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SST29EE512-70-4I-WH

EEPROM, 64KX8, 70ns, Parallel, CMOS, PDSO32, 8 X 14 MM, TSOP1-32

器件类别:存储    存储   

厂商名称:Silicon Laboratories Inc

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Silicon Laboratories Inc
零件包装代码
TSOP1
包装说明
TSOP1,
针数
32
Reach Compliance Code
unknown
ECCN代码
3A991.B.1.B.2
最长访问时间
70 ns
JESD-30 代码
R-PDSO-G32
长度
12.4 mm
内存密度
524288 bit
内存集成电路类型
EEPROM
内存宽度
8
功能数量
1
端子数量
32
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
64KX8
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP1
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
编程电压
5 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
10
宽度
8 mm
最长写入周期时间 (tWC)
10 ms
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512 Kbit (64K x8) Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
SST29EE / LE / VE512512Kb Page-Write flash memories
Data Sheet
FEATURES:
• Single Voltage Read and Write Operations
– 4.5-5.5V for SST29EE512
– 3.0-3.6V for SST29LE512
– 2.7-3.6V for SST29VE512
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption
– Active Current: 20 mA (typical) for 5V and 10 mA
(typical) for 3.0/2.7V
– Standby Current: 10 µA (typical)
• Fast Page-Write Operation
– 128 Bytes per Page, 512 Pages
– Page-Write Cycle: 5 ms (typical)
– Complete Memory Rewrite: 2.5 sec (typical)
– Effective Byte-Write Cycle Time: 39 µs (typical)
• Fast Read Access Time
– 4.5-5.5V operation: 70 and 90 ns
– 3.0-3.6V operation: 150 and 200 ns
– 2.7-3.6V operation: 200 and 250 ns
• Latched Address and Data
• Automatic Write Timing
– Internal V
PP
Generation
• End of Write Detection
– Toggle Bit
– Data# Polling
• Hardware and Software Data Protection
• Product Identification can be accessed via
Software Operation
• TTL I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm, 8mm x 20mm)
– 32-pin PDIP
PRODUCT DESCRIPTION
The SST29EE/LE/VE512 are 64K x8 CMOS, Page-Write
EEPROMs manufactured with SST’s proprietary, high
performance CMOS SuperFlash technology. The split-
gate cell design and thick oxide tunneling injector attain
better reliability and manufacturability compared with
alternate approaches. The SST29EE/LE/VE512 write
with a single power supply. Internal Erase/Program is
transparent to the user. The SST29EE/LE/VE512 con-
form to JEDEC standard pinouts for byte-wide memories.
Featuring high performance Page-Write, the SST29EE/
LE/VE512 provide a typical Byte-Write time of 39 µsec.
The entire memory, i.e., 64 Kbyte, can be written page-
by-page in as little as 2.5 seconds, when using interface
features such as Toggle Bit or Data# Polling to indicate
the completion of a Write cycle. To protect against inad-
vertent write, the SST29EE/LE/VE512 have on-chip
hardware and Software Data Protection schemes.
Designed, manufactured, and tested for a wide spectrum
of applications, the SST29EE/LE/VE512 are offered with
a guaranteed Page-Write endurance of 10,000 cycles.
Data retention is rated at greater than 100 years.
The SST29EE/LE/VE512 are suited for applications that
require convenient and economical updating of program,
configuration, or data memory. For all system applica-
tions, the SST29EE/LE/VE512 significantly improve per-
formance and reliability, while lowering power
consumption. The SST29EE/LE/VE512 improve flexibil-
ity while lowering the cost for program, data, and configu-
ration storage applications.
To meet high density, surface mount requirements, the
SST29EE/LE/VE512 are offered in 32-lead PLCC and 32-
lead TSOP packages. A 600-mil, 32-pin PDIP package is
also available. See Figures 1, 2, and 3 for pinouts.
Device Operation
The SST Page-Write EEPROM offers in-circuit electrical
write capability. The SST29EE/LE/VE512 do not require
separate Erase and Program operations. The internally
timed Write cycle executes both erase and program trans-
parently to the user. The SST29EE/LE/VE512 have indus-
try standard optional Software Data Protection, which SST
recommends always to be enabled. The SST29EE/LE/
VE512 are compatible with industry standard EEPROM
pinouts and functionality.
©2002 Silicon Storage Technology, Inc.
S71060-06-000 2/02
301
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
Small-Sector Flash and SSF are trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
512 Kbit Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
Data Sheet
Read
The Read operations of the SST29EE/LE/VE512 are con-
trolled by CE# and OE#, both have to be low for the system
to obtain data from the outputs. CE# is used for device
selection. When CE# is high, the chip is deselected and
only standby power is consumed. OE# is the output control
and is used to gate data from the output pins. The data bus
is in high impedance state when either CE# or OE# is high.
Refer to the Read cycle timing diagram for further details
(Figure 4).
consists of a specific three-byte load sequence that allows
writing to the selected page and will leave the SST29EE/
LE/VE512 protected at the end of the Page-Write. The
page-load cycle consists of loading 1 to 128 Bytes of data
into the page buffer. The internal Write cycle consists of the
T
BLCO
time-out and the write timer operation. During the
Write operation, the only valid reads are Data# Polling and
Toggle Bit.
The Page-Write operation allows the loading of up to 128
Bytes of data into the page buffer of the SST29EE/LE/
VE512 before the initiation of the internal Write cycle. Dur-
ing the internal Write cycle, all the data in the page buffer is
written simultaneously into the memory array. Hence, the
Page-Write feature of SST29EE/LE/VE512 allows the
entire memory to be written in as little as 2.5 seconds. Dur-
ing the internal Write cycle, the host is free to perform addi-
tional tasks, such as to fetch data from other locations in
the system to set up the write to the next page. In each
Page-Write operation, all the bytes that are loaded into the
page buffer must have the same page address, i.e. A
7
through A
16
. Any byte not loaded with user data will be writ-
ten to FFH.
See Figures 5 and 6 for the Page-Write cycle timing dia-
grams. If after the completion of the three-byte SDP load
sequence or the initial byte-load cycle, the host loads a sec-
ond byte into the page buffer within a byte-load cycle time
(T
BLC
) of 100 µs, the SST29EE/LE/VE512 will stay in the
page-load cycle. Additional bytes are then loaded consecu-
tively. The page-load cycle will be terminated if no addi-
tional byte is loaded into the page buffer within 200 µs
(T
BLCO
) from the last byte-load cycle, i.e., no subsequent
WE# or CE# high-to-low transition after the last rising edge
of WE# or CE#. Data in the page buffer can be changed by
a subsequent byte-load cycle. The page-load period can
continue indefinitely, as long as the host continues to load
the device within the byte-load cycle time of 100 µs. The
page to be loaded is determined by the page address of
the last byte loaded.
Write
The Page-Write to the SST29EE/LE/VE512 should always
use the JEDEC Standard Software Data Protection (SDP)
three-byte command sequence. The SST29EE/LE/VE512
contain the optional JEDEC approved Software Data Pro-
tection scheme. SST recommends that SDP always be
enabled, thus, the description of the Write operations will
be given using the SDP enabled format.
The three-byte
SDP Enable and SDP Write commands are identical;
therefore, any time a SDP Write command is issued,
Software Data Protection is automatically assured.
The
first time the three-byte SDP command is given, the device
becomes SDP enabled. Subsequent issuance of the same
command bypasses the data protection for the page being
written. At the end of the desired Page-Write, the entire
device remains protected. For additional descriptions,
please see the application notes
The Proper Use of
JEDEC Standard Software Data Protection
and
Protecting
Against Unintentional Writes When Using Single Power
Supply Flash Memories.
The Write operation consists of three steps. Step 1 is the
three-byte load sequence for Software Data Protection.
Step 2 is the byte-load cycle to a page buffer of the
SST29EE/LE/VE512. Steps 1 and 2 use the same timing
for both operations. Step 3 is an internally controlled Write
cycle for writing the data loaded in the page buffer into the
memory array for nonvolatile storage. During both the SDP
three-byte load sequence and the byte-load cycle, the
addresses are latched by the falling edge of either CE# or
WE#, whichever occurs last. The data is latched by the ris-
ing edge of either CE# or WE#, whichever occurs first. The
internal Write cycle is initiated by the T
BLCO
timer after the
rising edge of WE# or CE#, whichever occurs first. The
Write cycle, once initiated, will continue to completion, typi-
cally within 5 ms. See Figures 5 and 6 for WE# and CE#
controlled Page-Write cycle timing diagrams and Figures
15 and 17 for flowcharts.
The Write operation has three functional cycles: the Soft-
ware Data Protection load sequence, the page-load cycle,
and the internal Write cycle. The Software Data Protection
©2002 Silicon Storage Technology, Inc.
Software Chip-Erase
The SST29EE/LE/VE512 provide a Chip-Erase operation,
which allows the user to simultaneously clear the entire
memory array to the “1” state. This is useful when the entire
device must be quickly erased.
The Software Chip-Erase operation is initiated by using a
specific six-byte load sequence. After the load sequence,
the device enters into an internally timed cycle similar to the
Write cycle. During the Erase operation, the only valid read
is Toggle Bit. See Table 4 for the load sequence, Figure 10
for timing diagram, and Figure 19 for the flowchart.
S71060-06-000 2/02
301
2
512 Kbit Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
Data Sheet
Write Operation Status Detection
The SST29EE/LE/VE512 provide two software means to
detect the completion of a Write cycle, in order to optimize
the system Write cycle time. The software detection
includes two status bits: Data# Polling (DQ
7
) and Toggle Bit
(DQ
6
). The end of write detection mode is enabled after the
rising WE# or CE# whichever occurs first, which initiates
the internal Write cycle.
The actual completion of the nonvolatile write is asynchro-
nous with the system; therefore, either a Data# Polling or
Toggle Bit read may be simultaneous with the completion
of the Write cycle. If this occurs, the system may possibly
get an erroneous result, i.e., valid data may appear to con-
flict with either DQ
7
or DQ
6
. In order to prevent spurious
rejection, if an erroneous result occurs, the software routine
should include a loop to read the accessed location an
additional two (2) times. If both reads are valid, then the
device has completed the Write cycle, otherwise the rejec-
tion is valid.
Hardware Data Protection
Noise/Glitch Protection: A WE# or CE# pulse of less than 5
ns will not initiate a Write cycle.
V
DD
Power Up/Down Detection: The Write operation is
inhibited when V
DD
is less than 2.5V.
Write Inhibit Mode: Forcing OE# low, CE# high, or WE#
high will inhibit the Write operation. This prevents inadvert-
ent writes during power-up or power-down.
Software Data Protection (SDP)
The SST29EE/LE/VE512 provide the JEDEC approved
optional Software Data Protection scheme for all data alter-
ation operations, i.e., Write and Chip-Erase. With this
scheme, any Write operation requires the inclusion of a
series of three byte-load operations to precede the data
loading operation. The three-byte load sequence is used to
initiate the Write cycle, providing optimal protection from
inadvertent Write operations, e.g., during the system
power-up or power-down. The SST29EE/LE/VE512 are
shipped with the Software Data Protection disabled.
The software protection scheme can be enabled by
applying a three-byte sequence to the device, during a
page-load cycle (Figures 5 and 6). The device will then
be automatically set into the data protect mode. Any
subsequent Write operation will require the preceding
three-byte sequence. See Table 4 for the specific soft-
ware command codes and Figures 5 and 6 for the tim-
ing diagrams. To set the device into the unprotected
mode, a six-byte sequence is required. See Table 4 for
the specific codes and Figure 9 for the timing diagram. If
a Write is attempted while SDP is enabled the device
will be in a non-accessible state for ~ 300 µs. SST rec-
ommends Software Data Protection always be enabled.
See Figure 17 for flowcharts.
The SST29EE/LE/VE512 Software Data Protection is a
global command, protecting (or unprotecting) all pages in
the entire memory array once enabled (or disabled). There-
fore using SDP for a single Page-Write will enable SDP for
the entire array. Single pages by themselves cannot be
SDP enabled or disabled, although the page addressed
during the SDP write will be written.
Single power supply reprogrammable nonvolatile memo-
ries may be unintentionally altered. SST strongly recom-
mends that Software Data Protection (SDP) always be
enabled. The SST29EE/LE/VE512 should be programmed
using the SDP command sequence. SST recommends the
SDP Disable Command Sequence not be issued to the
device prior to writing.
Data# Polling (DQ
7
)
When the SST29EE/LE/VE512 are in the internal Write
cycle, any attempt to read DQ
7
of the last byte loaded dur-
ing the byte-load cycle will receive the complement of the
true data. Once the Write cycle is completed, DQ
7
will
show true data. Note that even though DQ
7
may have valid
data immediately following the completion of an internal
Write operation, the remaining data outputs may still be
invalid: valid data on the entire data bus will appear in sub-
sequent successive Read cycles after an interval of 1 µs.
See Figure 7 for Data# Polling timing diagram and Figure
16 for a flowchart.
Toggle Bit (DQ
6
)
During the internal Write cycle, any consecutive attempts to
read DQ
6
will produce alternating ‘0’s and ‘1’s, i.e., toggling
between 0 and 1. When the Write cycle is completed, the
toggling will stop. The device is then ready for the next
operation. See Figure 8 for Toggle Bit timing diagram and
Figure 16 for a flowchart. The initial read of the Toggle Bit
will typically be a “1”.
Data Protection
The SST29EE/LE/VE512 provide both hardware and soft-
ware features to protect nonvolatile data from inadvertent
writes.
©2002 Silicon Storage Technology, Inc.
S71060-06-000 2/02
301
3
512 Kbit Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
Data Sheet
Please refer to the following Application Notes for more
information on using SDP:
Protecting Against Unintentional Writes When
Using Single Power Supply Flash Memories
The Proper Use of JEDEC Standard Software
Data Protection
TABLE 1: P
RODUCT
I
DENTIFICATION
Address
Manufacturer’s ID
Device ID
SST29EE512
SST29LE512
SST29VE512
0001H
0001H
0001H
5DH
3DH
3DH
T1.2 301
Data
BFH
0000H
Product Identification
The Product Identification mode identifies the device as the
SST29EE/LE/VE512 and manufacturer as SST. This mode
is accessed via software. For details, see Table 4, Figure
11 for the software ID entry, and Read timing diagram and
Figure 18 for the ID entry command sequence flowchart.
Product Identification Mode Exit
In order to return to the standard Read mode, the Software
Product Identification mode must be exited. Exiting is
accomplished by issuing the Software ID Exit (reset) opera-
tion, which returns the device to the Read operation. The
Reset operation may also be used to reset the device to the
Read mode after an inadvertent transient condition that
apparently causes the device to behave abnormally, e.g.,
not read correctly. See Table 4 for software command
codes, Figure 12 for timing waveform, and Figure 18 for a
flowchart.
F
UNCTIONAL
B
LOCK
D
IAGRAM
X-Decoder
SuperFlash
Memory
A15 - A0
Address Buffer & Latches
Y-Decoder and Page Latches
CE#
OE#
WE#
Control Logic
I/O Buffers and Data Latches
DQ7 - DQ0
301 ILL B1.1
©2002 Silicon Storage Technology, Inc.
S71060-06-000 2/02
301
4
512 Kbit Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
Data Sheet
WE#
VDD
A12
A15
NC
NC
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
5
6
7
8
9
10
11
12
13
4
3
2
1
32 31 30
29
28
27
26
25
24
23
22
NC
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
32-lead PLCC
Top View
21
14 15 16 17 18 19 20
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
301 ILL F19.1
FIGURE 1: P
IN
A
SSIGNMENTS FOR
32-
LEAD
PLCC
A11
A9
A8
A13
A14
NC
WE#
VDD
NC
NC
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Standard Pinout
Top View
Die Up
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
301 ILL F01.2
FIGURE 2: P
IN
A
SSIGNMENTS FOR
32-
LEAD
TSOP
NC
NC
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
32-pin
6
PDIP
7
8
Top View
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
301 ILL F02.2
FIGURE 3: P
IN
A
SSIGNMENTS FOR
32-
PIN
PDIP
©2002 Silicon Storage Technology, Inc.
S71060-06-000 2/02
301
5
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参数对比
与SST29EE512-70-4I-WH相近的元器件有:SST29VE512-200-4I-WH、SST29EE512-70-4C-WH。描述及对比如下:
型号 SST29EE512-70-4I-WH SST29VE512-200-4I-WH SST29EE512-70-4C-WH
描述 EEPROM, 64KX8, 70ns, Parallel, CMOS, PDSO32, 8 X 14 MM, TSOP1-32 EEPROM, 64KX8, 200ns, Parallel, CMOS, PDSO32, 8 X 14 MM, TSOP1-32 EEPROM, 64KX8, 70ns, Parallel, CMOS, PDSO32, 8 X 14 MM, TSOP1-32
是否Rohs认证 不符合 不符合 不符合
厂商名称 Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc
零件包装代码 TSOP1 TSOP1 TSOP1
包装说明 TSOP1, TSOP1, TSOP1,
针数 32 32 32
Reach Compliance Code unknown unknown unknown
ECCN代码 3A991.B.1.B.2 EAR99 3A991.B.1.B.2
最长访问时间 70 ns 200 ns 70 ns
JESD-30 代码 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
长度 12.4 mm 12.4 mm 12.4 mm
内存密度 524288 bit 524288 bit 524288 bit
内存集成电路类型 EEPROM EEPROM EEPROM
内存宽度 8 8 8
功能数量 1 1 1
端子数量 32 32 32
字数 65536 words 65536 words 65536 words
字数代码 64000 64000 64000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 70 °C
最低工作温度 -40 °C -40 °C -
组织 64KX8 64KX8 64KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 TSOP1 TSOP1
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 NOT SPECIFIED 240
编程电压 5 V 3 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 5.5 V 3.6 V 5.5 V
最小供电电压 (Vsup) 4.5 V 2.7 V 4.5 V
标称供电电压 (Vsup) 5 V 3 V 5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 10 NOT SPECIFIED 10
宽度 8 mm 8 mm 8 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms
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