SATA 6Gb/s, compatible with SATA 3Gb/s and 1.5Gb/s
2.5”
Industry Standard Form Factor
1.8”
Industry Standard Form Factor
Height: 7.0 mm thick;
Height: 5 mm thick
Weight: 80GB - 240GB: 70 grams ± 2 grams
Weight: 80GB: 35 grams ± 2 gram
300GB – 1.6TB: 72 grams ± 2 grams
240-800GB: 37 grams ± 2 grams
M.2
2280-D5-BM; Height: 1.5 mm thick; Weight:11 grams ± 1 grams
2 million hours Mean Time Between Failures (MTBF)
Up to 880TB Written
24/7 operation
Read: 1.3 W Typical
0° C to 70° C
Meets the requirements of European Union (EU) RoHS Compliance Directives
Self-Monitoring, Analysis and Reporting Technology (S.M.A.R.T.) commands
To order, visit
intel.com/ssd
Write: 5.0 W Typical
Idle: 650 mW Typical
2.5”
80GB: up to 70,000 / 7,000 IOPS
120GB: up to 75,000 / 4,600 IOPS
160GB: up to 75,000 / 7,500 IOPS
240GB: up to 75,000 / 7,500 IOPS
300GB: up to 75,000 / 9,000 IOPS
480GB: up to 75,000 / 11,000 IOPS
600GB: up to 75,000 / 11,000 IOPS
800GB: up to 75,000 / 11,500 IOPS
Random I/O Operations per Second
3
Interface
Form Factor, Height and Weight
Life Expectancy
Lifetime Endurance
3
Usage
4
Power Consumption
Operating Temperature
RoHS Compliance
Product Health Monitoring
Product Ordering Information
1.
2.
3.
4.
Device measured using IOMeter* with 4K Random Writes QD=32 across 100% span of the drive. Latency measured using write transfer size of 4KB and queue depth set to 1.
Based on the Intel® SSD DC S3500 Series Product Specification
Based on JESD218 standard with JESD219 workload
Based on JESDEC SSD standard JC64.8
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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions
marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this information.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other
information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any
difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems
or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, go to:
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized
errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which
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*Other names and brands may be claimed as the property of others.
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微控制器 MCU
