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ST083S08PFM2L

Silicon Controlled Rectifier, 135A I(T)RMS, 85000mA I(T), 800V V(DRM), 800V V(RRM), 1 Element, TO-208AD

器件类别:模拟混合信号IC    触发装置   

厂商名称:International Rectifier ( Infineon )

厂商官网:http://www.irf.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
包装说明
POST/STUD MOUNT, O-MUPM-D2
Reach Compliance Code
compliant
其他特性
HIGH SPEED
标称电路换相断开时间
12 µs
配置
SINGLE
最大直流栅极触发电流
200 mA
最大直流栅极触发电压
3 V
最大维持电流
600 mA
JEDEC-95代码
TO-208AD
JESD-30 代码
O-MUPM-D2
JESD-609代码
e0
最大漏电流
30 mA
通态非重复峰值电流
2500 A
元件数量
1
端子数量
2
最大通态电流
85000 A
最高工作温度
125 °C
最低工作温度
-40 °C
封装主体材料
METAL
封装形状
ROUND
封装形式
POST/STUD MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
最大均方根通态电流
135 A
重复峰值关态漏电流最大值
30000 µA
断态重复峰值电压
800 V
重复峰值反向电压
800 V
表面贴装
NO
端子面层
TIN LEAD
端子形式
SOLDER LUG
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
触发设备类型
SCR
Base Number Matches
1
文档预览
Bulletin I25185 rev. B 03/94
ST083S SERIES
INVERTER GRADE THYRISTORS
Stud Version
Features
All diffused design
Center amplifying gate
Guaranteed high dv/dt
Guaranteed high di/dt
High surge current capability
Low thermal impedance
High speed performance
85A
Typical Applications
Inverters
Choppers
Induction heating
All types of force-commutated converters
Major Ratings and Characteristics
Parameters
I
T(AV)
@ T
C
I
T(RMS)
I
TSM
@ 50Hz
@ 60Hz
I
2
t
@ 50Hz
@ 60Hz
V
DRM
/V
RRM
t
q
range (*)
T
J
q
ST083S
85
85
135
2450
2560
30
27
400 to 1200
10 to 30
- 40 to 125
Units
A
°C
A
A
A
KA
2
s
KA
2
s
V
µs
°C
case style
TO-209AC (TO-94)
(*) t = 10 to 20µs for 400 to 800V devices
q
t = 15 to 30µs for 1000 to 1200V devices
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1
ST083S Series
Bulletin I25185 rev. B 03/94
ELECTRICAL SPECIFICATIONS
Voltage Ratings
Voltage
Type number
Code
04
08
ST083S
10
12
V
DRM
/V
RRM
, maximum
repetitive peak voltage
V
400
800
1000
1200
V
RSM
, maximum
non-repetitive peak voltage
V
500
900
1100
1300
I
DRM
/I
RRM
max.
@ T
J
= T
J
max.
mA
30
Current Carrying Capability
Frequency
180
o
el
50Hz
400Hz
1000Hz
2500Hz
Recovery voltage Vr
Voltage before turn-on Vd
Rise of on-state current di/dt
Case temperature
Equivalent values for RC circuit
210
200
150
70
50
V
DRM
50
60
I
TM
180
o
el
120
120
80
25
50
50
85
330
350
320
220
50
V
DRM
-
60
I
TM
100µs
270
210
190
85
50
-
85
2540
1190
630
250
50
V
DRM
-
60
I
TM
Units
1930
810
400
100
50
-
85
V
A/µs
°C
A
22Ω / 0.15µF
22Ω / 0.15µF
22Ω / 0.15µF
On-state Conduction
Parameter
I
T(AV)
Max. average on-state current
@ Case temperature
I
T(RMS)
Max. RMS on-state current
I
TSM
Max. peak, one half cycle,
non-repetitive surge current
ST083S
85
85
135
2450
2560
2060
2160
Units
A
°C
Conditions
180° conduction, half sine wave
DC @ 77°C case temperature
t = 10ms
A
t = 8.3ms
t = 10ms
t = 8.3ms
t = 10ms
t = 8.3ms
KA
2
s
t = 10ms
t = 8.3ms
KA
2
√s
No voltage
reapplied
100% V
RRM
reapplied
No voltage
reapplied
100% V
RRM
reapplied
Sinusoidal half wave,
Initial T
J
= T
J
max
I
2
t
Maximum I
2
t for fusing
30
27
21
19
I
2
√t
Maximum I
2
√t
for fusing
300
t = 0.1 to 10ms, no voltage reapplied
2
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ST083S Series
Bulletin I25185 rev. B 03/94
On-state Conduction
Parameter
V
TM
Max. peak on-state voltage
ST083S
2.15
1.46
1.52
2.32
Units
Conditions
I
TM
= 300A, T
J
= T
J
max, t
p
= 10ms sine wave pulse
V
T(TO)1
Low level value of threshold
voltage
V
T(TO)2
High level value of threshold
voltage
r
t
1
V
(16.7% x
π
x I
T(AV)
< I <
π
x I
T(AV)
), T
J
= T
J
max.
(I >
π
x I
T(AV)
), T
J
= T
J
max.
(16.7% x
π
x I
T(AV)
< I <
π
x I
T(AV)
), T
J
= T
J
max.
(I >
π
x I
T(AV)
), T
J
= T
J
max.
Low level value of forward
slope resistance
mΩ
2.34
600
1000
mA
r
t
2
I
H
I
L
High level value of forward
slope resistance
Maximum holding current
Typical latching current
T
J
= 25°C, I
T
> 30A
T
J
= 25°C, V
A
= 12V, Ra = 6Ω, I
G
= 1A
Switching
Parameter
di/dt
Max. non-repetitive rate of rise
of turned-on current
t
d
ST083S
1000
0.80
Min
10
q
Units
A/µs
Conditions
T
J
= T
J
max, V
DRM
= rated V
DRM
I
TM
= 2 x di/dt
T
J
= 25°C, V
DM
= rated V
DRM
, I
TM
= 50A DC, t
p
= 1µs
Resistive load, Gate pulse: 10V, 5Ω source
T
J
= T
J
max, I
TM
= 100A, commutating di/dt = 10A/µs
V
R
= 50V, t
p
= 200µs, dv/dt: see table in device code
Typical delay time
t
q
q
Max. turn-off time (*)
Max
30
µs
(*) t = 10 to 20µs for 400 to 800V devices; t = 15 to 30µs for 1000 to 1200V devices.
Blocking
Parameter
dv/dt
I
RRM
I
DRM
Maximum critical rate of rise of
off-state voltage
Max. peak reverse and off-state
leakage current
ST083S
500
30
Units
V/µs
mA
Conditions
T
J
= T
J
max., linear to 80% V
DRM
, higher value
available on request
T
J
= T
J
max, rated V
DRM
/V
RRM
applied
Triggering
Parameter
P
GM
Maximum peak gate power
ST083S
40
5
5
20
Units
W
A
Conditions
T
J
= T
J
max, f = 50Hz, d% = 50
T
J
= T
J
max, t
p
5ms
P
G(AV)
Maximum average gate power
I
GM
+V
GM
-V
GM
I
GT
V
GT
I
GD
V
GD
Max. peak positive gate current
Maximum peak positive
gate voltage
Maximum peak negative
gate voltage
Max. DC gate current required
to trigger
Max. DC gate voltage required
to trigger
Max. DC gate current not to trigger
Max. DC gate voltage not to trigger
V
5
200
3
20
0.25
mA
T
J
= T
J
max, t
p
5ms
T
J
= 25°C, V
A
= 12V, Ra = 6Ω
V
mA
V
T
J
= T
J
max, rated V
DRM
applied
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3
ST083S Series
Bulletin I25185 rev. B 03/94
Thermal and Mechanical Specifications
Parameter
T
J
T
stg
R
thJC
R
thCS
T
Max. junction operating temperature range
Max. storage temperature range
Max. thermal resistance, junction to case
Max. thermal resistance, case to heatsink
Mounting torque, ± 10%
ST083S
-40 to 125
-40 to 150
0.195
0.08
15.5
(137)
14
(120)
Units
°C
Conditions
DC operation
K/W
Nm
(Ibf-in)
Nm
(Ibf-in)
g
See Outline Table
Non lubricated threads
Lubricated threads
Mounting surface, smooth, flat and greased
wt
Approximate weight
Case style
130
TO-209AC (TO-94)
∆R
thJC
Conduction
(The following table shows the increment of thermal resistence R
thJC
when devices operate at different conduction angles than DC)
Conduction angle
180°
120°
90°
60°
30°
Sinusoidal conduction Rectangular conduction Units
0.034
0.041
0.052
0.076
0.126
0.025
0.042
0.056
0.079
0.127
K/W
Conditions
T
J
= T
J
max.
Ordering Information Table
Device Code
ST
1
08
2
3
3
S
4
12
5
P
6
F
7
K
8
0
9
10
1
2
3
4
5
6
7
8
9
- Thyristor
- Essential part number
- 3 = Fast turn off
- S = Compression bonding Stud
- Voltage code: Code x 100 = V
RRM
(See Voltage Ratings Table)
- P = Stud Base 1/2" 20UNF
- Reapplied dv/dt code (for t
q
Test Condition)
- t
q
code
- 0 = Eyelet terminals (Gate and Aux. Cathode Leads)
1 = Fast-on terminals (Gate and Aux. Cathode Leads)
2 = Flag terminals (For Cathode and Gate Terminals)
dv/dt - t
q
combinations available
dv/dt (V/µs)
10
q
12
up to 800V
15
18
20
t (µs)
15
18
only for
20
1000/1200V
25
30
*
Standard part number.
All other types available
t
q
(µs)
20
CN
CM
CL
CP
CK
CL
CP
CK
CJ
--
50
DN
DM
DL
DP
DK
--
DP
DK
DJ
DH
100
EN
EM
EL
EP
EK
--
EP
EK
EJ
EH
200
FN *
FM *
FL
FP *
FK *
--
FP *
FK *
FJ
FH
400
HN
HM
HL
HP
HK
--
--
HK
HJ
HH
10
- Critical dv/dt:
None = 500V/µsec (Standard value)
L
= 1000V/µsec (Special selection)
only on request.
4
www.irf.com
ST083S Series
Bulletin I25185 rev. B 03/94
Outline Table
CERAMIC HOUSING
16.5 (0.65) MAX.
2.6 (0.10) MAX.
4.3 (0.17) DIA
FLEXIBLE LEAD
C.S. 16mm 2
RED SILICON RUBBER
157 (6.18)
170 (6.69 )
RED CATHODE
WHITE GATE
C.S. 0.4 mm 2
(.0006 s.i.)
(.025 s.i.)
20
(
0.7
9)
MI
N.
9. 5
(0.
37
)M
IN .
8.5 (0.33) DIA.
Fast-on Terminals
AMP. 280000-1
REF-250
10 (0.39)
70 (2.75) MIN.
215 (8.46)
RED SHRINK
29 (1 .14) MAX.
WHITE SHRINK
22.5 (0.88) MAX. DIA.
12. 5 (0.49) MAX.
21 (0.83)
MAX.
SW 27
1/2"-20UNF-2A
29.5 (1.16)
MAX.
Case Style TO-209AC (TO-94)
All dimensions in millimeters (inches)
CERAMIC HOUSING
FLAG TERMINALS
22.5 DIA.
(0.89) MAX.
1.5 (0.06) DIA.
10
(0.39 )
5.2 (0.20) DIA.
46 (1.81)
49 (1.93)
7.5
(0.30)
1 2.5 (0.49)
21(0.83 )
M AX.
Case Style TO-208AD (TO-83)
All dimensions in millimeters (inches)
MAX.
1/2"-20UNF-2A
SW 27
29 (1. 14) MA X.
2.4 (0.09)
29.5 (1.16)
(0.6 5)
16.5
10
(0.39)
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5
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