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SSC-LUYT801

TOP LED DEVICE

厂商名称:SEOUL

厂商官网:http://www.seoulsemicon.com/

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*Customer:
SPECIFICATION
ITEM
MODEL
TOP LED DEVICE
SSC-LUYT801
[
Contents]
1. Features
-------------------------------------------------------------- 2
2. Application -------------------------------------------------------------- 2
3. Absolute Maximum Ratings ----------------------------------------------- 3
4. Electro-optical Characteristics --------------------------------------------- 3
5. Soldering Profile ------------------------------------------------------------- 4
6. Outline Dimension ------------------------------------------------- 5
7. Packing -------------------------------------------------------- 5
8. Reel Packing Structure -------------------------------------------- 6
9. Precaution for Use --------------------------------------------- 7
10. Characteristic Diagram ---------------------------------------- 8
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0.1)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-LUYT801
- 1/8 -
1. Features
White colored SMT package and colorless clear window
Material : AlGaInP
Suitable for all SMT assembly methods ; Suitable for all soldering methods
2. Application
Automotive
Electric appliance
Lightings
SSC-QP-0401-06(REV.0.1)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-LUYT801
- 2/8 -
3. Absolute Maximum Ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM
V
R
T
opr
T
stg
*2
(Ta=25℃)
Value
90
30
60
5
-40 ~ +100
-40 ~ +100
Unit
mW
mA
mA
V
ºC
ºC
*1 I
FM
conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10
Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product.
4. Electro-Optical Characteristics
Parameter
Forward Voltage
Reverse Current
Luminance Intensity
*1
Peak Wavelength
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle
*2
Symbol
V
F
I
R
I
V
Condition
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Min
1.8
-
90
-
584
-
-
Typ
2.1
-
130
593
587
15
120
Max
2.5
10
210
-
590
-
-
(Ta=25℃)
Unit
V
µA
mcd
nm
nm
nm
deg.
λ
P
λ
d
∆λ
2
θ
½
*1 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is
±10%
*2
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All measurements were made under the standardized environment of SSC
SSC-QP-0401-06(REV.0.1)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-LUYT801
- 3/8 -
5. Soldering Profile
(1) Reflow Soldering Conditions / Profile
Preliminary heat to be at maximum 150ºC for maximum 2 minutes.
Soldering heat to be at maximum 240ºC for maximum 10 seconds.
280
Device Surface Temperature [ C]
240
200
160
120
80
40
0
o
0
15
30
45
60
75
90
105 120 135 150 165 180 195
Soldering Times [sec]
(2) Lead-free solder
Preliminary heating to be at maximum 220°C for maximum 2 minutes.
Soldering heat to be at maximum 260°C for maximum 10 seconds.
280
Device Surface Temperature [ C]
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105 120 135 150 165 180 195
o
Soldering Times [sec]
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 300ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.0.1)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-LUYT801
- 4/8 -
6. Outline Dimension
( Tolerance:
±0.2,
Unit: mm )
7. Packing
1.75±0.1
2.0±0.05
4.0±0.1
1.55 ± 0.05
0.22±0.05
3.5±0.1
8±0.1
1.0±0.1
3.1±0.1
2.22±0.1
11.4
± 0.1
180
+0
-3
2.0
± 0.2
LABLE
13
±0.2
3.83±0.1
9.0
± 0.3
30°
10
22
60
( Tolerance:
±0.2,
Unit: mm )
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the
carrier tape at 10˚ angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SSC-QP-0401-06(REV.0.1)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
SSC-LUYT801
- 5/8 -
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