
function
– Programmable threshold (hysteresis)
Power reduction modes: slow, stop, and standby
Flexible supply scheme
– 5 V single supply with external ballast
– Multiple external supply: 5 V, 3.3 V, and 1.2 V
© Freescale Semiconductor, Inc., 2009, 2010, 2012. All rights reserved.
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参数对比
与SPC5642AF2MLU1相近的元器件有:SPC5642AF2MVZ2R、SPC5642AF2MLU2、SPC5642AF2MVZ3、SPC5642AF2MVZ1。描述及对比如下:
型号 SPC5642AF2MLU1 SPC5642AF2MVZ2R SPC5642AF2MLU2 SPC5642AF2MVZ3 SPC5642AF2MVZ1
描述 32-bit Microcontrollers - MCU GPC5642AF2MLU1/LQFP176/// 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 2MB Flash, 120MHz, -40/+105degC, Automotive Grade, PBGA 324 32-bit Microcontrollers - MCU SPC5642AF2MLU2/LQFP176///STANDARD MARKING * TRAY D 32-bit Microcontrollers - MCU SPC5642AF2MVZ3/BGA324///STANDARD MARKING * TRAY DR 32-bit Microcontrollers - MCU GPC5642AF2MVZ1/BGA324///
是否无铅 不含铅 - 不含铅 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 符合
Reach Compliance Code compliant - compliant compliant compliant
ECCN代码 3A991.A.2 - 3A991.A.2 3A991.A.2 3A991.A.2
位大小 32 - 32 32 32
CPU系列 E200 - E200 E200 E200
JESD-30 代码 S-PQFP-G176 - S-PQFP-G176 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e3 - e3 e2 e2
湿度敏感等级 3 - 3 3 3
端子数量 176 - 176 324 324
最高工作温度 125 °C - 125 °C 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFP - QFP BGA BGA
封装等效代码 QFP176,1.0SQ,20 - QFP176,1.0SQ,20 BGA324,22X22,40 BGA324,22X22,40
封装形状 SQUARE - SQUARE SQUARE SQUARE
封装形式 FLATPACK - FLATPACK GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 - 260 260 260
电源 1.2 V - 1.2 V 1.2 V 1.2 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
RAM(字节) 131072 - 131072 131072 131072
ROM(单词) 2097152 - 2097152 2097152 2097152
ROM可编程性 FLASH - FLASH FLASH FLASH
筛选级别 AEC-Q100 - AEC-Q100 AEC-Q100 AEC-Q100
速度 150 MHz - 120 MHz 80 MHz 150 MHz
最大压摆率 400 mA - 360 mA 300 mA 400 mA
标称供电电压 1.2 V - 1.2 V 1.2 V 1.2 V
表面贴装 YES - YES YES YES
技术 CMOS - CMOS CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) - Matte Tin (Sn) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
端子形式 GULL WING - GULL WING BALL BALL
端子节距 0.5 mm - 0.5 mm 1 mm 1 mm
端子位置 QUAD - QUAD BOTTOM BOTTOM
处于峰值回流温度下的最长时间 40 - 40 40 40
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC - MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 - 1 1 1
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