128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
器件标准:
下载文档型号 | ST24LC21BM1 | ST24FW21M1 | ST24FW21B1 | ST24LC21BB1 | ST24LW21B1 | ST24LW21B6 | ST24LW21M1 | ST24LW21M6 | ST24FC21M1 | ST24FC21B1 |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | SOIC | SOIC | DIP | DIP | DIP | DIP | SOIC | SOIC | SOIC | DIP |
包装说明 | 0.150 INCH, PLASTIC, SO-8 | 0.150 INCH, PLASTIC, SO-8 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | 0.150 INCH, PLASTIC, SO-8 | 0.150 INCH, PLASTIC, SO-8 | 0.150 INCH, PLASTIC, SO-8 | DIP, DIP8,.3 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION | 40 YEAR DATA RETENTION |
最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | e4 | e4 | e0 | e0 | e0 | e0 | e4 | e4 | e4 | e0 |
长度 | 4.9 mm | 4.9 mm | 9.55 mm | 9.55 mm | 9.55 mm | 9.55 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.55 mm |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
字数代码 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
组织 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | DIP | DIP | SOP | SOP | SOP | DIP |
封装等效代码 | SOP8,.25 | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V | 3.6/5.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 5.9 mm | 5.9 mm | 5.9 mm | 5.9 mm | 1.75 mm | 1.75 mm | 1.75 mm | 5.9 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
最大压摆率 | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | YES | NO | NO | NO | NO | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
写保护 | - | HARDWARE | HARDWARE | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | - | - |