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SST25VF080B-80-4I-S2AE-T

flash 2.7V to 3.6V 8mbit spi serial flash

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厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
包装说明
SOP, SOP8,.3
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
最大时钟频率 (fCLK)
80 MHz
数据保留时间-最小值
100
耐久性
100000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G8
JESD-609代码
e3
内存密度
8388608 bit
内存集成电路类型
FLASH
内存宽度
8
湿度敏感等级
3
端子数量
8
字数
1048576 words
字数代码
1000000
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1MX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.3
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
峰值回流温度(摄氏度)
260
电源
3/3.3 V
认证状态
Not Qualified
串行总线类型
SPI
最大待机电流
0.00002 A
最大压摆率
0.03 mA
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn) - annealed
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
类型
NOR TYPE
写保护
HARDWARE/SOFTWARE
文档预览
SST25VF080B
8 Mbit SPI Serial Flash
Features
• Single Voltage Read and Write Operations
- 2.7-3.6V
• Serial Interface Architecture
- SPI Compatible: Mode 0 and Mode 3
• High Speed Clock Frequency
- 50/66 MHz conditional (see
Table 5-6)
• Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
• Low Power Consumption:
- Active Read Current: 10 mA (typical)
- Standby Current: 5 µA (typical)
• Flexible Erase Capability
- Uniform 4 KByte sectors
- Uniform 32 KByte overlay blocks
- Uniform 64 KByte overlay blocks
• Fast Erase and Byte-Program:
- Chip-Erase Time: 35 ms (typical)
- Sector-/Block-Erase Time: 18 ms (typical)
- Byte-Program Time: 7 µs (typical)
• Auto Address Increment (AAI) Programming
- Decrease total chip programming time over
Byte-Program operations
• End-of-Write Detection
- Software polling the BUSY bit in Status Register
- Busy Status readout on SO pin in AAI Mode
• Hold Pin (HOLD#)
- Suspends a serial sequence to the memory
without deselecting the device
• Write Protection (WP#)
- Enables/Disables the Lock-Down function of the
status register
• Software Write Protection
- Write protection through Block-Protection bits in
status register
• Temperature Range
- Commercial: 0°C to +70°C
- Industrial: -40°C to +85°C
• Packages Available
- 8-lead SOIC (200 mils)
- 8-contact WSON (6mm x 5mm)
- 8-lead PDIP (300 mils)
• All devices are RoHS compliant
Product Description
25 series Serial Flash family features a four-wire, SPI-
compatible interface that allows for a low pin-count
package which occupies less board space and ulti-
mately lowers total system costs. The SST25VF080B
devices are enhanced with improved operating fre-
quency and lower power consumption. SST25VF080B
SPI serial flash memories are manufactured with pro-
prietary, high-performance CMOS SuperFlash technol-
ogy. The split-gate cell design and thick-oxide tunneling
injector attain better reliability and manufacturability
compared with alternate approaches.
The SST25VF080B devices significantly improve per-
formance and reliability, while lowering power con-
sumption. The devices write (Program or Erase) with a
single power supply of 2.7-3.6V for SST25VF080B.
The total energy consumed is a function of the applied
voltage, current, and time of application. Since for any
given voltage range, the SuperFlash technology uses
less current to program and has a shorter erase time,
the total energy consumed during any Erase or Pro-
gram operation is less than alternative flash memory
technologies.
The SST25VF080B device is offered in 8-lead SOIC
(200 mils), 8-contact WSON (6mm x 5mm), and 8-lead
PDIP (300 mils) packages. See
Figure 2-1
for pin
assignments.
2015 Microchip Technology Inc.
DS20005045C-page 1
SST25VF080B
1.0
BLOCK DIAGRAM
FUNCTIONAL BLOCK DIAGRAM
FIGURE 1-1:
Address
Buffers
and
Latches
X - Decoder
SuperFlash
Memory
Y - Decoder
Control Logic
I/O Buffers
and
Data Latches
Serial Interface
1296 B1.0
CE#
SCK
SI
SO
WP#
HOLD#
DS20005045C-page 2
2015 Microchip Technology Inc.
SST25VF080B
2.0
PIN DESCRIPTION
PIN ASSIGNMENTS
1
2
8
7
FIGURE 2-1:
CE#
SO
WP#
VSS
VDD
HOLD#
SCK
SI
CE#
SO
WP#
VSS
1
8
VDD
HOLD#
SCK
SI
2
7
Top View
3
4
6
5
1296 08-soic S2A P1.0
3
Top View
6
4
5
1296 08-wson QA P2.0
8-lead SOIC
CE#
VDD
8-contact WSON
SO
Top View
HOLD#
WP#
SCK
VSS
SI
1296 08-pdip-PA-P3.0
8-lead PDIP
TABLE 2-1:
Symbol
SCK
PIN DESCRIPTION
Pin Name
Serial Clock
Functions
To provide the timing of the serial interface.
Commands, addresses, or input data are latched on the rising edge of the clock
input, while output data is shifted out on the falling edge of the clock input.
To transfer commands, addresses, or data serially into the device.
Inputs are latched on the rising edge of the serial clock.
To transfer data serially out of the device.
Data is shifted out on the falling edge of the serial clock.
Outputs Flash busy status during AAI Programming when reconfigured as RY/BY#
pin. See
“Hardware End-of-Write Detection” on page 10
for details.
The device is enabled by a high to low transition on CE#. CE# must remain low for
the duration of any command sequence.
The Write Protect (WP#) pin is used to enable/disable BPL bit in the status register.
To temporarily stop serial communication with SPI flash memory without resetting
the device.
To provide power supply voltage: 2.7-3.6V for SST25VF080B
SI
SO
Serial Data Input
Serial Data Output
CE#
WP#
HOLD#
V
DD
V
SS
Chip Enable
Write Protect
Hold
Power Supply
Ground
2015 Microchip Technology Inc.
DS20005045C-page 3
SST25VF080B
3.0
MEMORY ORGANIZATION
used to select the device, and data is accessed through
the Serial Data Input (SI), Serial Data Output (SO), and
Serial Clock (SCK).
The SST25VF080B supports both Mode 0 (0,0) and
Mode 3 (1,1) of SPI bus operations. The difference
between the two modes, as shown in
Figure 4-1,
is the
state of the SCK signal when the bus master is in
Stand-by mode and no data is being transferred. The
SCK signal is low for Mode 0 and SCK signal is high for
Mode 3. For both modes, the Serial Data In (SI) is sam-
pled at the rising edge of the SCK clock signal and the
Serial Data Output (SO) is driven after the falling edge
of the SCK clock signal.
The SST25VF080B SuperFlash memory array is orga-
nized in uniform 4 KByte erasable sectors with 32
KByte overlay blocks and 64 KByte overlay erasable
blocks.
4.0
DEVICE OPERATION
The SST25VF080B is accessed through the SPI (Serial
Peripheral Interface) bus compatible protocol. The SPI
bus consist of four control lines; Chip Enable (CE#) is
FIGURE 4-1:
SPI PROTOCOL
CE#
MODE 3
MODE 3
MODE 0
SCK
SI
SO
MODE 0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
MSB
DON'T CARE
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
MSB
1296 SPIprot.0
HIGH IMPEDANCE
4.1
Hold Operation
The HOLD# pin is used to pause a serial sequence
underway with the SPI flash memory without resetting
the clocking sequence. To activate the HOLD# mode,
CE# must be in active low state. The HOLD# mode
begins when the SCK active low state coincides with
the falling edge of the HOLD# signal. The HOLD mode
ends when the HOLD# signal’s rising edge coincides
with the SCK active low state.
If the falling edge of the HOLD# signal does not coin-
cide with the SCK active low state, then the device
enters Hold mode when the SCK next reaches the
active low state. Similarly, if the rising edge of the
HOLD# signal does not coincide with the SCK active
low state, then the device exits in Hold mode when the
SCK next reaches the active low state. See
Figure 4-2
for Hold Condition waveform.
Once the device enters Hold mode, SO will be in high-
impedance state while SI and SCK can be V
IL
or V
IH.
If CE# is driven active high during a Hold condition, it
resets the internal logic of the device. As long as
HOLD# signal is low, the memory remains in the Hold
condition. To resume communication with the device,
HOLD# must be driven active high, and CE# must be
driven active low. See
Figure 5-3
for Hold timing.
FIGURE 4-2:
SCK
HOLD CONDITION WAVEFORM
HOLD#
Active
Hold
Active
Hold
Active
1296 HoldCond.0
DS20005045C-page 4
2015 Microchip Technology Inc.
SST25VF080B
4.2
Write Protection
4.2.1
WRITE PROTECT PIN (WP#)
SST25VF080B provides software Write protection. The
Write Protect pin (WP#) enables or disables the lock-
down function of the status register. The Block-Protec-
tion bits (BP3, BP2, BP1, BP0, and BPL) in the status
register provide Write protection to the memory array
and the status register. See
Table 4-3
for the Block-Pro-
tection description.
The Write Protect (WP#) pin enables the lock-down
function of the BPL bit (bit 7) in the status register.
When WP# is driven low, the execution of the Write-
Status-Register (WRSR) instruction is determined by
the value of the BPL bit (see
Table 4-1).
When WP# is
high, the lock-down function of the BPL bit is disabled.
TABLE 4-1:
WP#
L
L
H
CONDITIONS TO EXECUTE WRITE-STATUS-REGISTER (WRSR) INSTRUCTION
BPL
1
0
X
Execute WRSR Instruction
Not Allowed
Allowed
Allowed
4.3
Status Register
The software status register provides status on
whether the flash memory array is available for any
Read or Write operation, whether the device is Write
enabled, and the state of the Memory Write protection.
During an internal Erase or Program operation, the sta-
tus register may be read only to determine the comple-
tion of an operation in progress.
Table 4-2
describes
the function of each bit in the software status register.
TABLE 4-2:
Bit
0
1
2
3
4
5
6
Name
BUSY
WEL
BP0
BP1
BP2
BP3
AAI
SOFTWARE STATUS REGISTER
Function
1 = Internal Write operation is in progress
0 = No internal Write operation is in progress
1 = Device is memory Write enabled
0 = Device is not memory Write enabled
Indicate current level of block write protection (See
Table 4-3)
Indicate current level of block write protection (See
Table 4-3)
Indicate current level of block write protection (See
Table 4-3)
Indicate current level of block write protection (See
Table 4-3)
Auto Address Increment Programming status
1 = AAI programming mode
0 = Byte-Program mode
1 = BP3, BP2, BP1, BP0 are read-only bits
0 = BP3, BP2, BP1, BP0 are read/writable
Default at
Power-up
0
0
1
1
1
0
0
Read/Write
R
R
R/W
R/W
R/W
R/W
R
7
BPL
0
R/W
4.3.1
BUSY
The Busy bit determines whether there is an internal
Erase or Program operation in progress. A “1” for the
Busy bit indicates the device is busy with an operation
in progress. A “0” indicates the device is ready for the
next valid operation.
any memory Write (Program/Erase) commands. The
Write-Enable-Latch bit is automatically reset under the
following conditions:
Power-up
Write-Disable (WRDI) instruction completion
Byte-Program instruction completion
Auto Address Increment (AAI) programming is
completed or reached its highest unprotected
memory address
Sector-Erase instruction completion
Block-Erase instruction completion
Chip-Erase instruction completion
Write-Status-Register instructions
4.3.2
WRITE ENABLE LATCH (WEL)
The Write-Enable-Latch bit indicates the status of the
internal memory Write Enable Latch. If the Write-
Enable-Latch bit is set to “1”, it indicates the device is
Write enabled. If the bit is set to “0” (reset), it indicates
the device is not Write enabled and does not accept
2015 Microchip Technology Inc.
DS20005045C-page 5
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参数对比
与SST25VF080B-80-4I-S2AE-T相近的元器件有:SST25VF080B-80-4C-QAE-T、SST25VF080B-80-4I-QAE-T、SST25VF080B-80-4C-S2AE-T、SST25VF080B-50-4C-S2AF。描述及对比如下:
型号 SST25VF080B-80-4I-S2AE-T SST25VF080B-80-4C-QAE-T SST25VF080B-80-4I-QAE-T SST25VF080B-80-4C-S2AE-T SST25VF080B-50-4C-S2AF
描述 flash 2.7V to 3.6V 8mbit spi serial flash flash 2.7V to 3.6V 8mbit spi serial flash flash 2.7V to 3.6V 8mbit spi serial flash flash 2.7V to 3.6V 8mbit spi serial flash 存储器构架(格式):FLASH 存储器接口类型:SPI 存储器容量:8Mb (1M x 8) 存储器类型:Non-Volatile 8Mbit
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A EAR99
最大时钟频率 (fCLK) 80 MHz 80 MHz 80 MHz 80 MHz 50 MHz
数据保留时间-最小值 100 100 100 100 100
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 R-PDSO-N8 R-PDSO-N8 R-PDSO-G8 S-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e4
内存密度 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8 8
端子数量 8 8 8 8 8
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000
最高工作温度 85 °C 70 °C 85 °C 70 °C 70 °C
组织 1MX8 1MX8 1MX8 1MX8 1MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SON SON SOP SOP
封装等效代码 SOP8,.3 SOLCC8,.25 SOLCC8,.25 SOP8,.3 SOP8,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
串行总线类型 SPI SPI SPI SPI SPI
最大待机电流 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A
最大压摆率 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING NO LEAD NO LEAD GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) -
包装说明 SOP, SOP8,.3 - - SOP, SOP8,.3 SOP, SOP8,.3
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