型号
- 型号
- 关键词
| 型号 | STK12C68-L35M | STK12C68-L45M | STK12C68-C35M | STK12C68-C45M | STK12C68-C55M | STK12C68-L55M |
|---|---|---|---|---|---|---|
| 描述 | 8KX8 NON-VOLATILE SRAM, 35ns, CQCC28, CERAMIC, LCC-28 | 8KX8 NON-VOLATILE SRAM, 45ns, CQCC28, CERAMIC, LCC-28 | 8KX8 NON-VOLATILE SRAM, 35ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 45ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 55ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 55ns, CQCC28, CERAMIC, LCC-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | QLCC | DIP | DIP | DIP | QLCC |
| 包装说明 | QCCN, LCC28(UNSPEC) | QCCN, LCC28(UNSPEC) | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | QCCN, LCC28(UNSPEC) |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 35 ns | 45 ns | 35 ns | 45 ns | 55 ns | 55 ns |
| 其他特性 | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/10000 CYCLES |
| JESD-30 代码 | R-CQCC-N28 | R-CQCC-N28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 13.97 mm | 35.56 mm | 35.56 mm | 35.56 mm | 13.97 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | DIP | DIP | DIP | QCCN |
| 封装等效代码 | LCC28(UNSPEC) | LCC28(UNSPEC) | DIP28,.3 | DIP28,.3 | DIP28,.3 | LCC28(UNSPEC) |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.29 mm | 2.29 mm | 4.14 mm | 4.14 mm | 4.14 mm | 2.29 mm |
| 最大待机电流 | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A |
| 最大压摆率 | 0.085 mA | 0.08 mA | 0.085 mA | 0.08 mA | 0.075 mA | 0.075 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - | - |
| 厂商名称 | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
测试/测量
嵌入式系统
嵌入式系统
淘e淘
EE_FPGA学习乐园
DIY/开源硬件专区