型号
- 型号
- 关键词
Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash
器件类别：存储
厂商名称：Microchip(微芯科技)
厂商官网：https://www.microchip.com
下载文档| 型号 | SST39VF800A-90-4I-B3KE-T | SST39VF400A-70-4I-M1QE-T | SST39VF400A-70-4C-C1QE | SST39VF800A-70-4I-M1QE | SST39VF400A-70-4I-M1QE |
|---|---|---|---|---|---|
| 描述 | Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash | Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash | Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash | Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash | NOR Flash 2.7V to 3.6V 4Mb Multi-Purpose Flash |
| 是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| 最长访问时间 | - | 70 ns | 70 ns | 70 ns | 70 ns |
| 命令用户界面 | - | YES | YES | YES | YES |
| 通用闪存接口 | - | YES | YES | YES | YES |
| 数据轮询 | - | YES | YES | YES | YES |
| JESD-30 代码 | - | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609代码 | - | e1 | e1 | e1 | e1 |
| 内存密度 | - | 4194304 bit | 4194304 bit | 8388608 bit | 4194304 bit |
| 内存集成电路类型 | - | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | - | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | - | 3 | - | 3 | 3 |
| 部门数/规模 | - | 128 | 128 | 256 | 128 |
| 端子数量 | - | 48 | 48 | 48 | 48 |
| 字数 | - | 262144 words | 262144 words | 524288 words | 262144 words |
| 字数代码 | - | 256000 | 256000 | 512000 | 256000 |
| 最高工作温度 | - | 85 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C |
| 组织 | - | 256KX16 | 256KX16 | 512KX16 | 256KX16 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | FBGA | VFLGA | VFBGA | VFBGA |
| 封装等效代码 | - | BGA48,6X11,20 | LGA48,6X11,20 | BGA48,6X11,20 | BGA48,6X11,20 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 部门规模 | - | 2K | 2K | 2K | 2K |
| 最大待机电流 | - | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | TIN SILVER COPPER | TIN SILVER COPPER | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | - | BALL | BUTT | BALL | BALL |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 |
| 切换位 | - | YES | YES | YES | YES |
| 类型 | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 零件包装代码 | - | - | DSBGA | DSBGA | DSBGA |
| 包装说明 | - | - | 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, XFLGA-48 | VFBGA, BGA48,6X11,20 | 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207C2B-4, WFBGA-48 |
| 针数 | - | - | 48 | 48 | 48 |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
| 长度 | - | - | 6 mm | 6 mm | 6 mm |
| 功能数量 | - | - | 1 | 1 | 1 |
| 工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 编程电压 | - | - | 2.7 V | 2.7 V | 2.7 V |
| 座面最大高度 | - | - | 0.52 mm | 0.73 mm | 0.73 mm |
| 最大供电电压 (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | - | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | - | 3 V | 3 V | 3 V |
| 宽度 | - | - | 4 mm | 4 mm | 4 mm |
