7F-7, No. 3, Wu Chuan 1
st
Road, New Taipei Industrial Park,
New Taipei City, Taiwan, R.O.C.
Tel.：886-2-22991331
Fax：886-2-22982466
1. INTRODUCTION
HITANO Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid
circuits and automatic surface mounting on any printed circuit boards.
ST series use a special material between nickel-barrier and ceramic body. It provides excellent performance to withstand bending
stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by
electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the
dissolution of termination when extended immersion in molten solder at elevated solder temperature.
2. FEATURES
a.
b.
c.
d.
e.
f.
g.
High performance to withstanding 5mm of substrate bending
test guarantee.
A wide selection of sizes is available (0603 to 2225).
High capacitance in given case size.
Capacitor with lead-free termination (pure Tin).
Reduction in PCB bend failure.
High reliability and stability.
RoHS & HALOGEN compliant.
3. APPLICATIONS
a.
b.
c.
d.
e.
For general digital circuit.
For power supply bypass capacitors.
For consumer electronics.
For telecommunication.
DC to DC converter
4.HOW TO ORDER
ST
Series
0603
Size
Inch (mm)
0603
(1608)
0805
(2012)
1206
(3216)
1210
(3225)
1808
(4520)
1812
(4532)
1825
(4563)
2220
(5750)
2225
(5763)
100=10x10
0
=10pF
N
Dielectric
100
Capacitance
G
Tolerance
500
Rated voltage
C
T
Termination Packaging
T=7”
reeled
G=13”
reeled
N: C0G(NPO) Two significant digits
B=±0.1pF
followed by no. of
zeros. and R is in
C=±0.25pF
X: X7R
place of decimal
point.
D=±0.5pF
eg.:
R47=0.47pF
0R5=0.5pF
1R0=1.0pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z=-20/+80%
Two significant
L=Ag/Ni/Sn
digits followed by
no. of zeros. And R
C=Cu/Ni/Sn
is in place of
(Note 1)
decimal point.
500=
50 VDC
101=
100 VDC
201=
200 VDC
251=
250 VDC
501=
500 VDC
631=
630 VDC
102=
1000 VDC
202=
2000 VDC
302=
3000 VDC
Note 1: Please see below product range to find right ter mination code.
Page 1 of 17
7F-7, No. 3, Wu Chuan 1
st
Road, New Taipei Industrial Park,
New Taipei City, Taiwan, R.O.C.
Tel.：886-2-22991331
Fax：886-2-22982466
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
0603 (1608)
L (mm)
W (mm)
0.80±0.10
1.60±0.20
0.80±0.15
Thickness
mm
0.80±0.07
0.80
+0.15/-0.10
0.80±0.10
0805 (2012)
2.10±0.20
1.25±0.20
1.25±0.10
0.80±0.10
1206 (3216)
3.30±0.30
1.60±0.20
1.25±0.10
0.95±0.10
1.60±0.20
0.95±0.10
1.25±0.10
1210 (3225)
3.30±0.30
2.50±0.30
1.60±0.20
2.00±0.20
2.50±0.30
1.25±0.10
1808 (4520)
4.50±0.50
2.00±0.20
1.60±0.20
2.00±0.20
1.25±0.10
1812 (4532)
4.60±0.50
3.20±0.30
1.60±0.20
2.00±0.20
2.50±0.30
1825 (4563)
2220 (5750)
4.60±0.50
5.70±0.40
6.30±0.40
5.00±0.40
2.00±0.20
2.50±0.30
2.00±0.20
2.50±0.30
2225 (5763)
5.70±0.40
6.30±0.40
2.00±0.20
2.50±0.30
C
X
C
M
E
M
C
E
F
G
C
E
F
C
E
F
G
F
G
F
G
F
G
0.26
0.30
0.26
0.26
0.30
Fig. 1 The outline of MLCC
M
B
M
B
T
Symbol
S
M
B
min (mm)
0.20
B
X
0.30
L
0.30
W
0.30
6.GENERAL ELECTRICAL DATA
Dielectric
Size
Rated voltage (WVDC)
Capacitance range*
Capacitance tolerance
Tan
δ*
Insulation resistance at 500Vdc for 60 seconds
Operating temperature
Temperature coefficient
Termination
**
X7R:
Rated vol. D.F.
50V
Exception of D.F.
0603≥0.047μF; 0805≥0.18μF,
≤2.5% ≤3%
1206≥0.47μF
NP0
0603, 1206, 1210, 1812,
1808, 1825, 2220, 2225
50V, 100V, 200V, 250V, 500V,
630V, 1KV, 2KV, 3KV
1.5pF ~ 6800pF
X7R
0603, 1206, 1210, 1812,
1808, 1825, 2220, 2225
50V, 100V, 200V, 250V, 500V,
630V, 1KV, 2KV, 3KV
100pF ~ 10μF
Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)
J (±5%), K (±10%), M (±20%)
Cap≥10pF: F (±1%), G (±2%), J (±5%),K (±10%)
Cap<30pF: Q≥400+20C
50V
≤
2.5%**
Cap≥30pF: Q≥1000
100V ~ 3KV
≤
2.5%
≥100GΩ
or R·C≥1000 whichever is smaller
≥10GΩ
or R·C≥ 500Ω-F whichever is smaller
-55 to +125°C
±30ppm
/
℃
±15%
Ag (or Cu)/Ni/Sn (lead-free termination)
* Measured at 1.0±0.2Vrms, 1.0kHz±10% for C≤10μF; 0.5±0.2Vrms, 120Hz±20% for C>10µF, 30~70% related humidity, 25°C ambient temperature.
Page 2 of 17
7F-7, No. 3, Wu Chuan 1
st
Road, New Taipei Industrial Park,
New Taipei City, Taiwan, R.O.C.
Tel.：886-2-22991331
Fax：886-2-22982466
7. Typical Bending Cracks of MLCC
MLCC ceramic body is consisted of rigidity material. It will be suffered compressive and tensional stress when the carried
board is bended. If the suffered stress is over ceramic body strength, the bending crack is occurred.
Therefore, the bending crack
will be only occurred after soldering process.
8.The stress v.s. position on PCB during bending
Chip mounting close to board separation point
Magnitude of stress
1>2
≈
3>4>5
Page 3 of 17
7F-7, No. 3, Wu Chuan 1
st
Road, New Taipei Industrial Park,
New Taipei City, Taiwan, R.O.C.
Tel.：886-2-22991331
Fax：886-2-22982466
HITANO ST series is added a special termination material (Ultra-Buffer or Anti-Bend)between ceramic
body and Ni-barrier that can absorb mechanical stress to prevent bending crack occurred.
Page 4 of 17
7F-7, No. 3, Wu Chuan 1
st
Road, New Taipei Industrial Park,
New Taipei City, Taiwan, R.O.C.
Tel.：886-2-22991331
Fax：886-2-22982466
11.Comparison of Bending Test Result
Resistance to Substrate Bending
100%
90%
80%
0805, X7R, 22nF, 250V (MA sereis)
0805,X7R,22nF,250V (C series)
0805, X7R, 22nF, 250V (FP
series)
0805,X7R,22nF,250V (ST
series)
1206, X7R, 100nF, 100V (MA sereis)
1206,X7R,100nF,100V (C series)
1206, X7R, 100nF, 100V (FP
series)
1206,X7R,100nF,100V (ST
series)
Failure Ratio (%)
70%
60%
50%
40%
30%
20%
10%
0%
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
Bending (mm)
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
PCB TEST RESULT
Mean Bend
Mean Bend
C series(mm)
ST series.(mm)
≥
2
≥
5
≥
2
≥
5
≥
2
≥
5
≥
2
≥
5
≥
3
≥
5
≥
3
≥
5
≥
3
≥
5
≥
5
≥
7
≥
5
≥
7
Improvement
with Ultra-buffer
300%
300%
300%
300%
300%
140%
117%
114%
114%
Page 5 of 17
FPGA/CPLD
